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Renesas Hails Fast Wake-Up Times as Key Factor in Low-Power MCUs

Renesas Hails Fast Wake-Up Times as Key Factor in Low-Power MCUs

Renesas recently released 12 new MCUs for IoT and industrial use cases—the key focal point being its wakeup time, along with high performance, low power, and enhanced security.


News Feb 04, 2021 by Jake Hertz
Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.


News Jan 27, 2021 by Jake Hertz
Reducing Distortion in Tape Recordings with Hysteresis in SPICE

Reducing Distortion in Tape Recordings with Hysteresis in SPICE

Summary


French Researchers Exploit Non-Idealities of Memristors to Bring AI to the Edge

French Researchers Exploit Non-Idealities of Memristors to Bring AI to the Edge

Keeping with the trend to depart from von Neumann architectures, French researchers have overcome non-ideal properties of memristors to bring Bayesian networks to the edge.


News Jan 23, 2021 by Jake Hertz
Choosing the Right Redriver or Retimer Device to Extend PCIe Protocol Signal Range

Choosing the Right Redriver or Retimer Device to Extend PCIe Protocol Signal Range

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  


The Initial State of Finite State Machines and the Memory Debate

The Initial State of Finite State Machines and the Memory Debate

This article discusses the use of finite state machines (or FSMs) in design, including the initial state and the way memory configuration affects FPGA design.


Was 2020 the Year of Edge AI Compute?

Was 2020 the Year of Edge AI Compute?

In 2020, many companies released flagship low-power devices with the goal of bringing AI to the edge. We’ll review some of the most recent ones and see how they compare.


News Dec 28, 2020 by Jake Hertz
Factors Suppliers Consider Before Sending a Memory Device to Space

Factors Suppliers Consider Before Sending a Memory Device to Space

Despite the pandemic, 2020 was a monumental year for space exploration. And pivotal to each mission's success at the circuit level was radiation-hardened memory devices.


News Dec 21, 2020 by Tyler Charboneau
2020 Chip Market Year in Review: DRAM Comes Out on Top

2020 Chip Market Year in Review: DRAM Comes Out on Top

According to IC Insights, DRAM was the biggest IC product category for 2020 with sales of $65.2 billion, followed by NAND coming in second at $55.2 billion.


News Dec 10, 2020 by Luke James
Analog Power at the Size of Digital? Edge AI Processor Combines Best of Both Worlds

Analog Power at the Size of Digital? Edge AI Processor Combines Best of Both Worlds

Can analog computation be a viable solution to the many challenges facing edge AI hardware? We spoke with Mike Henry, CEO of Mythic, to see why they think it is.


News Dec 02, 2020 by Jake Hertz
Improving Home Appliance Safety with IEC Standards

Improving Home Appliance Safety with IEC Standards

This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.


Researchers Create Low-Power Method to Control Magnetism With Voltage

Researchers Create Low-Power Method to Control Magnetism With Voltage

New research has unveiled that it’s possible to switch states of magnetism between ON and OFF in a new class of easy-to-fabricate materials containing nitrogen.


News Nov 26, 2020 by Luke James
Micron Takes 3D NAND to Towering New Heights— 176 Layers to Be Exact

Micron Takes 3D NAND to Towering New Heights— 176 Layers to Be Exact

In what the company has described as a breakthrough in flash memory, performance, and density, Micron has shipped the world’s first 176-layer 3D NAND.


News Nov 17, 2020 by Luke James
Xilinx and Samsung Pioneer First Adaptable Computational Storage Device

Xilinx and Samsung Pioneer First Adaptable Computational Storage Device

With the demand for in-memory computation increasing, Xilinx and Samsung have set out to create a “one size fits all” solution.


News Nov 13, 2020 by Jake Hertz
Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?


News Nov 06, 2020 by Dr. Steve Arar
In-Memory Computing May Solve the AI Memory Balancing Act of Volume, Speed, and Processing

In-Memory Computing May Solve the AI Memory Balancing Act of Volume, Speed, and Processing

Designing memory architectures for AI/ML devices may feel like an impassable compromise with storage volume, speed, and processing. A new in-memory computing accelerator may be a useful solution.


News Nov 03, 2020 by Jake Hertz
Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).


News Oct 29, 2020 by Dr. Steve Arar
As 5G Begins and Moore’s Law Ends, Multichip Packaging May Be a Memory Solution

As 5G Begins and Moore’s Law Ends, Multichip Packaging May Be a Memory Solution

As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.


News Oct 26, 2020 by Dr. Steve Arar
SK Hynix to Acquire Intel’s NAND Memory Business

SK Hynix to Acquire Intel’s NAND Memory Business

US chipmaker Intel is selling part of its NAND memory chip business to SK Hynix for $9 billion in a deal that will see the South Korean semiconductor supplier become the world’s second-largest flash memory chipmaker.


News Oct 22, 2020 by Luke James
Non-Volatile Memory Surges Ahead as Arm Spin-Off Develops CeRAM and FeFETs

Non-Volatile Memory Surges Ahead as Arm Spin-Off Develops CeRAM and FeFETs

This week, Arm announced that it will transfer its entire CeRAM IP portfolio to a new spin-out from the company, Cerfe Labs, while taking minority ownership stake in the new company.


News Oct 08, 2020 by Jake Hertz