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MCU Roundup: New Connectivity Options for Industry 4.0 and Beyond

MCU Roundup: New Connectivity Options for Industry 4.0 and Beyond

Multiple MCU vendors recently announced new software, platforms, and modules to ever expand the reach of wireless connectivity.


News Nov 09, 2022 by Darshil Patel
NASA’s EMIT Mission Taps FPGA Processing to Measure Surface Minerals

NASA’s EMIT Mission Taps FPGA Processing to Measure Surface Minerals

Representing a joint effort to accurately characterize the minerals present on the Earth’s surface, NASA’s JPL leverages optical and FPGA-based advances to help in modeling the Earth’s climate.


News Nov 08, 2022 by Aaron Carman
Amphenol IP67 Inline Flow-Through Temperature Sensors | Featured Product Spotlight

Amphenol IP67 Inline Flow-Through Temperature Sensors | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


Startup Knocks Down Chiplet Hurdles with High-performance Link

Startup Knocks Down Chiplet Hurdles with High-performance Link

Eliyan is emerging from stealth mode, unveiling the successful tapeout of its high-performance UCIe-compliant die-to-die interconnect technology in 5 nm process.


News Nov 08, 2022 by Jake Hertz
Intel VP Aims to Deliver AI Everywhere and to Everyone

Intel VP Aims to Deliver AI Everywhere and to Everyone

Wei Li is the VP and GM for Artificial Intelligence and Analytics at Intel where, for 20 years, he has been an award-winning technologist and leader. He now directs their AI Everywhere initiative.


“Wi-Peep” Uses Wi-Fi-enabled Drone to Spy Through Walls

“Wi-Peep” Uses Wi-Fi-enabled Drone to Spy Through Walls

Leveraging a loophole in Wi-Fi, University of Waterloo researchers built a drone that determines the position of connected devices within seconds.


News Nov 07, 2022 by Aaron Carman
AMD Xilinx Zynq® UltraScale+™ MPSoC ZCU106 Evaluation Kit | New Product Brief

AMD Xilinx Zynq® UltraScale+™ MPSoC ZCU106 Evaluation Kit | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


New Slip Ring Assembly Meets the High-voltage Needs of Satellites

New Slip Ring Assembly Meets the High-voltage Needs of Satellites

The new component promises to triple the operational voltage of high-voltage satellites.


News Nov 07, 2022 by Jake Hertz
NorComp 172 D-Sub Connectors | Featured Product Spotlight

NorComp 172 D-Sub Connectors | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


Luminus Devices SFT-70X-WxS High Power White LEDs | Featured Product Spotlight

Luminus Devices SFT-70X-WxS High Power White LEDs | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


Is Assembly Language Still Relevant for Embedded Software Development?

Is Assembly Language Still Relevant for Embedded Software Development?

As embedded systems continue to evolve, you might wonder: should I learn assembly language for embedded software development? Learn the answer in this article.


TSMC Grants a Sweep of EDA Certifications for New Process Nodes

TSMC Grants a Sweep of EDA Certifications for New Process Nodes

To ensure that designers have the right tools for the job, TSMC announced a slew of EDA tool certifications for its most advanced processes—ranging from 3 nm nodes to 3D semiconductor integration.


News Nov 05, 2022 by Aaron Carman
Understanding CMRR and its Relationship With ADC Offset Error

Understanding CMRR and its Relationship With ADC Offset Error

Learn how variations of the common mode rejection ratio (CMRR) can affect an analog-to-digital converter's (ADC) performance.


Qualcomm and Vodafone Team for Next-gen 5G O-RAN Effort

Qualcomm and Vodafone Team for Next-gen 5G O-RAN Effort

The two companies will continue to collaborate on efforts to expand 5G Open Radio Access Network (RAN) across Europe.


News Nov 04, 2022 by Chantelle Dubois
Using 3D Electronic Component Models to Synch PCB and Enclosure Designs

Using 3D Electronic Component Models to Synch PCB and Enclosure Designs

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.


Ferroelectric RAM (F-RAM) Hits the Market With Infineon’s EXCELON Family

Ferroelectric RAM (F-RAM) Hits the Market With Infineon’s EXCELON Family

Infineon has announced a new family of ferroelectric RAM—an energy-efficient, non-volatile memory solution designed for data-critical applications.


News Nov 03, 2022 by Aaron Carman
Micron Ships its Advanced DRAM 1-beta Node, Targeting Mobile

Micron Ships its Advanced DRAM 1-beta Node, Targeting Mobile

Claiming it as the industry’s most advanced DRAM technology, Micron Technology has released its advanced 1-beta DRAM node.


News Nov 02, 2022 by Jake Hertz
Omron Electronics Automotive Relays | New Product Brief

Omron Electronics Automotive Relays | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Microchip PIC16F18056 & PIC16F18076 8-Bit Microcontrollers | Asia New Product Brief

Microchip PIC16F18056 & PIC16F18076 8-Bit Microcontrollers | Asia New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


How Close Are We to Quantum Commercialization?

How Close Are We to Quantum Commercialization?

While quantum hardware is making significant strides to market, the path to quantum commercialization still has numerous obstacles ahead.


News Nov 02, 2022 by Jake Hertz