This article explores and provides answers to some common questions associated with CAN design and implementation challenges — in particular, signal…
This article explores and provides answers to some common questions associated with CAN design and implementation challenges — in particular, signal termination in CAN systems.
Silicon Labs is taking over Redpine Signals' connectivity business. What does the San Jose-based startup bring to the table?
Silicon Labs is taking over Redpine Signals' connectivity business. What does the San Jose-based startup bring to the table?
The 1-wire bus, though not as widespread as other protocols, is a valuable communication technique for certain applications.
The 1-wire bus, though not as widespread as other protocols, is a valuable communication technique for certain applications.
Keep this guide in your back pocket for the next time you're designing a device that requires BLE connectivity.
Keep this guide in your back pocket for the next time you're designing a device that requires BLE connectivity.
This article discusses the characteristics and applications of a serial communication protocol intended specifically for…
This article discusses the characteristics and applications of a serial communication protocol intended specifically for audio systems.
The STWLC68 integrates a high-power receiver and transmitter with a 32-bit Arm Cortex microcontroller core.
The STWLC68 integrates a high-power receiver and transmitter with a 32-bit Arm Cortex microcontroller core.
Dialog Semiconductor's latest IO-Link IC integrates advanced circuit protection and low power dissipation into a 3 mm x 3…
Dialog Semiconductor's latest IO-Link IC integrates advanced circuit protection and low power dissipation into a 3 mm x 3 mm package.
This article briefly reviews some important principles of power-supply design before discussing the features of the nRF5340.
This article briefly reviews some important principles of power-supply design before discussing the features of the nRF5340.
The Type 1SJ is designed for ISM bands ranging from 868 MHz to 916 MHz, including those employed in the US, Europe, and Asia.
The Type 1SJ is designed for ISM bands ranging from 868 MHz to 916 MHz, including those employed in the US, Europe, and Asia.
The embedded world Conference is the world’s leading meeting place for the embedded community, and it is returning…
The embedded world Conference is the world’s leading meeting place for the embedded community, and it is returning again for its 18th year.
Diligent’s Eclypse Z7 and Genesys ZU are designed to speed development for projects based on Xilinx’s Zynq-7000 and…
Diligent’s Eclypse Z7 and Genesys ZU are designed to speed development for projects based on Xilinx’s Zynq-7000 and Zynq Ultrascale+.
The QN9090 and QN9030 are Bluetooth low-energy (BLE) devices that integrate Arm Cortex-M4 CPUs.
The QN9090 and QN9030 are Bluetooth low-energy (BLE) devices that integrate Arm Cortex-M4 CPUs.
Toray Industries recently claimed that they were the first in the world to communicate wirelessly across the…
Toray Industries recently claimed that they were the first in the world to communicate wirelessly across the ultrahigh-frequency (UHF) band.
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator…
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected…
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments,…
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
Learn how to build a setup that will help you predict a battery's performance as it ages using a Trinket M0 and software…
Learn how to build a setup that will help you predict a battery's performance as it ages using a Trinket M0 and software algorithms.