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Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Concord Pro allows each player in the design process to share up-to-date component information.


News Nov 01, 2019 by Gary Elinoff
Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.


News Nov 01, 2019 by Lisa Boneta.
Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.


News Oct 31, 2019 by Gary Elinoff
Keithley SMU Modules Aim to Aid in Low-current, High-capacitance Testing

Keithley SMU Modules Aim to Aid in Low-current, High-capacitance Testing

Source measurement unit modules augment the effectiveness of Keithley's 4200A-SCS Parameter Analyzer.


News Oct 30, 2019 by Gary Elinoff
NXP and Volkswagen Roll Out Wi-Fi-Based V2X Automotive Connectivity Technology

NXP and Volkswagen Roll Out Wi-Fi-Based V2X Automotive Connectivity Technology

Going firmly against the grain, the new system will rely on Wi-Fi, and not 5G.


News Oct 29, 2019 by Gary Elinoff
New ARM IP Brings Down Costs of AI for Mainstream Products

New ARM IP Brings Down Costs of AI for Mainstream Products

Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.


News Oct 28, 2019 by Gary Elinoff
Diodes Incorporated Reveals 2A Load Switch Aimed to Improve High-Side Load Switch Reliability

Diodes Incorporated Reveals 2A Load Switch Aimed to Improve High-Side Load Switch Reliability

The AP22913 features slew-rate control and true reverse-current blocking for single-channel load switching.


News Oct 25, 2019 by Gary Elinoff
Microchip Claims to Have Solved Power Over Ethernet Interoperability Issues with New PoE Products

Microchip Claims to Have Solved Power Over Ethernet Interoperability Issues with New PoE Products

New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.


News Oct 24, 2019 by Gary Elinoff
Melexis Announces Pressure Sensing IC for Engine EVAP Systems

Melexis Announces Pressure Sensing IC for Engine EVAP Systems

The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.


News Oct 23, 2019 by Gary Elinoff
New Wi-Fi 6, 5G, mm Wave Antennas Unveiled by Antenna Company at MCW19

New Wi-Fi 6, 5G, mm Wave Antennas Unveiled by Antenna Company at MCW19

A new 64 antenna 5G DRA covers 24-30 GHz frequency bands, MIMO device is aimed at Wi-Fi 6 (802.11ax).


News Oct 23, 2019 by Gary Elinoff
US-based Mobile World Conference 2019 Kicks off in Los Angeles, Doubles Down on 5G, AI, and IoT

US-based Mobile World Conference 2019 Kicks off in Los Angeles, Doubles Down on 5G, AI, and IoT

MWC2019 Los Angeles begins today, giving us a chance to reflect on the past 10 months in connectivity.


News Oct 22, 2019 by Gary Elinoff
Reader Question: What Is the Most Difficult Specialty Within Electrical Engineering?

Reader Question: What Is the Most Difficult Specialty Within Electrical Engineering?

There are some disciplines that many call "black magic"—but which is the most difficult field an EE can pursue?


News Oct 21, 2019 by Kate Smith
X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.


News Oct 18, 2019 by Gary Elinoff
STMicroelectronics Unveils New Series of Secure Payment SoCs

STMicroelectronics Unveils New Series of Secure Payment SoCs

ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.


News Oct 17, 2019 by Gary Elinoff
u-blox Expands Its Bluetooth Portfolio with Three New BLE Modules

u-blox Expands Its Bluetooth Portfolio with Three New BLE Modules

New members of the BMD product series encompass both indoor and long-range Bluetooth solutions.


News Oct 16, 2019 by Gary Elinoff
ST and Mikroe Collaborate on “Click Boards” for STSPIN Motor Driver ICs in Embedded Systems

ST and Mikroe Collaborate on “Click Boards” for STSPIN Motor Driver ICs in Embedded Systems

The newly announced Click board series extends the reach of ST's STSPIN motor driver ICs into the Mikroe ecosystem.


News Oct 14, 2019 by Gary Elinoff
BehrTech and MAJiK Systems Devise a Brownfield, IIoT Solution for Legacy PLCs

BehrTech and MAJiK Systems Devise a Brownfield, IIoT Solution for Legacy PLCs

Legacy systems can now reap the benefits of the Industrial Internet of Things without PLC reprogramming.


News Oct 11, 2019 by Gary Elinoff
ROHM’s New Family of 4-Pin Trench-Gate SiC MOSFETs Aims to Reduce Switching Losses

ROHM’s New Family of 4-Pin Trench-Gate SiC MOSFETs Aims to Reduce Switching Losses

The SCT3xxx xR series, available in 650V and 1200V VDS versions, can reduce switching losses by up to 35%.


News Oct 11, 2019 by Gary Elinoff
IoT Roundup: New Wireless Protocols Extend Coverage and Memory

IoT Roundup: New Wireless Protocols Extend Coverage and Memory

As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.


News Oct 10, 2019 by Hannah DeTavis
Renesas Introduces Security-Focused RA Family of Arm-Based MCUs

Renesas Introduces Security-Focused RA Family of Arm-Based MCUs

The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.


News Oct 09, 2019 by Gary Elinoff