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ST Outfits Its Automotive MCUs With a Next-Gen Extensible Memory

ST Outfits Its Automotive MCUs With a Next-Gen Extensible Memory

With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.


News Apr 24, 2025 by Jake Hertz
It Was Technology Innovation Galore at Embedded World 2025

It Was Technology Innovation Galore at Embedded World 2025

Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.


News Mar 22, 2025 by Jeff Child
Weebit’s ReRAM Is Now AEC-Q100 Qualified. What Does That Mean?

Weebit’s ReRAM Is Now AEC-Q100 Qualified. What Does That Mean?

Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.


News Mar 20, 2025 by Luke James
Micron Targets AI PCs With Next Gen of Its PCI Express NAND SSDs

Micron Targets AI PCs With Next Gen of Its PCI Express NAND SSDs

The new SSD, which leverages a PCIe Gen5 interface, may redefine data transfer speeds and reliability for AI PC OEMs.


News Feb 24, 2025 by Jake Hertz
Rethinking Computational Storage: Unlock the Processing Power of SSDs

Rethinking Computational Storage: Unlock the Processing Power of SSDs

Generic concepts of computational storage are a dead end, but targeted accelerators leveraging the massive on-board bandwidth of solid-state drives may benefit high-performance computing.


Infineon Rolls Out Rad-Hard 512 Mbit NOR Flash Memory for Space Designs

Infineon Rolls Out Rad-Hard 512 Mbit NOR Flash Memory for Space Designs

Infineon says the new solution is an industry first for radiation-hardened NOR Flash.


News Dec 02, 2024 by Jake Hertz
A Deep Dive on Winbond’s Memory Technology for Edge AI

A Deep Dive on Winbond’s Memory Technology for Edge AI

In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.


News Nov 13, 2024 by Jeff Child
Edge AI Demands Call For Optimized Storage Controller Chips

Edge AI Demands Call For Optimized Storage Controller Chips

AI will push the limits of PCs and smartphones. In turn, demands on storage controller chips will be intense. Learn how chip architectures and firmware schemes must be optimized for these AI workloads.


From AI to Aerospace: New Memory Solutions Evolve to Meet Data Demands

From AI to Aerospace: New Memory Solutions Evolve to Meet Data Demands

New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.


News Sep 13, 2024 by Mike Falter
Global Efforts Heat Up to Boost Semiconductor Production

Global Efforts Heat Up to Boost Semiconductor Production

Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.


News Aug 22, 2024 by Jake Hertz
New AI Efforts Touch Everything From Data Ownership to Humanoid Robots

New AI Efforts Touch Everything From Data Ownership to Humanoid Robots

Startups are using and supporting AI in a myriad of ways.


News Aug 20, 2024 by Jake Hertz
Memory Leaders Rise to Meet the Storage Challenges of AI

Memory Leaders Rise to Meet the Storage Challenges of AI

At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.


News Aug 08, 2024 by Jake Hertz
Rethinking MCU Architectures for the AI Era

Rethinking MCU Architectures for the AI Era

MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.


Teledyne e2v Upgrades Processors and DDR4 for Space

Teledyne e2v Upgrades Processors and DDR4 for Space

Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.


News Jul 22, 2024 by Aaron Carman
Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.


News Jul 15, 2024 by Darshil Patel
Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Weebit Nano and Efabless are teaming up to make it easier for chip designers to prototype intelligent devices using Weebit's advanced memory technology.


News Jun 05, 2024 by Arjun Nijhawan
Phison Carves Out New SSD Brand Along With Inaugural Series

Phison Carves Out New SSD Brand Along With Inaugural Series

The new Pascari brand will provide SSDs for data-heavy enterprise applications.


News May 23, 2024 by Aaron Carman
Density Demands Push Memory Solutions to New Heights

Density Demands Push Memory Solutions to New Heights

From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize density and speed.


News Apr 29, 2024 by Aaron Carman
Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.


News Apr 02, 2024 by Jake Hertz
Understanding How CXL 3.0 Links the Data Center Fabric

Understanding How CXL 3.0 Links the Data Center Fabric

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.