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NVIDIA Unveils cuLitho: A “Breakthrough in Computational Lithography”

NVIDIA Unveils cuLitho: A “Breakthrough in Computational Lithography”

At NVIDIA’s GTC this week, the company lifted the curtain on a software suite that may drastically improve the resolution of existing lithographic systems.


News Mar 22, 2023 by Jake Hertz
Hailo Spins Vision SoC Crafted for AI Analytics-capable Smart Cameras

Hailo Spins Vision SoC Crafted for AI Analytics-capable Smart Cameras

With its Hailo-15 chip, the company hopes to bring advanced AI analytics and processing into intelligent camera designs.


News Mar 08, 2023 by Jeff Child
In a Series of Agreements, GlobalFoundries Buoys Chip Supply From Home

In a Series of Agreements, GlobalFoundries Buoys Chip Supply From Home

Tracking the goals of the CHIPS+ Act, GlobalFoundries is strengthening the U.S. semiconductor ecosystem with several partnerships and acquisitions.


News Feb 21, 2023 by Biljana Ognenova
Sensata - BEI Sensors IO-Link Encoders | Featured Product Spotlight

Sensata - BEI Sensors IO-Link Encoders | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


DC-DC Switching Regulators Zero In on Automotive and Industrial Designs

DC-DC Switching Regulators Zero In on Automotive and Industrial Designs

While their issues and challenges are distinct, both automotive and industrial systems rely on DC-DC switching regulator technology. Learn how to navigate these issues and make smart engineering choices.


TSMC Announces Expansion Plans for Highly-anticipated Arizona Fab

TSMC Announces Expansion Plans for Highly-anticipated Arizona Fab

TSMC will be adding a second fab to its Phoenix, Arizona, site—with plans to make both 4 nm and 3 nm process chips within the next three years.


News Dec 14, 2022 by Biljana Ognenova
New Foundry System Claimed to Half IC Prices and Slash Lead Times

New Foundry System Claimed to Half IC Prices and Slash Lead Times

Search for the Next's new Infrastructure Time Machines are designed to “turn Moore’s clock back by 10 years."


News Dec 05, 2022 by Chantelle Dubois
Aimed at Power Distribution, Menlo Micro Debuts “Highest” Power MEMS Switch

Aimed at Power Distribution, Menlo Micro Debuts “Highest” Power MEMS Switch

Putting its Ideal Switch technology back into action, Menlo Micro has unveiled what it says is the industry highest power MEMS switch device.


News Dec 01, 2022 by Jeff Child
Industry and Academia Look Toward Sustainable Circuit Boards

Industry and Academia Look Toward Sustainable Circuit Boards

The shift to sustainable circuit boards may begin with minute changes to solder and substrates and larger changes to manufacturing techniques.


News Nov 22, 2022 by Chantelle Dubois
Rotary Position Sensor from onsemi Puts a New Spin on Inductive Sensing

Rotary Position Sensor from onsemi Puts a New Spin on Inductive Sensing

Using its patented technology, onsemi has brought inductive position sensing into the high-speed, high-accuracy realm. The device enables easy-to-implement PCB sensor designs.


News Nov 16, 2022 by Jeff Child
Siemens Touts its Online PCBflow as “DFM for the Rest of Us”

Siemens Touts its Online PCBflow as “DFM for the Rest of Us”

Setting out to break down the barriers to design-for-manufacturing (DFM) for small design groups, Siemens is positioning its PCBflow service as an online DFM collaboration space.


News Nov 15, 2022 by Jeff Child
Ferroelectric RAM (F-RAM) Hits the Market With Infineon’s EXCELON Family

Ferroelectric RAM (F-RAM) Hits the Market With Infineon’s EXCELON Family

Infineon has announced a new family of ferroelectric RAM—an energy-efficient, non-volatile memory solution designed for data-critical applications.


News Nov 03, 2022 by Aaron Carman
Chipmakers Expand SiC Production as Demand for Power Electronics Grows

Chipmakers Expand SiC Production as Demand for Power Electronics Grows

Wolfspeed, STMicroelectronics, SK Siltron, and Onsemi have independently announced new efforts to bolster the SiC supply chain over the next five years.


News Oct 12, 2022 by Biljana Ognenova
NIST and Google Team Up to Build Open-source IC Supply Chain

NIST and Google Team Up to Build Open-source IC Supply Chain

The new partnership will give startups and research labs access to valuable R&D resources—particularly with open-source chips.


News Sep 27, 2022 by Jake Hertz
Day 5: ITD 2022 Closes Out With Keynote on Supply Chains, Hot Trends, and More

Day 5: ITD 2022 Closes Out With Keynote on Supply Chains, Hot Trends, and More

It's finally Friday, which means Industry Tech Days 2022 is on its last day! Check out our final Keynote made up of an executive panel.


News Sep 23, 2022 by Kimber Wymore
Cornell Professor Modifies Microwave to Evenly Dope Semiconductors

Cornell Professor Modifies Microwave to Evenly Dope Semiconductors

Using a modified microwave oven, a team of Cornell researchers have solved a limiting challenge in semiconductor manufacturing.


News Sep 13, 2022 by Jake Hertz
Micron to Build the First New Memory Fab in the US in 20 Years

Micron to Build the First New Memory Fab in the US in 20 Years

Propelled by the CHIPS and Science Act, the new fab based in Boise, Idaho, will generate 2,000 new jobs at Micron and 17,000 new jobs in side sectors.


News Sep 07, 2022 by Biljana Ognenova
Expanded Digi-Key Facility Opens—Boosts Shipping to 81k Boxes Daily

Expanded Digi-Key Facility Opens—Boosts Shipping to 81k Boxes Daily

Digi-Key Electronics opened its new distribution center this week at its headquarters. The new facility triples the location’s shipping rate to 81,000 boxes per day of electronic parts.


News Aug 19, 2022 by Jeff Child
Finding Summary Statistics and Probabilities with the Binomial Distribution

Finding Summary Statistics and Probabilities with the Binomial Distribution

Article two in our binomial distribution series, this article explains the process of calculating mean, standard deviation, and probabilities after integrating your analytical task into the binomial framework.


Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.


News Aug 16, 2022 by Jeff Child