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5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

u-blox’s newest technology integrates both GNSS and 5G onto the same package. We had the chance to sit down with Senior Product Manager Samuele Falcomer to get the details.


News Jan 26, 2021 by Jake Hertz
On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.


News Jan 25, 2021 by Adrian Gibbons
Modeling Hysteresis in SPICE

Modeling Hysteresis in SPICE

Modeling hysteresis in SPICE can be difficult when you're dealing with a multivalued transfer function. In this article, we'll teach you a way to "cheat" to get around this issue.


Researchers Claim Record-Breaking Speeds in New Optical Neuromorphic Chip

Researchers Claim Record-Breaking Speeds in New Optical Neuromorphic Chip

According to the researchers, this new type of optical neuromorphic processor can operate more than 1,000 times faster than any previous type of processor.


News Jan 17, 2021 by Luke James
DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

Some challenges to EE research include tight budgets and limited access to reputable silicon IP. DARPA Toolbox hopes to open access to these resources to drive microelectronic innovation forward.


News Jan 13, 2021 by Tyler Charboneau
How Junction-to-Ambient Thermal Resistance of an IC Package Affects Thermal Performance

How Junction-to-Ambient Thermal Resistance of an IC Package Affects Thermal Performance

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.


IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the beginning of TSMC's plans, though.


News Dec 17, 2020 by Luke James
Basics of IC Design Flows

Basics of IC Design Flows

This series will give you foundational information about the concept of integrated circuit (IC) design flows across types of IC.


What Is Mixed-Signal IC Design?

What Is Mixed-Signal IC Design?

This brief gives an overview of the steps in a typical mixed-signal IC design flow.


What Is RF Integrated Circuit Design?

What Is RF Integrated Circuit Design?

Learn the high-level steps behind RFIC design.


What Is Analog IC Design?

What Is Analog IC Design?

Learn the basic steps of the analog IC design process and how it compares to digital IC design.


What Is Digital IC Design?

What Is Digital IC Design?

Learn the high-level overview of digital integrated circuit (IC) design.


New Test Chip Analyzing 3D Thin Film Structures Hits the Market

New Test Chip Analyzing 3D Thin Film Structures Hits the Market

Chipmetrics Oy, a Finnish company, has begun to commercialize a test chip for analyzing thin-film structures in 3D chips.


News Dec 01, 2020 by Jake Hertz
Department of Defense Backs New Secure Electron Beam Lithography Initiative

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.


News Nov 28, 2020 by Luke James
Transistor Sizing in VLSI Design Using the Linear Delay Model

Transistor Sizing in VLSI Design Using the Linear Delay Model

In this article, we will learn how to find the optimal size of a transistor/logic gate present in a larger circuit to provide the desired performance using the linear delay model.


Security IC Solutions: Build or Buy?

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.


The Elmore Delay Model in VLSI Design

The Elmore Delay Model in VLSI Design

In this article, we'll discuss the Elmore delay model, which provides a simplistic delay analysis that avoids time-consuming numerical integration/differential equations of an RC network.


Introduction to CMOS Image Sensors

Introduction to CMOS Image Sensors

In this article, you'll learn the basics of the CMOS image sensor, including its core components, its block diagram, its strengths and weaknesses, and its applications.


Chipmakers Petition for Language Change in Funding Bill to Include Mission-Critical Devices

Chipmakers Petition for Language Change in Funding Bill to Include Mission-Critical Devices

A bill currently going through Congress which would see semiconductor firms handed an extra $3 billion in funding could do more harm than good if its language isn’t modified, some defense firms have said.


News Nov 07, 2020 by Luke James
Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?


News Nov 06, 2020 by Dr. Steve Arar