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Possible IC Packaging Shortages in 2018

Possible IC Packaging Shortages in 2018

Experts in semiconductor manufacturing are predicting longer lead times and higher demand for IC packaging in 2018. This news comes during a time when the electronics industry is already facing several shortages and high volume demands for components such as OLED displays, DRAM, and NAND flash memory.


News Dec 18, 2017 by Chantelle Dubois
Exploring the Future of Design in Autonomous Vehicles: An Interview with Mark Forbes of Altium

Exploring the Future of Design in Autonomous Vehicles: An Interview with Mark Forbes of Altium

All About Circuits recently met with Mark Forbes, Director of Product and Persona Marketing at Altium, to discuss the details behind autonomous vehicles including the challenges of unifying safety standards and why embedded software is so important to this booming field.


News Dec 13, 2017 by Karissa Manske
High Voltage Design: A New Three-Phase Half Bridge Gate Driver from Diodes Inc.

High Voltage Design: A New Three-Phase Half Bridge Gate Driver from Diodes Inc.

Diodes Incorporated has announced a new three-phase half bridge gate driver with multiple protection features and the ability to drive N-Channel MOSFETs and IGBTs.


News Dec 06, 2017 by Nick Davis
How To Simplify USB PD 1-4s Charging Design

How To Simplify USB PD 1-4s Charging Design

In this video, we'll take a look at a buck/boost battery manager IC that can charge your device battery using standard USB PD voltages—but it can also work in reverse, providing output to power or charge other devices.


Optimizing Smart Water Meters: A New Ultrasonic-Sensing Microcontroller from TI

Optimizing Smart Water Meters: A New Ultrasonic-Sensing Microcontroller from TI

In this article, we look at TI's new integrated ultrasonic-sensing MCU—the MSP430FR6047—that can deliver more accurate measurement for smart water meters.


News Nov 30, 2017 by Nick Davis
SiFive Building RISC-V Ecosystem, One Partnership at a Time

SiFive Building RISC-V Ecosystem, One Partnership at a Time

The catalog of IPs includes security cores, Logic NVM technology, embedded analytics, and multicore debugging toolsets.


News Nov 28, 2017 by Majeed Ahmad
Infineon iMOTION Design Kit Platform | New Product Brief

Infineon iMOTION Design Kit Platform | New Product Brief

Infineon’s iMOTION modular application design kit platform consists of multiple control and power boards that can be paired together for sensored or sensorless 3-phase motor drive applications.


A nanoPower and Tiny Voltage Supervisor from Maxim (and They Aren’t Kidding about the “Tiny”)

A nanoPower and Tiny Voltage Supervisor from Maxim (and They Aren’t Kidding about the “Tiny”)

A look at the MAX16140—a tiny device that uses a tiny amount of current, but one that promises a lot.


News Nov 15, 2017 by Nick Davis
GaN Breaks Barriers—RF Power Amplifiers Go Wide and High

GaN Breaks Barriers—RF Power Amplifiers Go Wide and High

This article describes the state of the semiconductor technology that is enabling new developments with shorter gate length GaAs and GaN transistors, circuit design considerations to achieve optimum performance, and examples of both GaAs and GaN wideband power amplifiers (PAs) that demonstrate today’s technology.


A New Multi-Pixel Metal-Oxide Gas Sensor with an I2C Interface in a Small Package

A New Multi-Pixel Metal-Oxide Gas Sensor with an I2C Interface in a Small Package

Sensirion touts long-term stability and increased robustness from their new SGP metal-oxide gas sensor, which is aimed at indoor air quality applications.


News Nov 13, 2017 by Nick Davis
SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

SiFive, the company behind the first RISC-V based SoCs, has recently announced the addition of Flex Logix’s FPGA IP to its DesignShare initiative.


News Nov 12, 2017 by Chantelle Dubois
Penny Wise and Pound Foolish: One Man’s Experience with the Hidden Cost of Cheap Parts

Penny Wise and Pound Foolish: One Man’s Experience with the Hidden Cost of Cheap Parts

Sometimes pennies saved in the design and manufacturing process can cost dollars later. This article visits the hidden costs of sourcing cheap components.


News Nov 03, 2017 by Mark Hughes
Implementing an Electronic Leveling Tool

Implementing an Electronic Leveling Tool

While it can be challenging to design electronic versions of precision tools, in this Industry Article we design an electronic level that matches the features of a conventional tool.


STMicro’s New ST53G System-in-Package Chip Could Add Contactless Payment to Your Smart Watch

STMicro’s New ST53G System-in-Package Chip Could Add Contactless Payment to Your Smart Watch

Could this be the chip that brings contactless payment in wearables to the forefront? This News Brief takes a look at the ST53G SiP (system-in-package) from STMicroelectronics.


News Oct 23, 2017 by Tim Youngblood
The History and Basics of IPC Standards: The Official Standards for PCBs

The History and Basics of IPC Standards: The Official Standards for PCBs

Learn about the industry-adopted IPC standards that govern every step related to the design, assembly, inspection, testing, and documentation of printed circuit boards (PCBs).


News Oct 20, 2017 by Nick Davis
All About BLDC Motor Control: Sensorless Brushless DC Motor Controllers

All About BLDC Motor Control: Sensorless Brushless DC Motor Controllers

Learn about sensorless brushless DC motor controllers, some example ICs, and some disadvantages of using such motors.


Intel to Introduce New CPU-FPGA Hybrid Chip Supported by Acceleration Stack

Intel to Introduce New CPU-FPGA Hybrid Chip Supported by Acceleration Stack

Last year, Intel acquired FPGA-focused Altera. Now they've announced the intention to create a hybrid between their well-known CPUs and FPGAs.Last year, Intel acquired FPGA-focused Altera. Now they've announced a new line of hybrid chips that combine FPGAs with their well-known CPUs, achieving a goal set in 2010.


News Oct 18, 2017 by Chantelle Dubois
Teardown Tuesday: Motion-Activated Trail Camera

Teardown Tuesday: Motion-Activated Trail Camera

In this Teardown Tuesday, we are going to take a look at the inner workings of a trail camera!


News Oct 17, 2017 by Alex Udanis
Dialog Semiconductor to Acquire Silego for $306 Million in Bid for the IoT

Dialog Semiconductor to Acquire Silego for $306 Million in Bid for the IoT

Dialog Semiconductor is set to acquire Silego for a reported $306 million. How will this affect their product lines?


News Oct 14, 2017 by Tim Youngblood
New Design Contest Challenges Designers to Create Configurable Mixed-Signal ICs

New Design Contest Challenges Designers to Create Configurable Mixed-Signal ICs

A new design competition has presented a series of challenges over roughly two months to use GreenPAK technology to make configurable mixed-signal ICs (CMICs).