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Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Intel claims the optical compute interconnect chiplet will "revolutionize high-speed data processing" of AI loads in data centers and HPC.


News Jul 03, 2024 by Jake Hertz
Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Semiconductor is bringing cryptographic agility and hardware root of trust to low-power FPGAs.


News Jul 02, 2024 by Duane Benson
Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

"Dynamite comes in small packages": Gowin Semiconductor adopts this mentality with its new FPGA targeting embedded high-speed interfaces.


News Jul 02, 2024 by Aaron Carman
Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

The new funding will expand the company’s product offerings and align it with the generative AI movement.


News Jul 01, 2024 by Jake Hertz
Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

The new microcontroller adds robust wireless connectivity and offloading to bolster the host processor.


News Jul 01, 2024 by Jake Hertz
My Favorites From Sensors Converge 2024

My Favorites From Sensors Converge 2024

A short recap of some of the most interesting technologies I was able to see while walking the show floor this year.


News Jun 28, 2024 by Dale Wilson
EDA Companies Unite With Samsung for AI and 3D IC Technology

EDA Companies Unite With Samsung for AI and 3D IC Technology

At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.


News Jun 28, 2024 by Arjun Nijhawan
TDK Launches Sensor Partner Program and MEMS Microphone

TDK Launches Sensor Partner Program and MEMS Microphone

TDK is building a collaborative ecosystem around its InvenSense MEMS sensors for IoT, wearable, hearable, AR/VR, and robotics applications.


News Jun 28, 2024 by Jake Hertz
Top EDA Vendors Reveal Plans to Support Intel Foundry

Top EDA Vendors Reveal Plans to Support Intel Foundry

It's DAC 2024 week, and Intel Foundry, the "world’s first systems foundry for the AI era," is getting a boost from top EDA vendors Ansys, Siemens, Cadence, and Synopsys.


News Jun 27, 2024 by Duane Benson
RISC-V Summit Europe News—Processor IP, Verification Tools, and More

RISC-V Summit Europe News—Processor IP, Verification Tools, and More

At every point in the design process, RISC-V developers can make use of the advancements presented at RISC-V Summit Europe.


News Jun 26, 2024 by Aaron Carman
Tiny But Mighty: Ceva Reveals New NPUs for Tiny Machine Learning Devices

Tiny But Mighty: Ceva Reveals New NPUs for Tiny Machine Learning Devices

The new neural processing unit is designed for edge AI applications that require targeted machine learning in resource-constrained settings.


News Jun 26, 2024 by Duane Benson
A Q&A With GlobalFoundries’ Vikas Gupta: With Silicon Photonics, Data Centers Can Shoulder AI

A Q&A With GlobalFoundries’ Vikas Gupta: With Silicon Photonics, Data Centers Can Shoulder AI

In this exclusive interview, GlobalFoundries representative Vikas Gupta discussed the advantages of silicon photonics for developing efficient AI chips.


News Jun 25, 2024 by Ingrid Fadelli
NXP Adds to AI Automotive Portfolio With Audio Processing DSP Chips

NXP Adds to AI Automotive Portfolio With Audio Processing DSP Chips

The chip family promises to deliver a significant upgrade to automotive infotainment systems.


News Jun 25, 2024 by Duane Benson
Qorvo Introduces Alternative to Mechanical Circuit Breakers

Qorvo Introduces Alternative to Mechanical Circuit Breakers

Qorvo's 4 mΩ SiC JFET for solid-state circuit breakers provides significant advantages over traditional mechanical breakers. Andy Wilson discussed the details with EEPower at PCIM 2024.


News Jun 24, 2024 by Kevin Clemens
Siemens Launches Thermal Analysis Software for the 3D IC Design Era

Siemens Launches Thermal Analysis Software for the 3D IC Design Era

The new EDA tool supports the industry’s growing transition toward 3D integrated circuits.


News Jun 24, 2024 by Jake Hertz
Nuvoton’s New MCU Balances Low Power Consumption and Speed

Nuvoton’s New MCU Balances Low Power Consumption and Speed

While the MCU can run at speeds of up to 72 MHz, its processing architecture and ReRAM technology keep power consumption low.


News Jun 21, 2024 by Jake Hertz
New SoCs Presented at PCIM Europe Gun for Integration in EVs

New SoCs Presented at PCIM Europe Gun for Integration in EVs

Though PCIM Europe drew to a close last week, show attendees gave EV designers plenty to consider with several newly announced SoCs.


News Jun 21, 2024 by Darshil Patel
Startup Orca Semiconductor Exits Stealth Sampling Its First PMIC

Startup Orca Semiconductor Exits Stealth Sampling Its First PMIC

The new startup is tackling the inefficiencies of “big analog” with its application-specific approach.


News Jun 20, 2024 by Jake Hertz
Companies Rally RISC-V Support for AI and HPC Applications

Companies Rally RISC-V Support for AI and HPC Applications

As RISC-V gains traction as an open-source alternative to Arm, several companies have announced partnerships and research to bolster the ISA.


News Jun 20, 2024 by Arjun Nijhawan
New PC-Based 5 GS/s Oscilloscope First to Be Powered by USB

New PC-Based 5 GS/s Oscilloscope First to Be Powered by USB

Using USB-C for power and data, the PicoScope 3000E series brings new meaning to portable, high-performance test equipment.


News Jun 19, 2024 by Aaron Carman