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Microchip Ethernet Switches | New Product Brief

Microchip Ethernet Switches | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Apr 17, 2022 by Mouser
TDK NTCSP Automotive Chip NTC Thermistor | New Product Brief

TDK NTCSP Automotive Chip NTC Thermistor | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Apr 17, 2022 by Mouser
Molex Sentrality High-Power Pin & Socket Connector | New Product Brief

Molex Sentrality High-Power Pin & Socket Connector | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Apr 17, 2022 by Mouser
MICROCHIP SAM E51 Touch Curiosity Evaluation Kit | New Product Brief

MICROCHIP SAM E51 Touch Curiosity Evaluation Kit | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Apr 17, 2022 by Mouser
CUI INC. VMS-C/VMS-C-CNF Open Frame Power Supplies | New Product Brief

CUI INC. VMS-C/VMS-C-CNF Open Frame Power Supplies | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Apr 17, 2022 by Mouser
Demystifying LoRa and LoRaWAN Wireless Network Protocols

Demystifying LoRa and LoRaWAN Wireless Network Protocols

In this article, get a basic understanding of wireless communication networks—LoRa and LoRaWAN.


“Magnetic Sandwich” Promises New Pathways in Lossless Electronics

“Magnetic Sandwich” Promises New Pathways in Lossless Electronics

Researchers have found a way to achieve a quantum anomalous Hall effect at elevated temperatures—potentially building new inroads to lossless electronics.


News Apr 16, 2022 by Abdulwaliy Oyekunle
Three New Power Devices Cut Down Component Count and BOM

Three New Power Devices Cut Down Component Count and BOM

By reducing component counts, power system designs can achieve critical advantages such as lower costs and easier manufacturing. Three recently announced power solutions offer vivid examples of trend.


News Apr 15, 2022 by Ikimi .O
Evolving TinyML—The First Neuromorphic Analog Signal Processor Beside a Sensor

Evolving TinyML—The First Neuromorphic Analog Signal Processor Beside a Sensor

Israeli Polyn’s neuromorphic IC has been successfully packaged and evaluated, taking TinyML, or tiny machine learning, technology another step to becoming more mainstream.


News Apr 15, 2022 by Jake Hertz
Reference Designs Take a Shot at Qi-compliant In-vehicle Wireless Charging

Reference Designs Take a Shot at Qi-compliant In-vehicle Wireless Charging

As the Qi standard increases in popularity for wireless charging, Microchip and Renesas announce their Qi-compliant automotive-grade wireless power transmitter reference designs.


News Apr 14, 2022 by Darshil Patel
On-demand Solar Energy—Researchers Store and Use Energy from the Sun

On-demand Solar Energy—Researchers Store and Use Energy from the Sun

One setback to fully utilizing solar energy is how to successfully store it. Aiming to tackle this issue, researchers have successfully converted stored electrical energy into usable electrical power.


News Apr 14, 2022 by Jake Hertz
The Evolution of the Mainframe Computer—to IBM’s Latest z16

The Evolution of the Mainframe Computer—to IBM’s Latest z16

With a history dating back to the 1940s, the mainframe computer has advanced significantly to today's mainframes, such as the IBM Z series.


News Apr 13, 2022 by Arjun Nijhawan
Harvard Kicks Photonics Up a Notch With First Integrated Laser on TFLN Chip

Harvard Kicks Photonics Up a Notch With First Integrated Laser on TFLN Chip

Hoping to keep pushing photonic technology further, researchers at Harvard University have successfully integrated laser onto thin-film lithium niobate (TFLN) chips.


News Apr 13, 2022 by Jake Hertz
RF Switch Ups Power Density and Integration for 5G Networks

RF Switch Ups Power Density and Integration for 5G Networks

The new RF switch device from Menlo Micro offers 25 W power handling and an integrated charge pump driver circuit.


News Apr 12, 2022 by Jeff Child
Ep. 43 | Mark Papermaster: The EE and Exec Behind Apple, IBM, Cisco, and AMD’s Success

Ep. 43 | Mark Papermaster: The EE and Exec Behind Apple, IBM, Cisco, and AMD’s Success

What hasn’t Mark Papermaster accomplished? He’s the engineer and exec who impacted Apple’s iPhones and iPods, the IBM Power PC, and has led AMD's remarkable rejuvenation from a company that “may have lost their way” to surpassing Intel’s market cap.


IBM Researcher Reveals Details on Quantum Entanglement Forging

IBM Researcher Reveals Details on Quantum Entanglement Forging

IBM Quantum has introduced entanglement forging, a technique to double the size of systems that can be simulated using quantum hardware. We spoke to one of the researchers who led the development of this method.


News Apr 11, 2022 by Ingrid Fadelli
The Pros and Cons of Moving EDA to the Cloud

The Pros and Cons of Moving EDA to the Cloud

Taking EDA to the cloud, Synopsys’ new software-as-a-service (SaaS) offerings for EDA and IC design raise the question: is cloud computing a good choice for chip design?


News Apr 11, 2022 by Jake Hertz
What is it About Audio Distortion? Understanding Nonlinearity

What is it About Audio Distortion? Understanding Nonlinearity

Learn about how system nonlinearity creates distortion in audio signals that impacts the sounds we hear. We will examine sine waves, harmonics, and intermodulation distortion.


From Collabs to Laser Modules—Efforts to Improve AR/VR Technology Keep on Rolling In

From Collabs to Laser Modules—Efforts to Improve AR/VR Technology Keep on Rolling In

Trying to keep the momentum building for AR/VR technology, Google targets a micro-LED company, Microsoft and Qualcomm teaming up, and ams OSRAM has a new laser module prototype.


News Apr 09, 2022 by Kristijan Nelkovski
DesignCon 2022: Automated Software Targets IEEE 802.3 Cabling

DesignCon 2022: Automated Software Targets IEEE 802.3 Cabling

To support advanced IEEE 802.3 networking standards and shrinking test times, Rohde & Schwarz debuted two new software suite options for doing automated testing cable assemblies up to IEEE 802.3ck.


News Apr 08, 2022 by Jeff Child