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Nvidia Pulls Ahead in GPU Performance Race With New Processor

Nvidia Pulls Ahead in GPU Performance Race With New Processor

Nvidia says the H200 Tensor Core GPU, which doubles the performance of its predecessor, is now the world’s most powerful GPU.


News Nov 20, 2023 by Duane Benson
T&M Companies Release New Oscilloscopes for Dense Computing Designs

T&M Companies Release New Oscilloscopes for Dense Computing Designs

Three oscilloscopes from Keysight, Quantifi Photonics, and Rigol promise improvements to electronic testing and measurement.


News Nov 14, 2023 by Jake Hertz
Infineon Acquires GaN Systems, Bolstering Its Power Portfolio

Infineon Acquires GaN Systems, Bolstering Its Power Portfolio

Infineon has long been a leader in the power components industry. Now, the manufacturer is bringing GaN Systems' E-HEMTs into the fold.


News Nov 01, 2023 by Duane Benson
RISC-V Releases Abound Ahead of 2023 RISC-V Summit

RISC-V Releases Abound Ahead of 2023 RISC-V Summit

At the 2023 North America RISC-V Summit, dozens of presenters will showcase RISC-V innovations in desktop computing and wearable applications.


News Oct 27, 2023 by Arjun Nijhawan
Codasip’s New RISC-V Processor Family Dials In on Custom Compute

Codasip’s New RISC-V Processor Family Dials In on Custom Compute

The latest RISC-V IP makes processing power customizable for a wide span of embedded applications.


News Oct 23, 2023 by Aaron Carman
DustPhotonics Claims First to Develop 800G Silicon Photonics Chip

DustPhotonics Claims First to Develop 800G Silicon Photonics Chip

Leveraging silicon photonics for the data center, designers now have a single-chip solution for 800 Gb/s transmission.


News Oct 09, 2023 by Aaron Carman
MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

This year’s Plugfest helped validate I3C and build out its ecosystem amongst some of the industry’s leaders.


News Sep 28, 2023 by Jake Hertz
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

The new NPUs offload from any host processor to facilitate on-device edge computing.


News Sep 18, 2023 by Aaron Carman
AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
Generative AI Startup Shows Off Digital In-Memory Computing Platform

Generative AI Startup Shows Off Digital In-Memory Computing Platform

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to scale data center AI.


News Sep 14, 2023 by Aaron Carman
Behind Saildrone: The Company Sending Autonomous Sailboats Into the Eye of Hurricanes

Behind Saildrone: The Company Sending Autonomous Sailboats Into the Eye of Hurricanes

Driven by wind and solar power, storm-chasing Saildrone vessels are autonomously collecting valuable scientific data for up to a year at a time.


News Sep 12, 2023 by Aaron Carman
From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design

From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design

EDA tools now employ the newest advances in AI to help designers accelerate the IC development process.


News Sep 11, 2023 by Jake Hertz
Zuken Releases Host of Upgrades to Flagship PCB Design Software

Zuken Releases Host of Upgrades to Flagship PCB Design Software

The latest CR-8000 release expands the design software's spectrum of signal integrity, power integrity, and electromagnetic compatibility analysis tools.


News Sep 05, 2023 by Aaron Carman
Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel’s newest Xeon processors are based on either performance cores (P-cores) or efficiency cores (E-cores), giving designers more flexibility to prioritize speed or power efficiency.


News Aug 30, 2023 by Aaron Carman
Two Companies Use MEMS to Cool the ‘World’s Fastest Compact SSD’

Two Companies Use MEMS to Cool the ‘World’s Fastest Compact SSD’

At this year's Flash Memory Summit, two companies combined their respective cooling technology and SSD controllers to unlock unprecedented storage performance.


News Aug 29, 2023 by Aaron Carman
Semiconductor Industry News: Recent IPOs, Acquisitions, and Fallen Deals

Semiconductor Industry News: Recent IPOs, Acquisitions, and Fallen Deals

Amid the Chips Act, labor shortages, and international trade tension, the semiconductor industry is anything but predictable.


News Aug 28, 2023 by Duane Benson
Flash Memory Summit Presenters Pitch Solutions to Hiking Memory Demands

Flash Memory Summit Presenters Pitch Solutions to Hiking Memory Demands

Here are three announcements from the 2023 Flash Memory Summit that reflect some of the biggest trends in memory and storage technology.


News Aug 18, 2023 by Jake Hertz
Renesas MCUs/MPUs Can Now Be Programmed With Visual Studio Code

Renesas MCUs/MPUs Can Now Be Programmed With Visual Studio Code

By adding support for a familiar text editor, Renesas hopes to reach a new market of firmware designers.


News Aug 07, 2023 by Aaron Carman
New Temperature Sensor May Simplify Thermal Monitoring for Circuits

New Temperature Sensor May Simplify Thermal Monitoring for Circuits

Researchers at the University of Tokyo recently developed a new type of thermal sensor on a lightweight rolled-plastic base.


News Jul 27, 2023 by Duane Benson