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LiDAR Chip Gets a Boost From MEMS Switching to Hit a “Record” Resolution

LiDAR Chip Gets a Boost From MEMS Switching to Hit a “Record” Resolution

New research from UC Berkeley leverages micro-electromechanical system (MEMS) in LiDAR focal plane switch arrays (FPSAs) to achieve "record resolution." What challenges did they overcome to reach this record?


News Mar 15, 2022 by Jake Hertz
Menlo Micro’s “Ideal Switch” Gains Traction with $150 Million Funding

Menlo Micro’s “Ideal Switch” Gains Traction with $150 Million Funding

Claiming to have realized the “ideal switch,” GE spinoff Menlo Micro has secured over $225 million in funding to this point.


News Mar 14, 2022 by Jake Hertz
Researchers Create “Perfect EM Absorption” Rectenna for RF Energy Harvesting

Researchers Create “Perfect EM Absorption” Rectenna for RF Energy Harvesting

New research out of the University of South Florida takes a new approach to radio frequency (RF) energy harvesting using metamaterials to create a new type of "rectenna."


News Mar 14, 2022 by Jake Hertz
Processing Tech Highlight: MWC 2022 Wraps Up

Processing Tech Highlight: MWC 2022 Wraps Up

Another year at Mobile World Congress (MWC) Barcelona wraps up with a tech highlight on processors and system-on-chips (SoCs) from Intel, MediaTek, and Qualcomm.


News Mar 12, 2022 by vishvachi
Tokyo Researchers Hit the Lottery Ticket Theory with “Hiddenite” AI Chip

Tokyo Researchers Hit the Lottery Ticket Theory with “Hiddenite” AI Chip

A new, low-power AI processor leverages a bleeding-edge neural network theory: the lottery ticket theory.


News Mar 11, 2022 by Jake Hertz
New 3D IPUs Go for “WoW Factor” with TSMC’s Wafer-on-Wafer Technology

New 3D IPUs Go for “WoW Factor” with TSMC’s Wafer-on-Wafer Technology

Graphcore has revealed new intelligent processor units (IPUs) based on 3D wafer-on-wafer (WoW) technology. Next up for the company: an AI computer system.


News Mar 11, 2022 by Darshil Patel
Apple’s New M1 Ultra SoC Claims to Pack a Punch in Performance

Apple’s New M1 Ultra SoC Claims to Pack a Punch in Performance

Keeping its in-house chip momentum rolling, Apple unveils its newest member of the M1 family, the M1 Ultra. Let's dive into this new system-on-chip (SoC) and see what it brings to the table.


News Mar 10, 2022 by Jake Hertz
What the Expansion of OpenRAN Means for Telecom Hardware

What the Expansion of OpenRAN Means for Telecom Hardware

As we learned at this year's Mobile World Congress, OpenRAN is making headway. How exactly will this standard impact hardware development in the telecom space?


News Mar 09, 2022 by vishvachi
Diamond Keeps Growing as a WBG Material for High-power and Frequency Electronics

Diamond Keeps Growing as a WBG Material for High-power and Frequency Electronics

In the search for better wide bandgap (WBG) materials, researchers are looking towards the exploitation of diamond for the fabrication of field-effect transistors (FETs) for high-power and frequency electronics.


News Mar 09, 2022 by Abdulwaliy Oyekunle
The Potential of “Smart Roads:” Integrated Roadways Reimagines Infrastructure

The Potential of “Smart Roads:” Integrated Roadways Reimagines Infrastructure

Combining technology with pavement, Integrated Roadways dreams of a future where roads are intelligent. Learn more through AAC's interview with its CEO, Tim Sylvester.


News Mar 08, 2022 by Jake Hertz
How Actress Hedy Lamarr, the “Mother of Wi-Fi,” Laid the Foundation for Modern RF Tech

How Actress Hedy Lamarr, the “Mother of Wi-Fi,” Laid the Foundation for Modern RF Tech

Lamarr, in collaboration with an avante-garde musician named George Antheil, developed an early version of spread-spectrum communication known as frequency hopping.


News Mar 08, 2022 by Robert Keim
AAC Exclusive: A Chat With IBM Researchers Who Built the New “VTFET” Transistor

AAC Exclusive: A Chat With IBM Researchers Who Built the New “VTFET” Transistor

In December, IBM and Samsung announced a new transistor architecture said to defy conventional FinFETs. We spoke with two of IBM's leading researchers on this project for details.


News Mar 07, 2022 by Ingrid Fadelli
Shining a Light on Solid-state Green LEDs: Could C-GaN Be the Answer?

Shining a Light on Solid-state Green LEDs: Could C-GaN Be the Answer?

High-efficiency, solid-state green LEDs remain an elusive goal for semiconductor manufacturers. Research funded by ARPA-E targets these LEDs using standard complementary metal-oxide-semiconductor (CMOS) processing tools.


News Mar 07, 2022 by Dale Wilson
Recent Initiatives Strike at Creating a More Diverse, Hands-on EE Education

Recent Initiatives Strike at Creating a More Diverse, Hands-on EE Education

As technology continues to evolve, so should the education of those making the technology. A recent outpour of initiatives and programs from companies and universities shoot for more diverse, hands-on EE education.


News Mar 05, 2022 by Lianne Frith
Kicking Off Women’s History Month with the “Queen of Carbon Science”

Kicking Off Women’s History Month with the “Queen of Carbon Science”

Here is an accolade to Mildred Dresselhaus, a woman who began studying carbon allotropes on a nanoscale level and prompted other female physicists to follow her steps in STEM.


News Mar 04, 2022 by Biljana Ognenova
With Help from NXP Engineers, Young Students Chat with ISS Astronauts

With Help from NXP Engineers, Young Students Chat with ISS Astronauts

In an unforgettable demonstration of STEM education in action, students at Tarwater Elementary School in Arizona used ham radio equipment to communicate directly with the International Space Station.


News Mar 04, 2022 by Robert Keim
A System-on-package Future? UCIe Consortium Aims for Open Chiplet Ecosystem

A System-on-package Future? UCIe Consortium Aims for Open Chiplet Ecosystem

Citing a necessary industry shift from system-on-chip (SoC) to system-on-package (SoP) technology, Intel joins the launch of the Universal Chiplet Interconnect Express (UCIe) Consortium.


News Mar 03, 2022 by Jake Hertz
And That’s a Wrap: ISSCC 2022 Teases Out a Lot of New Tech

And That’s a Wrap: ISSCC 2022 Teases Out a Lot of New Tech

As this year's International Solid-State Circuits Conference (ISSCC) wraps up this week, let's take a look at some of this years interesting announcements.


News Mar 03, 2022 by Ikimi .O
Qualcomm Launches Digital Chassis Tech to Drive Vehicle Connectivity

Qualcomm Launches Digital Chassis Tech to Drive Vehicle Connectivity

Connectivity technology is no longer confined to houses and businesses. Now, Qualcomm has released a suite of new chips, SDKs, and services to enhance vehicle precision and communication.


News Mar 02, 2022 by Jake Hertz
Setting a World Standard: David Boggs the Co-father of the Ethernet

Setting a World Standard: David Boggs the Co-father of the Ethernet

David Boggs, co-inventor of the Ethernet, helped propel the world of connectivity to the future. Learn about his life, his work with Robert Metcalfe, and how the Ethernet standard shook up the world.


News Mar 02, 2022 by Jake Hertz