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Pulse-Frequency Modulation for Switching Regulators

Pulse-Frequency Modulation for Switching Regulators

What’s the difference between PFM and PWM? We explore pulse-frequency modulation as a technique for controlling the output voltage of a switch-mode voltage regulator.


Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
Navitas Technology Takes GaN to New Power Heights

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.


AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.


News Sep 21, 2023 by Aaron Carman
AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
Memory, Processing, & Security: Focal Points of New Automotive Releases

Memory, Processing, & Security: Focal Points of New Automotive Releases

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.


News Sep 13, 2023 by Darshil Patel
How Will Angstrom-Scale Chips Advance the Electronics Industry?

How Will Angstrom-Scale Chips Advance the Electronics Industry?

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).


Semiconductor Skills Shortage May Escalate to ‘Crisis’ by 2030

Semiconductor Skills Shortage May Escalate to ‘Crisis’ by 2030

Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the world, it now faces an unprecedented challenge.


News Aug 14, 2023 by Jake Hertz
IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex AI challenges.


News Aug 14, 2023 by Aaron Carman
Startup HaiLa Aims Its Ambient IoT Tech at a ‘No Batteries’ IoT Future

Startup HaiLa Aims Its Ambient IoT Tech at a ‘No Batteries’ IoT Future

Emerging from stealth mode, HaiLa believes they can enable a future of IoT nodes without batteries.


News Aug 01, 2023 by Jake Hertz
At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.


News Jul 17, 2023 by Darshil Patel
Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.


News Jul 12, 2023 by Jake Hertz
Marveling at MEMS: The New Superheroes of The Silicon World

Marveling at MEMS: The New Superheroes of The Silicon World

Fari Assaderaghi and SiTime are aiming to disrupt the 70-year-old quartz timing industry by replacing crystals with silicon MEMS. After nearly two decades of following “Moore’s Law for timing improvements,” their time may have finally arrived.


Fundamentals of Binary-Coded Decimal (BCD)

Fundamentals of Binary-Coded Decimal (BCD)

This article provides an introduction to the computational number system known as binary-coded decimal or BCD. This numeric encoding scheme is historically significant and still advantageous in certain applications.


Boolean Canonical Forms: Sum-of-Products and Product-of-Sums

Boolean Canonical Forms: Sum-of-Products and Product-of-Sums

Understanding two key Boolean canonical forms, the sum-of-products and the product-of-sums, is important in digital system design and optimization. We will introduce how to generate these forms and provide guidelines on when it is typically best to use each form.


What Intel’s European Investments Say About Its Tech Roadmap

What Intel’s European Investments Say About Its Tech Roadmap

Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those funds looks like.


News Jun 29, 2023 by Chantelle Dubois
AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.


News Jun 27, 2023 by Jake Hertz
AI or 5G? EdgeQ Asks, “Why Not Both?” While Building a Wireless Base Station-on-a-Chip

AI or 5G? EdgeQ Asks, “Why Not Both?” While Building a Wireless Base Station-on-a-Chip

Adil Kidwai, VP and Head of Product Management at EdgeQ, discusses how they are aiming to redefine software-defined radios as they build what they believe is the world’s first base station-on-a-chip, using RISC-V to enable AI and 5G.


With PowerVia Backside Power, Intel Anticipates Big Chip Breakthroughs

With PowerVia Backside Power, Intel Anticipates Big Chip Breakthroughs

Intel has unveiled a new backside power delivery technology called PowerVia, which decouples power and signal interconnects on a wafer to increase performance and lower costs.


News Jun 22, 2023 by Arjun Nijhawan
Exploring Output Ripple in a Negative Voltage Charge Pump Using LTspice

Exploring Output Ripple in a Negative Voltage Charge Pump Using LTspice

In this article, we’ll use LTspice simulations to more thoroughly understand output-voltage ripple and consider techniques for mitigating it within a charge pump circuit.