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iRel40: The European Initiative Determined to Improve Component Reliability

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.


News Feb 17, 2021 by Luke James
Apple Files Three Patents for Biometric Sensor-based Tech Coming Down the Pike

Apple Files Three Patents for Biometric Sensor-based Tech Coming Down the Pike

Apple appears to be moving farther into the health market with new patents targeting various metrics of health including AR/VR, glucose monitoring, and clinical sleep analysis.


News Feb 15, 2021 by Adrian Gibbons
New PMOS Devices Take a Note on the Low On-Resistance of NMOS

New PMOS Devices Take a Note on the Low On-Resistance of NMOS

Many current P-channel MOSFETs don't cut it for high-voltage applications. To meet the challenge, a new family of PMOS is claimed to feature 62% lower RDS(on) than comparable devices.


News Feb 12, 2021 by Jake Hertz
Nine Factors to Consider for Board-Level Machine Vision Camera Integration

Nine Factors to Consider for Board-Level Machine Vision Camera Integration

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.


A Glimpse Into the Future of Prosthetics: Advanced Sensors, E-Skin, and AI

A Glimpse Into the Future of Prosthetics: Advanced Sensors, E-Skin, and AI

Researchers in electronics-based prosthetics, from e-skin to bionic hands, are working to bring comfortable and cutting-edge technology to future mainstream wearers.


News Feb 10, 2021 by Rushi Patel
In a Reach for Industry 4.0, ADI Unveils Condition-Based Monitoring Dev Kit

In a Reach for Industry 4.0, ADI Unveils Condition-Based Monitoring Dev Kit

Condition-based monitoring is important to consider when designing with vibration in mind, especially in IoT and industrial applications. A new development platform knits together resources for hardware designers, software engineers, and algorithm developers alike.


News Feb 08, 2021 by Adrian Gibbons
MIT Devises Custom Hardware Acceleration to Spur Real-Time Robotic Response

MIT Devises Custom Hardware Acceleration to Spur Real-Time Robotic Response

To push real-time robotic response into reality, MIT researchers have turned to their own in-house technique called "robomorphic computing."


News Jan 22, 2021 by Jake Hertz
New Image Sensors Find Use in Brain Imaging, Security Cameras, and Even Selfies

New Image Sensors Find Use in Brain Imaging, Security Cameras, and Even Selfies

A new crop of image sensors shows how device makers have been thinking out of the box with on-chip hardware "re-mosaic," curved image sensors, and more.


News Jan 21, 2021 by Nicholas St. John
From Labs to Fabs: New Manufacturing Method Shows Promise in Scaling Quantum Computing

From Labs to Fabs: New Manufacturing Method Shows Promise in Scaling Quantum Computing

Using transistors as qubits, researchers have achieved single-electron operation in foundry-fabricated silicon—a potential breakthrough in quantum computing manufacturing.


News Jan 20, 2021 by Jake Hertz
The Fundamentals of Time-Sensitive Networking

The Fundamentals of Time-Sensitive Networking

Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.


Integrated Laser-on-Silicon Photonics Gets a Boost from DARPA

Integrated Laser-on-Silicon Photonics Gets a Boost from DARPA

Partially funded by DARPA, Tower Semiconductor is creating a new foundry process for integrated-laser-on-silicon photonics.


News Jan 12, 2021 by Luke James
Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021

Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021

The U.S. government has made big pushes for domestic chip manufacturing in 2020. What does this trajectory look like for 2021?


News Dec 30, 2020 by Luke James
A New Manufacturing Method May Pull Nanowires From the Research Realm to Market

A New Manufacturing Method May Pull Nanowires From the Research Realm to Market

Nanowires are seeing drastic advances in academia, emphasizing the promise that they offer the optoelectronics industry.


News Dec 30, 2020 by Jake Hertz
MAXIM INTEGRATED TMC5160A Motor Controller & Driver ICs | Featured Product Spotlight

MAXIM INTEGRATED TMC5160A Motor Controller & Driver ICs | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


RENESAS ELECTRONICS RA6M4 32-bit ARM® Microcontrollers | Featured Product Spotlight

RENESAS ELECTRONICS RA6M4 32-bit ARM® Microcontrollers | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


INFINEON TPM Evaluation Kit for the TPM SLM 9670 | New Product Brief

INFINEON TPM Evaluation Kit for the TPM SLM 9670 | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the beginning of TSMC's plans, though.


News Dec 17, 2020 by Luke James
New SWIR Technology May Be a Catalyst for Machine Vision

New SWIR Technology May Be a Catalyst for Machine Vision

This week, Belgian-company Imec introduced a prototype of a new SWIR sensor offering record small pixel pitch. How is this announcement representative of SWIR's growing place in machine learning?


News Dec 16, 2020 by Jake Hertz
Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Updates to the IEEE 1588 standard protocol map out a low-cost method for synchronizing distributed clocks.


Molex 2.5mm Board-In Connector | Tech Specs

Molex 2.5mm Board-In Connector | Tech Specs

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Dec 10, 2020 by TTI, Inc