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Sense, Process, Connect: Synaptics Launches SoCs and Dev Kit for Edge AI

Sense, Process, Connect: Synaptics Launches SoCs and Dev Kit for Edge AI

Synaptics' new SoCs and dev kit bring "out-of-the-box" embedded AI to any product, independent of the data center.


News Apr 19, 2024 by Jake Hertz
Applying IP Customization to Improve AI Chips: A Case Study

Applying IP Customization to Improve AI Chips: A Case Study

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.


Cars, Control, and Communication: A Product Roundup From Embedded World

Cars, Control, and Communication: A Product Roundup From Embedded World

Embedded World 2024 lived up to its promise of delivering exciting semiconductor news. Here are four bits that caught our eye for automotive, RISC-V, Bluetooth LE, and AI applications.


News Apr 16, 2024 by Duane Benson
New Processors Shine on the Embedded World Stage

New Processors Shine on the Embedded World Stage

Some of the industry’s computing giants, including Google and Intel, flashed the spotlight on new processors at Embedded World.


News Apr 15, 2024 by Jake Hertz
Circuit and Operation of a D Flip-Flop

Circuit and Operation of a D Flip-Flop

D-type flip-flops are fundamental digital memory components. Here, we examine their input-output behavior and internal circuitry.


VISC: The New Coprocessing RISC-V Architecture for AI Efficiency

VISC: The New Coprocessing RISC-V Architecture for AI Efficiency

The VISC architecture, developed by UK-based Red Semiconductor, targets AI autonomy, cryptography, and other AI applications


News Apr 12, 2024 by Duane Benson
Arm Shows Off New NPU and IoT Reference Design at Embedded World

Arm Shows Off New NPU and IoT Reference Design at Embedded World

Drilling down on the edge AI focus at Embedded World 2024, Arm announced some significant updates to its computing portfolio.


News Apr 12, 2024 by Aaron Carman
Efficient Discrete Logic Implementation Using MCU Complex Logic Blocks

Efficient Discrete Logic Implementation Using MCU Complex Logic Blocks

Learn how the Configurable Logic Block (CLB) peripheral in the PIC16F13145 family of microcontrollers allows developers to implement complex discrete logic functions in hardware to reduce the Bill of Materials and develop custom application-specific logic.


Semidynamics Provides All-In-One AI IP to Facilitate AI Chip Design

Semidynamics Provides All-In-One AI IP to Facilitate AI Chip Design

The All-In-One AI IP bundles a CPU, GPU, NPU—and Semidynamics' unique, in-house "Gazzillion Misses" technology—into a single subsystem.


News Apr 11, 2024 by Jake Hertz
Altera Infuses AI Into New Mid-Range FPGAs

Altera Infuses AI Into New Mid-Range FPGAs

Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.


News Apr 10, 2024 by Dale Wilson
AMD Announces Two New Adaptive SoCs for Faster Edge AI

AMD Announces Two New Adaptive SoCs for Faster Edge AI

At Embedded World 2024, AMD announced two new adaptive SoC chips targeting edge AI and high-load edge computing systems—both of which will be deployed in Subaru's Eyesight ADAS.


News Apr 10, 2024 by Duane Benson
At Silicon Labs, Wireless IoT is Only The First Step in Rethinking Product Design

At Silicon Labs, Wireless IoT is Only The First Step in Rethinking Product Design

Daniel Cooley, CTO and SVP of Technology and Product Development, has spent nearly 20 years at Silicon Labs. He discusses today’s cutting-edge wireless and IoT technologies and where he thinks they are heading over the next 50 years.


All About Circuits Looks Ahead at Embedded World 2024

All About Circuits Looks Ahead at Embedded World 2024

Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show in Nuremberg, Germany.


News Apr 03, 2024 by Jeff Child
Earthquake in Taiwan—Our Hearts Go Out to Those Impacted

Earthquake in Taiwan—Our Hearts Go Out to Those Impacted

The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.


With an Eye on On-Device AI, Qualcomm Rolls Out New Snapdragon SoC

With an Eye on On-Device AI, Qualcomm Rolls Out New Snapdragon SoC

The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.


News Mar 28, 2024 by Duane Benson
NXP Launches Open S32 CoreRide Platform for Software-Defined Vehicles

NXP Launches Open S32 CoreRide Platform for Software-Defined Vehicles

Today, NXP announced a new platform and automotive processor that promises more integration and utility in SDVs—no matter the architecture.


News Mar 28, 2024 by Aaron Carman
Shake It Off! A Digital Drawing Pad Inspired by the Iconic Etch A Sketch

Shake It Off! A Digital Drawing Pad Inspired by the Iconic Etch A Sketch

In this project, which uses the Arduino IDE, we create and demonstrate a digital drawing pad using an ESP32-based e-paper display dev board, rotary encoders for drawing control, and an accelerometer for shake detection to initiate an erase.


Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semiconductor’s Founder and Executive Director joins us to discuss their thin-film, low-cost alternative to traditional silicon manufacturing and their aim to disrupt applications from smart labeling to IoT sensors and fingerprint sensors.


Intel Receives $8.5B Grant to Ramp Up Chip Production

Intel Receives $8.5B Grant to Ramp Up Chip Production

The U.S. CHIPS Act is starting to materialize with a large sum of money going Intel’s way.


News Mar 25, 2024 by Jake Hertz
Nvidia Reveals Blackwell: The ‘World’s Most Powerful Chip’ for AI

Nvidia Reveals Blackwell: The ‘World’s Most Powerful Chip’ for AI

Nvidia took the GTC stage to unveil Blackwell, a platform built upon a 208 billion transistor, dual-die GPU with a 10 TB/s chip-to-chip interconnect.


News Mar 22, 2024 by Duane Benson