Latest Mobile Articles and Videos

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.

Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores,…

Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores, marking the biggest architectural change since the 80286.

At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.

At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.

High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and…

High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and extend operating times for battery-powered devices and systems.

As we look back on 2023, we give tribute to the 50th anniversary of the cellphone. After half a century, this device is…

As we look back on 2023, we give tribute to the 50th anniversary of the cellphone. After half a century, this device is almost unrecognizable from its two-pound form in the 70s and 80s.

Packing a radar and UWB transceiver in one chip, NXP’s latest development, announced today, simplifies vehicle access.

Packing a radar and UWB transceiver in one chip, NXP’s latest development, announced today, simplifies vehicle access.

Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets,…

Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.

Employing an ultrasound technique, xMEMS Labs has created a powerful MEMS speaker with a broad frequency range for…

Employing an ultrasound technique, xMEMS Labs has created a powerful MEMS speaker with a broad frequency range for next-gen applications.

SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.

SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.

The Keysight EDA 2024 tool suite promises to provide end-to-end design, modeling. and simulation with “shift left”…

The Keysight EDA 2024 tool suite promises to provide end-to-end design, modeling. and simulation with “shift left” workflow tools designed to increase productivity in the RF/5G world.

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five…

In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five critical BLE security procedures.

It’s a consequential time in the connectivity world. While Apple switches to USB-C on its new iPhone 15, Intel has…

It’s a consequential time in the connectivity world. While Apple switches to USB-C on its new iPhone 15, Intel has released version 5 of its Thunderbolt standard.

The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.

The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.

Pairing is an important concept in Bluetooth LE. Let’s examine the fundamentals of Bluetooth LE pairing, outlining how…

Pairing is an important concept in Bluetooth LE. Let’s examine the fundamentals of Bluetooth LE pairing, outlining how LE devices securely share keys between trusted devices.

Toshiba TCR1HF CMOS Linear LDO Regulator ICs are advanced silicon monolithic ICs crafted for power supply applications.…

Toshiba TCR1HF CMOS Linear LDO Regulator ICs are advanced silicon monolithic ICs crafted for power supply applications. Watch and learn all about their features, specs, applications, and more!

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both…

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).

Using modified quantum dot technology, Saphlux says its new display prototype offers the best red micro-LED engine in the…

Using modified quantum dot technology, Saphlux says its new display prototype offers the best red micro-LED engine in the industry.