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You’ve Got the Power—Ensuring Interoperability for Power Over Ethernet Devices

You’ve Got the Power—Ensuring Interoperability for Power Over Ethernet Devices

Learn how the Ethernet Alliance Certified test plan and PoE certification can maximize your product success and help you avoid expensive recalls and post-launch redesigns.


Understanding the Limits of VNA Calibration

Understanding the Limits of VNA Calibration

In this article, we compare the scope of factory and user calibration for vector network analyzers (VNAs). We then learn about the types of errors that calibration techniques can't correct.


Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

We talked with Flux’s co-founders about their new partnership—announced today—with online electronic parts ecosystem firm Ultra Librarian.


News Mar 06, 2024 by Jeff Child
Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Ahead of the IEEE 1.6 TbE standard, Synopsys has developed a complete 1.6 T solution that includes multi-rate, multi-channel 1.6 T Ethernet MAC and PCS controllers, 224-G Ethernet PHY IP, and verification IP.


News Mar 05, 2024 by Jake Hertz
Laird Connectivity Sera NX040 modules for Ultra-Wide Band and Bluetooth® LE | New Product Brief

Laird Connectivity Sera NX040 modules for Ultra-Wide Band and Bluetooth® LE | New Product Brief

Laird Connectivity Sera NX040 modules seamlessly integrate Ultra-Wide Band (UWB) and Bluetooth® LE technologies, offering robust and low-power performance. Watch and learn all about their features, specs, applications, and more!


AMD Rolls Out Cost-Optimized FPGA Family

AMD Rolls Out Cost-Optimized FPGA Family

As FPGAs target more applications, AMD’s newest family—launched today—balances cost and power with performance.


News Mar 05, 2024 by Aaron Carman
Keysight Introduces First Integrated Toolset for Quantum System Design

Keysight Introduces First Integrated Toolset for Quantum System Design

The QuantumPro workflow combines five key tools—schematic design, layout creation, electromagnetic (EM) analysis, nonlinear circuit simulation, and quantum parameter extraction—into one unified toolchain.


News Mar 04, 2024 by Duane Benson
Infineon Leverages Coreless Transformer Design in Solid-State Isolators

Infineon Leverages Coreless Transformer Design in Solid-State Isolators

The new family uses coreless transformer technology to ramp up switching speeds while lowering power dissipation by up to 70%.


News Mar 04, 2024 by Jake Hertz
Vishay VSMA1085/VSMA1094 Infrared Emitting Diodes | Featured Product Spotlight

Vishay VSMA1085/VSMA1094 Infrared Emitting Diodes | Featured Product Spotlight

Vishay Semiconductors Opto group introduces the Astral series, high-power infrared emitters catering to consumer and automotive applications. Watch and learn all about their features, specs, applications, and more!


TRACO POWER TCI AC-DC Industrial Power Supplies | New Product Brief

TRACO POWER TCI AC-DC Industrial Power Supplies | New Product Brief

TRACO POWER TCI AC-DC Industrial Power Supplies offer high-performance solutions across various applications. Watch and learn all about their features, specs, applications, and more!


Building a Handheld Retro Gaming Console With Local Wireless Connectivity

Building a Handheld Retro Gaming Console With Local Wireless Connectivity

In this project article, we design a handheld gaming console with wireless multiplayer functionality using ESP8266 microcontrollers. We then program a game for it with the Arduino IDE.


From Passives to Wi-Fi 7, New T&M Equipment Validates Next-Gen Devices

From Passives to Wi-Fi 7, New T&M Equipment Validates Next-Gen Devices

Keysight, Saelig, and Rohde & Schwarz have dropped new test equipment to help engineers at the forefront of new passive and wireless technology alike.


News Mar 01, 2024 by Jake Hertz
MWC 2024: Three New 5G Devices Boost Networking Performance

MWC 2024: Three New 5G Devices Boost Networking Performance

From ready-made routers to AI-enhanced modems, the latest 5G hardware showcased at MWC 2024 continues to improve the state-of-the-art.


News Feb 29, 2024 by Aaron Carman
Microchip’s Portfolio of Integrated Motor Drivers Grows With New Family

Microchip’s Portfolio of Integrated Motor Drivers Grows With New Family

The new systems introduce high levels of integration to reduce complexity and BOM count for motor circuitry.


News Feb 29, 2024 by Jake Hertz
Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Unveiled today, Renesas' new embedded AI processors significantly increase performance for vision-sensing devices while consuming less power than competitive alternatives.


News Feb 29, 2024 by Duane Benson
ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.


News Feb 28, 2024 by Jake Hertz
Frequency Response of the MOSFET Common-Source Amplifier

Frequency Response of the MOSFET Common-Source Amplifier

In this article, we learn about the frequency response of the MOSFET common-source amplifier by examining its s-domain transfer function.


STMicro, ADI, and Rohm Release New Op Amps for Industrial Applications

STMicro, ADI, and Rohm Release New Op Amps for Industrial Applications

Three new op amps bring low offset, low drift, and wide gain bandwidth for industrial designers.


News Feb 27, 2024 by Aaron Carman
EPCOS / TDK ERUC23 SMT Flat Wire Coupled Inductors | New Product Brief

EPCOS / TDK ERUC23 SMT Flat Wire Coupled Inductors | New Product Brief

EPCOS / TDK ERUC23 SMT Flat Wire Coupled Inductors offer a high-performance solution characterized by low loss ferrite, high saturation currents, and low DC resistance. Watch and learn all about their features, specs, applications, and more!


ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.


News Feb 27, 2024 by Duane Benson