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A Critical DRAM Fault Poses a Looming Threat to CPU Security

A Critical DRAM Fault Poses a Looming Threat to CPU Security

Rowhammer attacks are just one type of affront to DRAM security. Now, a team at ETH Zürich has uncovered an even more insidious threat to CPU memory.


The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

Hoping to unlock AI and 5G smartphone innovations, Micron and MediaTek, leveraging 1α node technology, have validated the next generation of memory: the LPDDR5X.


News Nov 19, 2021 by Jake Hertz
Phase-change Memory Could Open Doors to Better Data Storage and Computing

Phase-change Memory Could Open Doors to Better Data Storage and Computing

Pushing beyond the von Neumann bottleneck can be difficult for memory devices. One option is phase-change memory (PCM) which Stanford and IBM are researching for data storage and computing.


BittWare XUP P3R FPGA Accelerator Card V1 AME | New Product Brief

BittWare XUP P3R FPGA Accelerator Card V1 AME | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Micron’s Crucial DDR5 DRAM Promises Better Bandwidth for Next-gen Computers

Micron’s Crucial DDR5 DRAM Promises Better Bandwidth for Next-gen Computers

Reliability, speed, and large bandwidth per core are demanded by high-powered applications in personal computers. These are exactly what Micron's latest Crucial DDR5 memory promises to deliver.


News Nov 01, 2021 by Abdulwaliy Oyekunle
Ep. 36 | Cryptography in the Cloud Age with Intel Federal’s Steve Orrin

Ep. 36 | Cryptography in the Cloud Age with Intel Federal’s Steve Orrin

How does the US government protect the "serious secrets they need to keep" using innovative cryptography? In this episode of Moore's Lobby, hear about how cybersecurity is evolving for private industry and for governmental institutions under active attack.


Macronix and Crypto Quantique Team Up to Push Back on IoT Security Challenges

Macronix and Crypto Quantique Team Up to Push Back on IoT Security Challenges

Hoping to create an end-to-end security solution for the Internet of Things (IoT), Macronix and Crypto Quantique are teaming up to take on IoT security challenges.


News Oct 25, 2021 by Jake Hertz
Renesas’ New RA2E2 32-bit MCUs Promises More Scalable IoT Designs

Renesas’ New RA2E2 32-bit MCUs Promises More Scalable IoT Designs

Based on the ARM Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to the internet of things (IoT) endpoint applications.


News Oct 15, 2021 by Abdulwaliy Oyekunle
Micron Seeks to Solve Data Center Challenges with New Generation SSD

Micron Seeks to Solve Data Center Challenges with New Generation SSD

Data centers are facing serious challenges as technology continues to boom and Micron is out to keep them at bay with its latest solid-state drive.


News Oct 07, 2021 by Jake Hertz
Will Lithium-based Memristors Spur an Analog Computing Renaissance?

Will Lithium-based Memristors Spur an Analog Computing Renaissance?

In an AAC interview with MIT's faculty Jennifer Rupp and Ericsson's Dr. Saeed Bastani, we learned how a new field, "lithionics," could be the key to advancing neuromorphic computing.


News Oct 04, 2021 by Adrian Gibbons
Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications

Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications

AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory with high bandwidth memory.


Can 3D NAND Flash Memory Side Step the Challenges of NAND?

Can 3D NAND Flash Memory Side Step the Challenges of NAND?

Traditional NAND often faces power, performance, and cost inefficiencies. NEO Semiconductor has announced recently-patented X-NAND to bypass these limitations.


News Aug 18, 2021 by Ikimi .O
The Unsung Hero: Reference Designs from 3 Companies Aim to Inspire EEs

The Unsung Hero: Reference Designs from 3 Companies Aim to Inspire EEs

Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to help design facial detecting IoT, MasterGaN devices, and for Qi 1.3.


CrossBar Reimagines ReRAM Technology for Physically Unclonable Functions

CrossBar Reimagines ReRAM Technology for Physically Unclonable Functions

As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest resistive-RAM technology could be suited for a new class of PUF applications.


News Jul 22, 2021 by Jake Hertz
NVIDIA Dives Into Industrial High-performance Computing with HGX Platform

NVIDIA Dives Into Industrial High-performance Computing with HGX Platform

Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release of a new platform: the HGX HPC platform.


News Jul 19, 2021 by Ikimi .O
Higher Memory, Compute, and Security: Xilinx’s Versal HBM Platform Speeds Past DDR5

Higher Memory, Compute, and Security: Xilinx’s Versal HBM Platform Speeds Past DDR5

Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.


News Jul 14, 2021 by Adrian Gibbons
Xilinx Opens a New Door to Edge AI with Newest Adaptable Compute Platform

Xilinx Opens a New Door to Edge AI with Newest Adaptable Compute Platform

Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.


News Jun 09, 2021 by Adrian Gibbons
Mythic Redefines Edge AI by Combining Analog Processing and Flash Memory

Mythic Redefines Edge AI by Combining Analog Processing and Flash Memory

A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest processor could be a hopeful contender in the world of edge computing.


News Jun 07, 2021 by Jake Hertz
Reaching Towards 2D Memory: Is Magnetic Graphene and Spintronics the Key?

Reaching Towards 2D Memory: Is Magnetic Graphene and Spintronics the Key?

Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and data processing applications.


Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.


News May 10, 2021 by Adrian Gibbons