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Graphene Nano-Chimneys Could Cool Future Circuits

Rice University students have determined that chimney-like structures made of carbon nanotubes could be the key to the future of heat dissipation.

February 15, 2017 by Robin Mitchell

Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.

January 25, 2017 by Chantelle Dubois

Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.

November 23, 2016 by Robin Mitchell

Why the Future of Data Centers Could Be in the Oceans

Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging them under water.

November 11, 2016 by Robin Mitchell

How to Keep a Power Transistor Cool Using a Heat Sink

Handling heat in electronics. Which components create heat, which components suffer from heat. Basics of heatsinking.

August 24, 2015 by Benjamin Crabtree