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Introduction to Ultra-Wideband (UWB) Technology

Introduction to Ultra-Wideband (UWB) Technology

Learn the basics of the ultra-wideband short-range wireless protocol, a technology that can be found in cutting-edge devices.


NASA Is Dedicating a Grant to Developing Power Systems for Space Exploration

NASA Is Dedicating a Grant to Developing Power Systems for Space Exploration

Universities and research institutions play a huge role in helping NASA develop and propel its technology forward, helping it realise innovations that have included everything from unique rocket engine designs to vehicles that can interact with the surfaces on other planets.


News Mar 18, 2020 by Luke James
Silicon vs. Silicon Carbide: Schottky Barrier Diode Edition

Silicon vs. Silicon Carbide: Schottky Barrier Diode Edition

How does a silicon carbide Schottky barrier diode compare to its silicon counterparts? Let's look to a few examples.


News Mar 17, 2020 by Gary Elinoff
Gallium Arsenide (Finally) Contends With GaN and SiC in One Regard: Space Applications

Gallium Arsenide (Finally) Contends With GaN and SiC in One Regard: Space Applications

GaAs has long been the bridesmaid but never the bride. However, because of its resistance to radiation, it is still the go-to choice for space-based applications. 


News Mar 16, 2020 by Gary Elinoff
Chinese Private Space Company Spacety Releases Plans for Small Satellite Development

Chinese Private Space Company Spacety Releases Plans for Small Satellite Development

Spacety was one of China’s first private space companies and has so far been involved in more than 10 space launches.


News Feb 26, 2020 by Luke James
The University of Illinois Develops A 3D Microchip Inductor to Fully Utilize 3D Structure Space

The University of Illinois Develops A 3D Microchip Inductor to Fully Utilize 3D Structure Space

Engineers from the University of Illinois have developed a microchip inductor that could greatly expand the capabilities of future chips.


u-blox’s New Multi-Radio Modules Aim to Bring Wi-Fi 6 to the Road

u-blox’s New Multi-Radio Modules Aim to Bring Wi-Fi 6 to the Road

The JODY-W3 series of multi-radio modules features 2 x 2 MIMO and dual-mode Bluetooth 5.1.


News Feb 24, 2020 by Gary Elinoff
Researchers Get Ahead of Hardware Backdoors—By Creating Their Own

Researchers Get Ahead of Hardware Backdoors—By Creating Their Own

This article assesses how researchers have taken a preventative approach to security by creating their own hardware backdoors.


News Feb 21, 2020 by Hannah DeTavis
TI Shrinks 36 V, 4 A Power Module for Rugged Industrial Applications

TI Shrinks 36 V, 4 A Power Module for Rugged Industrial Applications

TI claims that its TPSM53604 buck module consumes 50% less power and takes up 30% less space than competing devices.


News Feb 20, 2020 by Gary Elinoff
Mitsubishi Electric Aims to Improve In-flight Connectivity With Electronically-steered Array Antenna and RF IC

Mitsubishi Electric Aims to Improve In-flight Connectivity With Electronically-steered Array Antenna and RF IC

Mitsubishi Electric has announced an RF IC and a new electronically steered radio antenna that will deliver high-speed in-flight satellite connectivity.


News Feb 17, 2020 by Robin Mitchell
 Real Time Clocks (RTCs) in Microcontroller Timers

Real Time Clocks (RTCs) in Microcontroller Timers

This article is the third of a series on microcontroller timers which describes the RTCs inside a microcontroller.


How Does EUV Lithography Affect PCB Design—and National Security?

How Does EUV Lithography Affect PCB Design—and National Security?

The US government has blocked the sale of an EUV lithography system to China. What is EUV? why is it important? and why did the US government prevent its sale to China?


News Feb 06, 2020 by Robin Mitchell
Renesas Combines Synchronous Buck and LDO Regulator In One Rad-hard IC

Renesas Combines Synchronous Buck and LDO Regulator In One Rad-hard IC

The ISL70005SEH, geared for satellite orbit, incorporates both a synchronous buck converter and a low dropout (LDO) regulator in one monolithic IC.


News Jan 31, 2020 by Gary Elinoff
ChipSats—Hoards of Tiny Circuit Boards Sent to Space (or Attached to Cows)

ChipSats—Hoards of Tiny Circuit Boards Sent to Space (or Attached to Cows)

The size of a postage stamp, ChipSats form a sensor network to carry out tasks of larger satellites.


News Jan 21, 2020 by Lisa Boneta.
Harwin Gecko-MT Mixed Layout Connectors | Tech Specs

Harwin Gecko-MT Mixed Layout Connectors | Tech Specs

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Jan 21, 2020 by TTI, Inc
Position Tracking vs. Position Sensors? Distinction Matters in Terminology and Tech

Position Tracking vs. Position Sensors? Distinction Matters in Terminology and Tech

Position trackers and position sensors are fundamentally different. Yet sometimes outside of engineering spaces, we hear the terms used interchangeably. Here's why the distinction matters.


News Jan 18, 2020 by Tyler Charboneau
Microchip Revamps Popular Ethernet Transceiver and MCU for Space

Microchip Revamps Popular Ethernet Transceiver and MCU for Space

Based on familiar COTS devices, these two radiation-hardened devices are designed to facilitate space-based Ethernet connectivity.


News Jan 15, 2020 by Gary Elinoff
Maxim’s 2-Pin PLC Chip Saves Circuit Space and Power for True Wireless Earbuds

Maxim’s 2-Pin PLC Chip Saves Circuit Space and Power for True Wireless Earbuds

Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.


News Jan 10, 2020 by Gary Elinoff
ST Announces “First LoRa SoC,” Including Advanced Semtech Radio

ST Announces “First LoRa SoC,” Including Advanced Semtech Radio

The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.


News Jan 08, 2020 by Gary Elinoff
What’s New in Space? Components Designed to Weather Aerospace and Defense

What’s New in Space? Components Designed to Weather Aerospace and Defense

This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.


News Jan 05, 2020 by Hannah DeTavis