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Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Updates to the IEEE 1588 standard protocol map out a low-cost method for synchronizing distributed clocks.


Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Qualcomm recently unveiled Snapdragon 888, the company’s new high-end mobile platform built on the N5 process node.


News Dec 08, 2020 by Luke James
Figures of Merit in Power Design: A Reliable Benchmark or an Evolving Standard?

Figures of Merit in Power Design: A Reliable Benchmark or an Evolving Standard?

Design teams, especially in the power sector, may be increasingly asked to benchmark performance with Figures of Merit. What is this standard and how might it be evolving alongside component innovation?


The New IEC 62368-1 Safety Standard Is Upon Us. Here’s What You Should Know

The New IEC 62368-1 Safety Standard Is Upon Us. Here’s What You Should Know

IEC 62368-1 will be in effect on December 20, 2020. What are the key takeaways designers should know?


News Dec 01, 2020 by Tyler Charboneau
How Ethernet Switches are Branching Into Industries Far Beyond IT

How Ethernet Switches are Branching Into Industries Far Beyond IT

While Ethernet switches were once solely associated with IT applications, today they are staples in industries from military to rail communications.


News Nov 25, 2020 by Luke James
Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

While CAN FD has been around since 2011, this protocol is still, in many cases, the preferable option to Classical CAN for many designers. Here's why.


How Does Qi, the Wireless Charging Standard, Work?

How Does Qi, the Wireless Charging Standard, Work?

Qi-certified wireless charging devices are now commonplace in the consumer market. But how exactly does Qi achieve wireless power transfer at the circuit level?


News Nov 19, 2020 by Dr. Steve Arar
The Elmore Delay Model in VLSI Design

The Elmore Delay Model in VLSI Design

In this article, we'll discuss the Elmore delay model, which provides a simplistic delay analysis that avoids time-consuming numerical integration/differential equations of an RC network.


Adding an ISP and Machine Learning Acceleration to the i.MX 8M Family

Adding an ISP and Machine Learning Acceleration to the i.MX 8M Family

Learn how the i.MX 8M Plus applications processor enables edge computing, speeding up machine learning for a variety of applications including industrial tasks.


While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.


News Oct 14, 2020 by Nicholas St. John
Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

This morning, Maxim Integrated released its newest product, a low-power NN accelerator chip, with the hopes of bringing AI to the edge. We interviewed Kris Ardis, executive director of Micros, Security, and Software Business Unit at Maxim Integrated, to get the details.


News Oct 07, 2020 by Jake Hertz
What is DrMOS—the IC Powering Next-Gen Processors?

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.


News Sep 30, 2020 by Adrian Gibbons
Understanding Contrast, Histograms, and Standard Deviation in Digital Imagery

Understanding Contrast, Histograms, and Standard Deviation in Digital Imagery

Statistical techniques can help us to analyze the distribution of light and dark tones in an image.


GaN HEMT Reliability: Why the Industry Can’t Agree on One Testing Standard

GaN HEMT Reliability: Why the Industry Can’t Agree on One Testing Standard

If standardized testing methodology for GaN-based HEMT reliability is far on the horizon, what are manufacturers doing to help deliver quality GaN devices in the meantime? 


Xilinx Hardware Accelerators Link Up With O-RAN to Push 5G Server Performance

Xilinx Hardware Accelerators Link Up With O-RAN to Push 5G Server Performance

Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.


News Sep 21, 2020 by Adrian Gibbons
DDR4 Makes Headway Even with DDR5 Modules on Its Heels

DDR4 Makes Headway Even with DDR5 Modules on Its Heels

With no definitive release date for DDR5, DDR4 is making significant strides.


Determining Which PoE Transformer Is Best: Flyback or Forward?

Determining Which PoE Transformer Is Best: Flyback or Forward?

With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.


Four Telecom Players Team Up for 5G “Network Functions Virtualization” Platform

Four Telecom Players Team Up for 5G “Network Functions Virtualization” Platform

Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.


News Sep 12, 2020 by Jake Hertz
Data Buffers to the Rescue for Bandwidth-Burdened Server and Cloud Applications

Data Buffers to the Rescue for Bandwidth-Burdened Server and Cloud Applications

This week, Renesas has released their newest product: a data buffer for DDR5 aimed at empowering a new generation of high-performance computing applications.


News Sep 11, 2020 by Jake Hertz
How to Enable I2C on the OKdo E1 Board Using the NXP MCUXpresso IDE

How to Enable I2C on the OKdo E1 Board Using the NXP MCUXpresso IDE

In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.