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ST Packs the Power and Connectivity Strengths of STM32 Into a Wireless MCU Module

ST Packs the Power and Connectivity Strengths of STM32 Into a Wireless MCU Module

Designing a transceiver and antenna is no small feat. A new module from ST is designed to help small companies to spend less time on the hardware and more time on the Bluetooth LE, Zigbee, or Thread application itself.


News Jan 07, 2021 by Dr. Steve Arar
“vRAN” Is Becoming a Key Focus for Developers of 5G Radio Units

“vRAN” Is Becoming a Key Focus for Developers of 5G Radio Units

With an influx of 5G devices, telecom companies, specifically those aligned with the O-RAN Alliance, are further developing virtualized radio access networks.


Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Updates to the IEEE 1588 standard protocol map out a low-cost method for synchronizing distributed clocks.


Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

While CAN FD has been around since 2011, this protocol is still, in many cases, the preferable option to Classical CAN for many designers. Here's why.


Newly-Announced $3.4 Billion Plan Aims to Stimulate US Semiconductor R&D

Newly-Announced $3.4 Billion Plan Aims to Stimulate US Semiconductor R&D

The SIA and the Semiconductor Research Corporation have released a preview of an upcoming report that outlines the next decade’s chip research and funding priorities.


News Nov 04, 2020 by Luke James
A Low-Cost Method of Powering a Microcontroller

A Low-Cost Method of Powering a Microcontroller

This article proposes a simple microcontroller power-supply circuit that is worth considering when you’re developing a (very) cost-sensitive system.


Maxim Doubles Down on Factory Automation With IO-Link Chips and Reference Design

Maxim Doubles Down on Factory Automation With IO-Link Chips and Reference Design

In modernized factories, time efficiency is paramount. New designs from Maxim Integrated aim to streamline efficiency by using configurable digital and analog IO.


News Oct 28, 2020 by Jake Hertz
Xilinx Brings FPGA DNA to a Custom Hybrid System-on-Chip for 5G Radio Units

Xilinx Brings FPGA DNA to a Custom Hybrid System-on-Chip for 5G Radio Units

Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to break all existing benchmarks.


News Oct 27, 2020 by Adrian Gibbons
Machine Learning and Intelligent Vision for the Industrial Edge

Machine Learning and Intelligent Vision for the Industrial Edge

NXP’s i.MX 8M Plus applications processor enables machine learning and intelligent vision for consumer applications and the industrial edge. Learn about the features of this processor and how it can be used in embedded vision systems.


Semtech Builds Out LoRa Edge Platform for More Precise Tracking and Transport Analytics

Semtech Builds Out LoRa Edge Platform for More Precise Tracking and Transport Analytics

Semtech is turning to embedded software and a new hardware reference design to sharpen asset tracking IoT solutions.


News Oct 20, 2020 by Adrian Gibbons
Amazon Reveals Participation of Semiconductor Companies on New Sidewalk Protocol

Amazon Reveals Participation of Semiconductor Companies on New Sidewalk Protocol

Thanks to some strategic partnerships, the Amazon Sidewalk project looks poised to launch later this year.


News Sep 23, 2020 by Jake Hertz
Protecting IoT Embedded Designs with Security ICs

Protecting IoT Embedded Designs with Security ICs

In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs. 


How to Enable I2C on the OKdo E1 Board Using the NXP MCUXpresso IDE

How to Enable I2C on the OKdo E1 Board Using the NXP MCUXpresso IDE

In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.


Microchip Jumps on New CoaXPress Standard with Chips for Machine Vision

Microchip Jumps on New CoaXPress Standard with Chips for Machine Vision

CoaXPress 2.0—the communication standard for machine vision—is here. Microchip wasted no time to develop a family of devices to meet the new standard.


News Aug 20, 2020 by Jake Hertz
Leveraging the LPC55S16-EVK for Industrial Applications

Leveraging the LPC55S16-EVK for Industrial Applications

Explore the LPC55S16, an MCU well-suited for industrial and professional applications, thanks to its fast clock speed of 150 MHz, out-of-the-box support for communicating over a CAN-FD bus network, and low current consumption.


When Will the Semiconductor Industry Bounce Back? Market Experts Weigh In

When Will the Semiconductor Industry Bounce Back? Market Experts Weigh In

COVID-19 hard hit the semiconductor industry. How long will it take for the business to recover?


News Jul 15, 2020 by Ingrid Fadelli
Semiconductor Nanophotonics Linked to Higher Communication Speed for Supercomputers and Data Centers

Semiconductor Nanophotonics Linked to Higher Communication Speed for Supercomputers and Data Centers

In the world of electronics and indeed science on the whole, when something simply just works without explanation, that’s not good enough; lots of questions get asked and researchers poke and prod until they can understand the underlying mechanisms and processes at work.


News May 21, 2020 by Luke James
MATLAB and Simulink Get a Major Deep Learning Facelift

MATLAB and Simulink Get a Major Deep Learning Facelift

MathWorks has revamped MATLAB and Simulink with a host of deep learning development tools—and they say these updates will be a major boon for automotive and wireless designers.


News May 09, 2020 by Robin Mitchell
As Suppliers Hunker Down on IoT, Multi-Protocol Chips May Spike

As Suppliers Hunker Down on IoT, Multi-Protocol Chips May Spike

Suppliers are producing more multi-protocol chips to meet the power and connectivity demands of IoT. Can we expect to see more tech like NXP's multiprotocol mesh networking MCUs in the future?


News May 08, 2020 by Gary Elinoff
Energy Sharing—The Key to Preventing LED Drivers from Overheating?

Energy Sharing—The Key to Preventing LED Drivers from Overheating?

Managing heat in LED drivers is a challenge when the device encounters a high input voltage, but the output voltage is low. In these cases, an “energy sharing” mechanism may be a solution.


News Apr 14, 2020 by Dr. Steve Arar