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ST and Metalenz Bring “First Optical Metasurface” to Consumer Markets

ST and Metalenz Bring “First Optical Metasurface” to Consumer Markets

STMicroelectronics has joined forces with Metalenz, a Harvard spin-out, to develop the "world’s first optical metasurface technology" for consumer devices.


News Jun 18, 2022 by Ikimi .O
Renesas Speeds Up Read and Write Performance for MCUs with STT-MRAM

Renesas Speeds Up Read and Write Performance for MCUs with STT-MRAM

A new memory offering from Renesas hopes to speed up memory accesses for IoT applications.


News Jun 17, 2022 by Jake Hertz
Another Attack on Apple’s M1—This Time, as PACMAN

Another Attack on Apple’s M1—This Time, as PACMAN

Researchers at MIT have recently discovered a new hardware vulnerability in Apple’s M1 chip.


News Jun 16, 2022 by Jake Hertz
From Archeology to Autonomy, LiDAR Sweeps Industries

From Archeology to Autonomy, LiDAR Sweeps Industries

In the past month, LiDAR has made headlines in meteorology, archeology, and vehicle autonomy.


News Jun 15, 2022 by Jake Hertz
Purdue University Kicks Off First Semiconductor Degrees Program

Purdue University Kicks Off First Semiconductor Degrees Program

With an eye on the semiconductor engineering shortage, Purdue University has launched a six-component flexible study program.


News Jun 15, 2022 by Biljana Ognenova
New Real-time Oscilloscope Tackles the Debugging Challenges of I3C

New Real-time Oscilloscope Tackles the Debugging Challenges of I3C

A new oscilloscope may ease the pain points of designing and debugging devices using the I3C communication protocol.


News Jun 14, 2022 by Jake Hertz
NXP’s MCX MCUs Shoot for Accessible Edge AI Design

NXP’s MCX MCUs Shoot for Accessible Edge AI Design

A new family of four microcontroller units (MCUs) from NXP strives to provide something for everyone designing for edge AI.


News Jun 14, 2022 by Jake Hertz
Intel Rethinks a Common Substrate to Combat Chip Shortage

Intel Rethinks a Common Substrate to Combat Chip Shortage

Intel is getting creative in how it addresses manufacturing slowdowns—this time, by doubling up on capacitors for both sides of the ABF substrate.


News Jun 13, 2022 by Jake Hertz
onsemi Launches Industry “First” Solutions for PoE and KNX

onsemi Launches Industry “First” Solutions for PoE and KNX

The new building automation solutions from onsemi aim to incorporate essential components that serve the needs of a modern smart home system


News Jun 13, 2022 by Abdulwaliy Oyekunle
IoT Solutions Roll for Security, Antenna Selection, and Edge Compute

IoT Solutions Roll for Security, Antenna Selection, and Edge Compute

Designing Internet of Things (IoT) systems can be a tricky juggling act. To help engineers keep pace, new IoT products are helping solve problems in security, connectivity, and edge computing.


Microchip Pushes First RISC-V-based SoC FPGA to Mass Production

Microchip Pushes First RISC-V-based SoC FPGA to Mass Production

Microchip continues the push for RISC-V hardware by reaching milestones with its PolarFire system-on-a-chip (SoC) field-programmable gate array (FPGA) and Mi-V ecosystem.


News Jun 10, 2022 by Jake Hertz
EU Officially Rules USB-C as Common Charger By 2024

EU Officially Rules USB-C as Common Charger By 2024

Consumers will need to look for an icon and a label that indicates charger performance and decide on an unbundled sale before making a purchasing decision.


News Jun 09, 2022 by Biljana Ognenova
Guarding the Cloud: Google, Microchip, and Others Up Hardware Security

Guarding the Cloud: Google, Microchip, and Others Up Hardware Security

Here are a few companies that have recently announced new ways to protect cloud data at the silicon level.


News Jun 08, 2022 by Jake Hertz
Tektronix Goes Small with 1.5-inch Thick Bench Quality Oscilloscope

Tektronix Goes Small with 1.5-inch Thick Bench Quality Oscilloscope

Bidding engineers to consider employing the same test tool on their bench top as they use in the field, Tektronix has released a 1.5-inch thick oscilloscope small enough to fit in a laptop bag.


News Jun 07, 2022 by Jeff Child
Apple Rolls Out M2—Its Second-gen Mac Processor

Apple Rolls Out M2—Its Second-gen Mac Processor

Continuing its commitment to in-house silicon for the Mac, Apple has released its second-generation processor: the M2. However, how does it stack up compared to the M1?


News Jun 07, 2022 by Jake Hertz
Qualcomm Spurs AR/VR Development With XR Dev Platform

Qualcomm Spurs AR/VR Development With XR Dev Platform

Qualcomm takes a swing at opening up the world of AR/VR hardware development with its Snapdragon Spaces XR Developer Program.


News Jun 07, 2022 by Arjun Nijhawan
Renesas Claims Another Debut in I3C—The First I3C Intelligent Switch

Renesas Claims Another Debut in I3C—The First I3C Intelligent Switch

Moving beyond I2C, Renesas is introducing a new I3C intelligent switch family to boost performance and speed in the data center.


News Jun 06, 2022 by Jake Hertz
TI Keeps AI on the Edge Targeting Accessibility at Half the Power Consumption

TI Keeps AI on the Edge Targeting Accessibility at Half the Power Consumption

A new family of system-on-a-chips (SoCs) from Texas Instruments (TI) aims at accessible edge AI for applications including human-machine interface (HMI) interaction.


News Jun 06, 2022 by Jake Hertz
Processors Zero in on the Professional Workforce and Workstations

Processors Zero in on the Professional Workforce and Workstations

Recently, companies like AMD, NVIDIA, and Intel have been targeting the professional world and workstations with a roll-out of advanced processors.


News Jun 04, 2022 by Ikimi .O
Unpacking 6G Security Challenges—The Metasurface-in-the-Middle Attack

Unpacking 6G Security Challenges—The Metasurface-in-the-Middle Attack

Since 6G technology is still in its early days, there's a lot to be learned. Increasing the world's 6G knowledge, Rice University discovered an attack that creates a vulnerability in 6G frequency bands.


News Jun 03, 2022 by Jake Hertz