Thermal design is especially delicate in wearable devices. Here are a few ways researchers are tackling the issue—the most recent turning to materials science.
Thermal design is especially delicate in wearable devices. Here are a few ways researchers are tackling the issue—the most recent turning to materials science.
Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal…
Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Learn the characteristics of aluminum electrolytic capacitors and tips on how to properly select one for use in…
Learn the characteristics of aluminum electrolytic capacitors and tips on how to properly select one for use in electrical designs.
This article will discuss design practices that ensure better thermal management, including some common methods for…
This article will discuss design practices that ensure better thermal management, including some common methods for removing excess heat from a PCB.
Rice University students have determined that chimney-like structures made of carbon nanotubes could be the key to the…
Rice University students have determined that chimney-like structures made of carbon nanotubes could be the key to the future of heat dissipation.
Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.
Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.
Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has…
Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.
Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging…
Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging them under water.
Handling heat in electronics. Which components create heat, which components suffer from heat. Basics of heatsinking.
Handling heat in electronics. Which components create heat, which components suffer from heat. Basics of heatsinking.
Facebook
Google
GitHub
Linkedin