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MIT’s New Hong Kong Innovation Node Bridges Cultural and Production Gaps

MIT’s New Hong Kong Innovation Node Bridges Cultural and Production Gaps

Shenzhen is half a world away from most designers, which means that there are some very real logistical barriers to bringing products to market. MIT's new Innovation Node could help bridge the gap between design and production.


News Nov 10, 2015 by Jennifer A. Diffley
A Big Mesh: Military Tactics and the Future of Mobile Communications

A Big Mesh: Military Tactics and the Future of Mobile Communications

An analysis of the historical link between the military's use of retransmission stations ("retrans") and the advent of the mesh network.


News Sep 01, 2015 by Mark Gerasimas
Intel Unveils Thunderbolt 3

Intel Unveils Thunderbolt 3

Intel® unveils Thunderbolt™ 3, the fastest, most versatile connection to any dock, display, or peripheral device – including billions of USB devices.


News Jun 03, 2015 by Jennifer A. Diffley