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From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

With 2022's Consumer Electronics Show (CES) coming up soon, we’ll take a look at some notable technologies to be highlighted at next year's Innovation Awards.


News Dec 20, 2021 by Jake Hertz
Hardware-as-a-Service Takes on New Utility in an Era of Remote PCB Design

Hardware-as-a-Service Takes on New Utility in an Era of Remote PCB Design

As the world embraces remote and hybrid work, design for hardware finds itself at a crossroads.


News Dec 14, 2021 by Jake Hertz
5G Backhaul May Move Data From Base Stations to a Core Network

5G Backhaul May Move Data From Base Stations to a Core Network

The future of 5G NR means moving into mmWave frequencies. What opportunities and challenges await operators in designing backhaul network services?


News Dec 13, 2021 by Adrian Gibbons
With 3G’s Departure, We May See a Tidal Wave of Obsolete Hardware

With 3G’s Departure, We May See a Tidal Wave of Obsolete Hardware

The sunset of 3G is scheduled for the end of next year. What does this mean for the millions of devices that rely on this wireless technology?


News Dec 13, 2021 by Tyler Charboneau
An “Industry First” 5G NR Small Cell SoC Spurs Open RAN Technology Forward

An “Industry First” 5G NR Small Cell SoC Spurs Open RAN Technology Forward

Radio Access Networks (RAN) technology was limited and expensive; however, Open RAN (O-RAN) is hoping to create easier and more compatible 5G technology. Pushing 5G Open RAN forward is Picocom's 5G New Radio (NR) SoC.


News Dec 06, 2021 by Jake Hertz
Infineon Tackles High-frequency Switching Losses With Latest OptiMOS 6 MOSFETS

Infineon Tackles High-frequency Switching Losses With Latest OptiMOS 6 MOSFETS

With increased performance of drain-source on-state resistance, gate charge, and figures of merit, Infineon's latest 100 V MOSFET technology seeks to improve high-frequency switching applications.


News Nov 21, 2021 by Ikimi .O
The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

Hoping to unlock AI and 5G smartphone innovations, Micron and MediaTek, leveraging 1α node technology, have validated the next generation of memory: the LPDDR5X.


News Nov 19, 2021 by Jake Hertz
High-Layer Count (HLC) PCB Technology for the 5G Era

High-Layer Count (HLC) PCB Technology for the 5G Era

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.


Qorvo Acquires UnitedSiC, Snapping Up More of the Wide Bandgap Market

Qorvo Acquires UnitedSiC, Snapping Up More of the Wide Bandgap Market

In a bid to expand into new power markets, RF giant Qorvo has acquired UnitedSiC, a pioneer in SiC FET technology.


News Nov 10, 2021 by Adrian Gibbons
Wi-Fi CERTIFIED HaLow Makes Its Debut—and Graduates Its First Reference Design

Wi-Fi CERTIFIED HaLow Makes Its Debut—and Graduates Its First Reference Design

Wi-Fi HaLow is described as having the best combination of range, throughput, density, low-power operation, and deployment costs. Now, the certification program will bring this latest IEEE standard to market.


News Nov 05, 2021 by Jake Hertz
5G From Space: Verizon and Amazon Team Up to Build Antennas for LEO Satellites

5G From Space: Verizon and Amazon Team Up to Build Antennas for LEO Satellites

Amazon's Project Kuiper, a counterpart to SpaceX's Starlink, aims to bring connectivity to rural areas via a constellation of Ka-band satellites. Now, Verizon wants in on the action.


Qualcomm Targets Industry Shortcomings and 5G Adoption with New Processors

Qualcomm Targets Industry Shortcomings and 5G Adoption with New Processors

These new processors aim to bring 5G and performance to mid-tier smartphones.


News Oct 29, 2021 by Jake Hertz
National Science Foundation Bankrolls EE Innovation at the University Level

National Science Foundation Bankrolls EE Innovation at the University Level

With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.


News Oct 25, 2021 by Lianne Frith
Basics of Millimeter Wave Technology

Basics of Millimeter Wave Technology

What is millimeter wave technology and how is it characterized compared to other lower-frequency technologies?


Intro to 5G NR

Intro to 5G NR

Learn the basics of 5G NR (New Radio), including its frequency bands, applications, and what technologies make it possible.


DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

Disrupting the Ga-polar GaN technology tradition with N-polar GaN devices, Transphorm is evaluating the cost vs. performance of sapphire substrates with a new DARPA contract.


News Oct 15, 2021 by Adrian Gibbons
Understanding 5G New Radio in Non-standalone Operation Applications

Understanding 5G New Radio in Non-standalone Operation Applications

The 5G New Radio platform is continuing to evolve. A clear understanding of 5G goals, technical terms, and technology will allow designers to imagine new use-cases for the nascent network.


News Oct 12, 2021 by Adrian Gibbons
Design and Development of 5G Devices: 5G Performance Ranges

Design and Development of 5G Devices: 5G Performance Ranges

How can engineers choose the correct performance range for their 5G application?


Huawei and Infineon Tackle Automotive AR Heads-up Display Challenges

Huawei and Infineon Tackle Automotive AR Heads-up Display Challenges

Augmented reality technology has been a focus for all sorts of technology, but what about its use in heads-up displays for vehicles? What are the challenges and who are innovating in this space?


News Sep 26, 2021 by Jake Hertz
Widespread Micro-transfer Printing May Open the Floodgates for 3D ICs

Widespread Micro-transfer Printing May Open the Floodgates for 3D ICs

Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will combine a wide range of semiconductors on a single 3D IC.