Latest PCBs Articles and Videos

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create…

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for…

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

Summary

Summary

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75…

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design…

Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design of a high-voltage side (output stage) of the gate driver.

Smaller electronics call for more powerful inspection equipment. If you're building a collection of at-home lab…

Smaller electronics call for more powerful inspection equipment. If you're building a collection of at-home lab equipment, these visual tools may help you see where you're going on minuscule boards.

Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.

Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design…

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and…

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke…

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using…

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.

In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the…

In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).

This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.

This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This…

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

Junction-to-ambient thermal resistance (or θ_JA) should be measured under standardized testing conditions. Learn about…

Junction-to-ambient thermal resistance (or θ_JA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric appropriately.

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied,…

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical…

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.

Learn the high-level steps behind RFIC design.

Learn the high-level steps behind RFIC design.