The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact 20-pin package.
The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact 20-pin package.
Omron’s 4-pole relay fits on a PCB to reduce the heat generated in three-phase power electric vehicle wallboxes during…
Omron’s 4-pole relay fits on a PCB to reduce the heat generated in three-phase power electric vehicle wallboxes during high-power charging.
The new chip enables low data-rate communication between ECUs within the automotive network.
The new chip enables low data-rate communication between ECUs within the automotive network.
In this roundup, we highlight three new developments from Diodes Incorporated, Waymo, and the transportation department…
In this roundup, we highlight three new developments from Diodes Incorporated, Waymo, and the transportation department that are making cars and highways safer and more connected.
Whether in-home or in a dense commercial network, Microchip’s EV charger designs give designers access to new features…
Whether in-home or in a dense commercial network, Microchip’s EV charger designs give designers access to new features straight out of the box.
The Topaz FPGA line builds on the company’s Titanium FPGA portfolio with high-performance, cost-effective chips for…
The Topaz FPGA line builds on the company’s Titanium FPGA portfolio with high-performance, cost-effective chips for mainstream applications.
The new variants in Infineon's BLE 5.4 MCU family feature both SoC and module configurations.
The new variants in Infineon's BLE 5.4 MCU family feature both SoC and module configurations.
With an eye on efficiency, thermal resistance, and size, major power players have added new MOSFETs to their portfolios.
With an eye on efficiency, thermal resistance, and size, major power players have added new MOSFETs to their portfolios.
Automakers can now choose an Intel SDV SoC and later add a discrete GPU to handle larger compute workloads.
Automakers can now choose an Intel SDV SoC and later add a discrete GPU to handle larger compute workloads.
These new e-fuse offerings from Toshiba, Nexperia, and STMicroelectronics serve manifold applications: laptops, vehicles,…
These new e-fuse offerings from Toshiba, Nexperia, and STMicroelectronics serve manifold applications: laptops, vehicles, datacenters, and beyond.
The new line operates at 200 MHz—the highest dsPIC clock speed to date—and adds a double-precision floating point…
The new line operates at 200 MHz—the highest dsPIC clock speed to date—and adds a double-precision floating point unit and enhanced DSP engine.
NXP, Infineon, MediaTek, and Onsemi are joining hands with automotive OEMs to target systems ranging from digital…
NXP, Infineon, MediaTek, and Onsemi are joining hands with automotive OEMs to target systems ranging from digital cockpits to traction inverters.
Global energy demands are projected to soar over the next decade, making the need for increased power density in…
Global energy demands are projected to soar over the next decade, making the need for increased power density in semiconductors paramount.
Several companies have updated the size, efficiency, or development ecosystems of their image sensors for applications…
Several companies have updated the size, efficiency, or development ecosystems of their image sensors for applications ranging from AR to factory automation.
The 48-V direct drive motor driver IC promotes high efficiency, airflow, and speed rotation in fan motors.
The 48-V direct drive motor driver IC promotes high efficiency, airflow, and speed rotation in fan motors.
Samsung, Sensry, and Melexis recently announced new sensor technology and collaborations aimed at improving performance,…
Samsung, Sensry, and Melexis recently announced new sensor technology and collaborations aimed at improving performance, power, and protection.
The new current sensors integrate more features, reducing the need for external components.
The new current sensors integrate more features, reducing the need for external components.
The new topology eliminates the need for a transformer and significantly reduces the number of capacitors in DC-DC converter ICs.
The new topology eliminates the need for a transformer and significantly reduces the number of capacitors in DC-DC converter ICs.
Analog designers rejoice! ST, TI, and Rohm have released new op amps to address unique analog pain points.
Analog designers rejoice! ST, TI, and Rohm have released new op amps to address unique analog pain points.
"Dynamite comes in small packages": Gowin Semiconductor adopts this mentality with its new FPGA targeting embedded…
"Dynamite comes in small packages": Gowin Semiconductor adopts this mentality with its new FPGA targeting embedded high-speed interfaces.