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What Is Analog IC Design?

What Is Analog IC Design?

Learn the basic steps of the analog IC design process and how it compares to digital IC design.


Construction of a Guitar Amplifier

Construction of a Guitar Amplifier

This article explains the theory and the construction of the circuit of a 10W practice guitar amplifier.


Department of Defense Backs New Secure Electron Beam Lithography Initiative

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.


News Nov 28, 2020 by Luke James
Understanding Multi-Faceted Modeling Within Fusion 360

Understanding Multi-Faceted Modeling Within Fusion 360

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about how to leverage the different modeling methods in Fusion 360.


Security IC Solutions: Build or Buy?

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.


How to Draw, Render, and Animate with Fusion 360

How to Draw, Render, and Animate with Fusion 360

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of complex designs.


TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

The new GaN FET family, which includes an integrated gate driver, is said to double power density in onboard chargers and industrial power supplies.


News Nov 10, 2020 by Jake Hertz
Processing Solutions for High-Density PCBs

Processing Solutions for High-Density PCBs

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.


Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."


News Oct 31, 2020 by Luke James
Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).


News Oct 29, 2020 by Dr. Steve Arar
QFLN Packages and Automated Optical Inspections are Incompatible. Side-Wettable Flanks Bridge the Gap

QFLN Packages and Automated Optical Inspections are Incompatible. Side-Wettable Flanks Bridge the Gap

Automated optical inspections can only be so thorough with QFLN packages. Pairing QFLN packages with side-wettable flanks facilitate the PCB assembly process.


News Oct 15, 2020 by Jake Hertz
How “Master” and “Slave” Terminology is Being Reexamined in Electrical Engineering

How “Master” and “Slave” Terminology is Being Reexamined in Electrical Engineering

"Master” and “slave” have been used for decades in engineering vernacular. Now, many tech companies are pushing for more neutral terms.


News Oct 06, 2020 by Tyler Charboneau
How Will 5G’s High-Frequency Band Affect Signal Integrity?

How Will 5G’s High-Frequency Band Affect Signal Integrity?

5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.


News Oct 05, 2020 by Jake Hertz
NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.


News Oct 02, 2020 by Luke James
Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?


News Sep 29, 2020 by Jake Hertz
Electronic Face Masks are a Fashionable High-Tech Trend

Electronic Face Masks are a Fashionable High-Tech Trend

Engineers are finding ways to innovate face masks with electronics—whether for air filtration, an LED smile, or language translation.


News Sep 26, 2020 by Adrian Gibbons
Eye Mask Prototype With Bimodal Sensors and Hydrogel Electrodes Measures Biometrics

Eye Mask Prototype With Bimodal Sensors and Hydrogel Electrodes Measures Biometrics

The researchers met the challenges of fabric-based sensors, combining the signal quality benefits of wet electrodes and the comfort benefits of dry electrodes.


News Sep 21, 2020 by Luke James
Clinical Trials Suggest New X-Ray Photon-Counting Detector May Improve Diagnoses

Clinical Trials Suggest New X-Ray Photon-Counting Detector May Improve Diagnoses

Researchers at CEA-Leti have developed a novel X-ray photon-counting detector that has been integrated into an X-ray scanner with promising initial trial results.


News Sep 19, 2020 by Luke James
Designing Microelectronics Using Fusion 360

Designing Microelectronics Using Fusion 360

This article dives into how Fusion 360 can be used to produce smarter microelectronics.


Molded Interconnect Devices May Be a PCB’s Partner in Design

Molded Interconnect Devices May Be a PCB’s Partner in Design

Molded interconnect devices, when conditioned with laser direct imaging, could be a helpful 3D supplement to PCB design.


News Sep 16, 2020 by Adrian Gibbons