The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.
The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.
Texas Instruments claims its highly-integrated BLDC motor driver can reduce PCB area by as much as 30%—a possible…
Texas Instruments claims its highly-integrated BLDC motor driver can reduce PCB area by as much as 30%—a possible catalyst for speeding mild-hybrid EV adoption.
Working closely with ROHM Semiconductor, researchers at Osaka University have developed a device that operates in the…
Working closely with ROHM Semiconductor, researchers at Osaka University have developed a device that operates in the terahertz spectrum to transmit large, uncompressed 8K videos uninterrupted within a 300 GHz bandwidth.
u-blox’s newest technology integrates both GNSS and 5G onto the same package. We had the chance to sit down with Senior…
u-blox’s newest technology integrates both GNSS and 5G onto the same package. We had the chance to sit down with Senior Product Manager Samuele Falcomer to get the details.
While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a…
While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.
Modeling hysteresis in SPICE can be difficult when you're dealing with a multivalued transfer function. In this article,…
Modeling hysteresis in SPICE can be difficult when you're dealing with a multivalued transfer function. In this article, we'll teach you a way to "cheat" to get around this issue.
According to the researchers, this new type of optical neuromorphic processor can operate more than 1,000 times faster…
According to the researchers, this new type of optical neuromorphic processor can operate more than 1,000 times faster than any previous type of processor.
Some challenges to EE research include tight budgets and limited access to reputable silicon IP. DARPA Toolbox hopes to…
Some challenges to EE research include tight budgets and limited access to reputable silicon IP. DARPA Toolbox hopes to open access to these resources to drive microelectronic innovation forward.
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied,…
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.
TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the…
TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the beginning of TSMC's plans, though.
This series will give you foundational information about the concept of integrated circuit (IC) design flows across types of IC.
This series will give you foundational information about the concept of integrated circuit (IC) design flows across types of IC.
This brief gives an overview of the steps in a typical mixed-signal IC design flow.
This brief gives an overview of the steps in a typical mixed-signal IC design flow.
Learn the high-level steps behind RFIC design.
Learn the high-level steps behind RFIC design.
Learn the basic steps of the analog IC design process and how it compares to digital IC design.
Learn the basic steps of the analog IC design process and how it compares to digital IC design.
Learn the high-level overview of digital integrated circuit (IC) design.
Learn the high-level overview of digital integrated circuit (IC) design.
Chipmetrics Oy, a Finnish company, has begun to commercialize a test chip for analyzing thin-film structures in 3D chips.
Chipmetrics Oy, a Finnish company, has begun to commercialize a test chip for analyzing thin-film structures in 3D chips.
U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography…
U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.
In this article, we will learn how to find the optimal size of a transistor/logic gate present in a larger circuit to…
In this article, we will learn how to find the optimal size of a transistor/logic gate present in a larger circuit to provide the desired performance using the linear delay model.
Depending on the project, designers have a number of options to either etch security at the silicon level or buy a…
Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.
In this article, we'll discuss the Elmore delay model, which provides a simplistic delay analysis that avoids…
In this article, we'll discuss the Elmore delay model, which provides a simplistic delay analysis that avoids time-consuming numerical integration/differential equations of an RC network.
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