The embedded world Conference is the world’s leading meeting place for the embedded community, and it is returning again for its 18th year.
The embedded world Conference is the world’s leading meeting place for the embedded community, and it is returning again for its 18th year.
Diligent’s Eclypse Z7 and Genesys ZU are designed to speed development for projects based on Xilinx’s Zynq-7000 and…
Diligent’s Eclypse Z7 and Genesys ZU are designed to speed development for projects based on Xilinx’s Zynq-7000 and Zynq Ultrascale+.
The QN9090 and QN9030 are Bluetooth low-energy (BLE) devices that integrate Arm Cortex-M4 CPUs.
The QN9090 and QN9030 are Bluetooth low-energy (BLE) devices that integrate Arm Cortex-M4 CPUs.
Toray Industries recently claimed that they were the first in the world to communicate wirelessly across the…
Toray Industries recently claimed that they were the first in the world to communicate wirelessly across the ultrahigh-frequency (UHF) band.
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator…
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected…
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments,…
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
Learn how to build a setup that will help you predict a battery's performance as it ages using a Trinket M0 and software…
Learn how to build a setup that will help you predict a battery's performance as it ages using a Trinket M0 and software algorithms.
The Digi ConnectCore 8M Nano SOM platform is designed to reduce time to market for sophisticated IoT designs.
The Digi ConnectCore 8M Nano SOM platform is designed to reduce time to market for sophisticated IoT designs.
Renesas’ Trusted Secure IP (TSIP) and onboard mesh networking are geared for secure, wireless communications.
Renesas’ Trusted Secure IP (TSIP) and onboard mesh networking are geared for secure, wireless communications.
The three companies ally their unique capabilities to build a new network security system.
The three companies ally their unique capabilities to build a new network security system.
These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC…
These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.
The M95M04 devices support 4Mbit capacity and allow devices to capture and store more data using the serial interface…
The M95M04 devices support 4Mbit capacity and allow devices to capture and store more data using the serial interface peripheral (SPI) bus.
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA)…
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.
ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.
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