Latest Digital ICs Articles and Videos

Intel's latest desktop processor family includes six new variants, offering up to 24 cores and 32 threads and up to 6 GHz…

Intel's latest desktop processor family includes six new variants, offering up to 24 cores and 32 threads and up to 6 GHz of frequency for high-performance gaming.

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply…

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.

Two relatively new players in the CPU world, Semidynamics and Signature IP, have announced multi-core RISC-V and CHI…

Two relatively new players in the CPU world, Semidynamics and Signature IP, have announced multi-core RISC-V and CHI interconnect IP for compute-intensive applications like AI/ML.

Leveraging silicon photonics for the data center, designers now have a single-chip solution for 800 Gb/s transmission.

Leveraging silicon photonics for the data center, designers now have a single-chip solution for 800 Gb/s transmission.

Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn…

Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn about these nuances and about the resources available to help you tackle these challenges.

When you look under the hood of generative AI processing, the system design challenges are many. Learn how efficiency,…

When you look under the hood of generative AI processing, the system design challenges are many. Learn how efficiency, power consumption, and memory issues all come into play.

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability…

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new…

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.

Hailed for his historic microprocessor designs at AMD, Apple, and Broadcom, Jim Keller is onto his next CPU endeavor at…

Hailed for his historic microprocessor designs at AMD, Apple, and Broadcom, Jim Keller is onto his next CPU endeavor at Tenstorrent.

The new NPUs offload from any host processor to facilitate on-device edge computing.

The new NPUs offload from any host processor to facilitate on-device edge computing.

In this hands-on project, we will update a 1980s version of a one-shot (monostable multivibrator) circuit by giving it a…

In this hands-on project, we will update a 1980s version of a one-shot (monostable multivibrator) circuit by giving it a modern, colorful output while also examining the circuit's operation.

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to…

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to scale data center AI.

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products…

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.

FPGA vendor Gowin Semiconductor has teamed with RISC-V IP developer Andes Technology to develop an SRAM FPGA SoC with a…

FPGA vendor Gowin Semiconductor has teamed with RISC-V IP developer Andes Technology to develop an SRAM FPGA SoC with a hard-instantiated RISC-V core.

At the center of one of the largest early court cases in Silicon Valley was the AL1 device, the brainchild of Four-Phase…

At the center of one of the largest early court cases in Silicon Valley was the AL1 device, the brainchild of Four-Phase Systems founder Lee Boysel.

Launched in January 2023, Altos Radar is fast-tracking a viable 4D automotive radar system with a recent $3.5M seed round.

Launched in January 2023, Altos Radar is fast-tracking a viable 4D automotive radar system with a recent $3.5M seed round.

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both…

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).

All About Circuits received exclusive details about Lumotive’s new LM10 chip, the first commercial optical…

All About Circuits received exclusive details about Lumotive’s new LM10 chip, the first commercial optical beam-steering chip designed to make optical 3D sensing as mainstream as cameras.