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Microchip Technology PIC18-Q41 Microcontrollers | New Product Brief

Microchip Technology PIC18-Q41 Microcontrollers | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Intel Set to Outsource Select CPU Production to TSMC’s 5nm Process

Intel Set to Outsource Select CPU Production to TSMC’s 5nm Process

Market analysts have reported that TSMC is to begin making Intel’s Core i3 chips on a 5nm process later this year, marking the latest in a series of struggles for Intel with its leading-edge process technology at both 10nm and 7nm.


News Jan 30, 2021 by Luke James
Understanding the Leakage Current Components in Short Channel MOS Transistors

Understanding the Leakage Current Components in Short Channel MOS Transistors

This article covers the basics of MOS transistors with a view towards better understanding the leakage current that can occur in such transistors.


Developers Double Down on the Machine Learning Basics Moving Into the New Year

Developers Double Down on the Machine Learning Basics Moving Into the New Year

Machine learning had a powerful impact on 2020 when it came to processing the mass amounts of COVID-19 data. To progress ML in 2021, developers are doubling down on features like on-device AI, low-power architecture, and framework compatibility.


News Jan 28, 2021 by Maya Jeyendran
Kirchhoff’s Laws: Laying EE Foundations in Voltage, Current, and Spectroscopy

Kirchhoff’s Laws: Laying EE Foundations in Voltage, Current, and Spectroscopy

While most EEs are familiar with Kirchhoff’s Laws of Current and Voltage, Kirchoff's research may have an even deeper impact on modern circuit analysis—and even quantum mechanics—than some may realize.


News Jan 27, 2021 by Kimber Wymore
5G Processor Standoff: Qualcomm, Samsung, and MediaTek Go Head to Head in Q1

5G Processor Standoff: Qualcomm, Samsung, and MediaTek Go Head to Head in Q1

Just this month, three major companies have released 5G-compatible chips. How do these new processors size up with one another?


News Jan 26, 2021 by Jake Hertz
5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

u-blox’s newest technology integrates both GNSS and 5G onto the same package. We had the chance to sit down with Senior Product Manager Samuele Falcomer to get the details.


News Jan 26, 2021 by Jake Hertz
Startup by Key Apple and Google Chip Designers Catches Qualcomm’s Eye

Startup by Key Apple and Google Chip Designers Catches Qualcomm’s Eye

In a $1.4 billion deal, Qualcomm recently announced that it will acquire NUVIA, an Arm-based startup led by three of Apple and Google’s foremost chip designers.


News Jan 25, 2021 by Luke James
On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.


News Jan 25, 2021 by Adrian Gibbons
Ongoing Chip Shortages Lead U.S. Automakers to Ask for Government Intervention

Ongoing Chip Shortages Lead U.S. Automakers to Ask for Government Intervention

As a chip shortage batters the global automotive industry, U.S. automakers plead for government intervention.


News Jan 22, 2021 by Luke James
MIT Devises Custom Hardware Acceleration to Spur Real-Time Robotic Response

MIT Devises Custom Hardware Acceleration to Spur Real-Time Robotic Response

To push real-time robotic response into reality, MIT researchers have turned to their own in-house technique called "robomorphic computing."


News Jan 22, 2021 by Jake Hertz
TinyML Makes Its First Debut on a Bluetooth SoC

TinyML Makes Its First Debut on a Bluetooth SoC

In a collaboration with Edge Impulse, Nordic Semiconductor has announced that TinyML will now be an available feature of select Bluetooth chips—an "industry first" as the press release says.


News Jan 20, 2021 by Jake Hertz
From Labs to Fabs: New Manufacturing Method Shows Promise in Scaling Quantum Computing

From Labs to Fabs: New Manufacturing Method Shows Promise in Scaling Quantum Computing

Using transistors as qubits, researchers have achieved single-electron operation in foundry-fabricated silicon—a potential breakthrough in quantum computing manufacturing.


News Jan 20, 2021 by Jake Hertz
The 2021 National Defense Authorization Act Zeroes In on AI Development

The 2021 National Defense Authorization Act Zeroes In on AI Development

The National Defense Authorization Act is a landmark in artificial intelligence legislation, which could advance U.S. leadership in this field and help the country fortify its competitive edge in the chip industry.


News Jan 19, 2021 by Luke James
The Fundamentals of Time-Sensitive Networking

The Fundamentals of Time-Sensitive Networking

Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.


Energy Harvesting Spotlight: Maxim Claims “Smallest Solar Harvesting Solution”

Energy Harvesting Spotlight: Maxim Claims “Smallest Solar Harvesting Solution”

IoT designers are commonly plagued with the issue of long-term deployment. Energy-harvesting paradigms, including a new solar harvesting device from Maxim, may be a promising supplement to battery cells.


News Jan 18, 2021 by Adrian Gibbons
Are AR Smart Glasses Making a Comeback? Lenovo and Vuzix Think So

Are AR Smart Glasses Making a Comeback? Lenovo and Vuzix Think So

Since the initial hype of Google Glass has died down in recent years, many AR companies have used the CES stage to resurge excitement in AR smart glasses. Here are the latest advancements from CES 2021.


News Jan 18, 2021 by Jake Hertz
The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The CES 2021 stage has debuted the hardware of some of the first Wi-Fi 6E devices. What are the benefits and challenges of this new connectivity protocol?


News Jan 15, 2021 by Tyler Charboneau
Two Up-and-Coming Companies Collaborate to Make Battery-Less IoT a Sustainable Reality

Two Up-and-Coming Companies Collaborate to Make Battery-Less IoT a Sustainable Reality

Current energy-harvesting designs have their limitations. e-peas and Sequans are coming up with what they call a "non-stop, zero-maintenance" solution.


DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

Some challenges to EE research include tight budgets and limited access to reputable silicon IP. DARPA Toolbox hopes to open access to these resources to drive microelectronic innovation forward.


News Jan 13, 2021 by Tyler Charboneau