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Amphenol ICC ix Industrial™  IP20 Connectors | Tech Specs

Amphenol ICC ix Industrial™  IP20 Connectors | Tech Specs

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Oct 09, 2020 by TTI, Inc
A New Bluetooth/BLE and Wi-Fi 6 Chip Integrates LNAs, PAs, and Switches

A New Bluetooth/BLE and Wi-Fi 6 Chip Integrates LNAs, PAs, and Switches

NXP has announced that it is sampling a new family of 2x2 Wi-Fi 6 + Bluetooth/BLE chips for advanced industrial and IoT markets.


News Oct 09, 2020 by Luke James
Molex LTE and 5G External Cellular Antennas | Digital Datasheet

Molex LTE and 5G External Cellular Antennas | Digital Datasheet

AAC’s Digital Datasheet video series introduces the specs and applications of components—both new and familiar—straight from their datasheets.


Hailo Goes Head to Head With Intel and Google on AI Acceleration Modules

Hailo Goes Head to Head With Intel and Google on AI Acceleration Modules

Hailo, an Israel-based startup, has benchmarked its AI acceleration modules against its Intel and Google counterparts. What's the verdict?


The Fundamentals of Power Density

The Fundamentals of Power Density

In this article, learn about the power density in power management systems, including how it is estimated, its limitations, and solutions for overcoming those limitations.


Understanding t-Values and Testing for Statistical Significance

Understanding t-Values and Testing for Statistical Significance

This article explains how t-values are calculated and used to decide whether experimental data indicate a relationship between variables.


Non-Volatile Memory Surges Ahead as Arm Spin-Off Develops CeRAM and FeFETs

Non-Volatile Memory Surges Ahead as Arm Spin-Off Develops CeRAM and FeFETs

This week, Arm announced that it will transfer its entire CeRAM IP portfolio to a new spin-out from the company, Cerfe Labs, while taking minority ownership stake in the new company.


News Oct 08, 2020 by Jake Hertz
Amphenol ICC Zhaga Book 20 - FLM Series | Tech Specs

Amphenol ICC Zhaga Book 20 - FLM Series | Tech Specs

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Oct 08, 2020 by TTI, Inc
How to Verify and Validate Designs Using Fusion 360

How to Verify and Validate Designs Using Fusion 360

This article discusses why verification and validation matter in design, how they differ, and how applications help teams incorporate and enrich their workflows.


Understanding Electromagnetic Compatibility Tests: Conducted EMC

Understanding Electromagnetic Compatibility Tests: Conducted EMC

This article is the first in a two-part series that reviews the basics of electromagnetic compatibility tests. First, we'll focus on a main category of EMC tests—conducted EMC—and the relevant test setup.


Just How Much of a “Breakthrough” is Tesla’s Tabless Battery Cell?

Just How Much of a “Breakthrough” is Tesla’s Tabless Battery Cell?

Tesla's Battery Day came with an important announcement: a tabless lithium-ion battery cell. How does this architecture compare to traditional cells?


News Oct 07, 2020 by Dr. Steve Arar
Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

This morning, Maxim Integrated released its newest product, a low-power NN accelerator chip, with the hopes of bringing AI to the edge. We interviewed Kris Ardis, executive director of Micros, Security, and Software Business Unit at Maxim Integrated, to get the details.


News Oct 07, 2020 by Jake Hertz
2020 Set to be Second-Highest Year for Semiconductor Mergers and Acquisitions

2020 Set to be Second-Highest Year for Semiconductor Mergers and Acquisitions

Two huge acquisitions in July and September have guaranteed that 2020 will, at the very least, be the second-largest year in history for semiconductor mergers and acquisitions.


News Oct 06, 2020 by Luke James
How “Master” and “Slave” Terminology is Being Reexamined in Electrical Engineering

How “Master” and “Slave” Terminology is Being Reexamined in Electrical Engineering

"Master” and “slave” have been used for decades in engineering vernacular. Now, many tech companies are pushing for more neutral terms.


News Oct 06, 2020 by Tyler Charboneau
The Effect of MOS Non-Idealities on VLSI Circuit Reliability

The Effect of MOS Non-Idealities on VLSI Circuit Reliability

Learn about various non-idealities of MOS transistors and the effects they have on VLSI system reliability.


Technology Enablers for Faster, Safer, High-Efficiency EV chargers

Technology Enablers for Faster, Safer, High-Efficiency EV chargers

This article looks at semiconductor technologies that are driving EV chargers, including high-voltage semiconductor switches, power converters, and multi-level complex power stages.


Understanding the t-Distribution in Tests for Statistical Significance

Understanding the t-Distribution in Tests for Statistical Significance

This article introduces a statistical distribution used in significance testing. We’ll discuss its importance and its relation with the normal distribution.


How Will 5G’s High-Frequency Band Affect Signal Integrity?

How Will 5G’s High-Frequency Band Affect Signal Integrity?

5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.


News Oct 05, 2020 by Jake Hertz
TE CONNECTIVITY enetSEAL+ Connector System | New Product Brief

TE CONNECTIVITY enetSEAL+ Connector System | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Why Comparing Low-Power MCUs Can Be So Difficult

Why Comparing Low-Power MCUs Can Be So Difficult

When vendors have different names for power modes of low-power MCUs, it can be confusing to compare options for battery-powered IoT designs.


News Oct 05, 2020 by Jake Hertz