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Amphenol ICC USB 4 Type C Connectors | New Product Brief

Amphenol ICC USB 4 Type C Connectors | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Hirose Electric FX27 0.8mm Pitch Floating Card Edge Connectors | Featured Product Spotlight

Hirose Electric FX27 0.8mm Pitch Floating Card Edge Connectors | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


3D Printing May Ease Semiconductor Shortage Woes

3D Printing May Ease Semiconductor Shortage Woes

Additive manufacturing can't do much in the way of complex ICs, but it can replace legacy passives and improve existing fab machinery.


News Oct 20, 2021 by Hannah DeTavis
One Charger to Charge Them All: EU Proposes USB-C Becomes the Standard

One Charger to Charge Them All: EU Proposes USB-C Becomes the Standard

Hoping to curb e-waste and let consumers have one cord to charge their devices, the European Commission (EC) suggests USB-C should become standard. How could this affect e-waste, designs, and engineers?


News Oct 19, 2021 by Tyler Charboneau
New LiDAR Chips Go the Distance, Rain or Shine

New LiDAR Chips Go the Distance, Rain or Shine

Though LiDAR is one of the most popular technologies for ADAS, it still has its hangups. Now, developers are fine-tuning LiDAR at the chip level—for instance, by extending detection distance and priming it for inclement weather.


Ep. 35 | The Impact of Chip Shortages on the Electronics Industry

Ep. 35 | The Impact of Chip Shortages on the Electronics Industry

Everybody knows the global chip shortage has rocked the industry. But how often do you get three executives in a virtual room together to talk about it as a group? In this special Industry Tech Days episode of Moore's Lobby, you'll hear high-level views from the experts on how the electronic components distribution world is changing.


“Magic Bookmark” Brings eBook Features to Print in a Sustainable Package

“Magic Bookmark” Brings eBook Features to Print in a Sustainable Package

As the world becomes more digital, where does that leave printed books? A new electronic device from the University of Surrey hopes to bring the features of eBooks to paper.


News Oct 18, 2021 by Jake Hertz
Colab Aims to Create a Secured Quantum Internet Using Quantum Key Distribution

Colab Aims to Create a Secured Quantum Internet Using Quantum Key Distribution

Researchers and companies alike are investing time into quantum networks/internet. However, what is this technology, how is it secured with quantum key distribution, and what are TB Group and Toshiba creating?


News Oct 18, 2021 by Abdulwaliy Oyekunle
FET Roundup: eGaN FETs, Next-gen SiC FETs, and “RibbonFETs” Hit the Scene

FET Roundup: eGaN FETs, Next-gen SiC FETs, and “RibbonFETs” Hit the Scene

This month has been a busy one in the FET space. Here are a few FETs from EPC, UnitedSiC, and Intel that depart from traditional silicon transistors in interesting ways.


News Oct 16, 2021 by Ikimi .O
Intro to 5G NR

Intro to 5G NR

Learn the basics of 5G NR (New Radio), including its frequency bands, applications, and what technologies make it possible.


DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

Disrupting the Ga-polar GaN technology tradition with N-polar GaN devices, Transphorm is evaluating the cost vs. performance of sapphire substrates with a new DARPA contract.


News Oct 15, 2021 by Adrian Gibbons
Renesas’ New RA2E2 32-bit MCUs Promises More Scalable IoT Designs

Renesas’ New RA2E2 32-bit MCUs Promises More Scalable IoT Designs

Based on the ARM Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to the internet of things (IoT) endpoint applications.


News Oct 15, 2021 by Abdulwaliy Oyekunle
Harwin SMT Spring Contacts | New Product Brief

Harwin SMT Spring Contacts | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Nordic Semiconductor Power Profiler Kit II (PPK2) | New Product Brief

Nordic Semiconductor Power Profiler Kit II (PPK2) | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.


News Oct 14, 2021 by Jake Hertz
New Sensor Claims an “Industry First” for Detecting Harmful UV-A Radiation

New Sensor Claims an “Industry First” for Detecting Harmful UV-A Radiation

Built for wearable devices, the new UV-detection chip can help users monitor their exposure to the most harmful type of radiation: UV-A.


News Oct 14, 2021 by Kristijan Nelkovski
World’s First TinyML Vision Challenge Crowns 2021 Winners

World’s First TinyML Vision Challenge Crowns 2021 Winners

Competitions are always an exciting way to test the limits and ingenuity of both technology and the designer. This week the winners of the first inaugural TinyML Vision Challenge were announced.


News Oct 13, 2021 by Jake Hertz
Samsung Potentially Takes the Lead on Tesla’s Self-driving Chips

Samsung Potentially Takes the Lead on Tesla’s Self-driving Chips

How will Samsung's involvement affect Tesla's silicon-level trajectory in autonomous driving?


News Oct 13, 2021 by Tyler Charboneau
Understanding 5G New Radio in Non-standalone Operation Applications

Understanding 5G New Radio in Non-standalone Operation Applications

The 5G New Radio platform is continuing to evolve. A clear understanding of 5G goals, technical terms, and technology will allow designers to imagine new use-cases for the nascent network.


News Oct 12, 2021 by Adrian Gibbons
Cadence Releases First ECAD Platform Dedicated to 3D System Design

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.


News Oct 12, 2021 by Adrian Gibbons