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Semidynamics Provides All-In-One AI IP to Facilitate AI Chip Design

Semidynamics Provides All-In-One AI IP to Facilitate AI Chip Design

The All-In-One AI IP bundles a CPU, GPU, NPU—and Semidynamics' unique, in-house "Gazzillion Misses" technology—into a single subsystem.


News Apr 11, 2024 by Jake Hertz
Altera Infuses AI Into New Mid-Range FPGAs

Altera Infuses AI Into New Mid-Range FPGAs

Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.


News Apr 10, 2024 by Dale Wilson
AMD Announces Two New Adaptive SoCs for Faster Edge AI

AMD Announces Two New Adaptive SoCs for Faster Edge AI

At Embedded World 2024, AMD announced two new adaptive SoC chips targeting edge AI and high-load edge computing systems—both of which will be deployed in Subaru's Eyesight ADAS.


News Apr 10, 2024 by Duane Benson
Renesas Electronics RA8D1 Arm® Cortex®-M85 Microcontrollers | New Product Brief

Renesas Electronics RA8D1 Arm® Cortex®-M85 Microcontrollers | New Product Brief

Renesas Electronics RA8D1 Arm® Cortex®-M85 MCUs are high-performance graphics processors featuring the powerful Arm® Cortex®-M85 core with Helium technology, optimized for computationally intensive AI/ML tasks. Watch and learn all about their features, specs, applications, and more!


Infineon Levels Up Machine Learning Performance With Three New MCUs

Infineon Levels Up Machine Learning Performance With Three New MCUs

Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.


News Apr 05, 2024 by Jake Hertz
All About Circuits Looks Ahead at Embedded World 2024

All About Circuits Looks Ahead at Embedded World 2024

Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show in Nuremberg, Germany.


News Apr 03, 2024 by Jeff Child
Earthquake in Taiwan—Our Hearts Go Out to Those Impacted

Earthquake in Taiwan—Our Hearts Go Out to Those Impacted

The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.


A Q&A With Renowned Neuromorphic Chip Designer Chiara Bartolozzi

A Q&A With Renowned Neuromorphic Chip Designer Chiara Bartolozzi

For our final feature celebrating Women’s History Month, we interviewed Chiara Bartolozzi, a senior researcher moving the needle in neuromorphic engineering.


News Mar 29, 2024 by Ingrid Fadelli
With an Eye on On-Device AI, Qualcomm Rolls Out New Snapdragon SoC

With an Eye on On-Device AI, Qualcomm Rolls Out New Snapdragon SoC

The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.


News Mar 28, 2024 by Duane Benson
Nvidia Reveals Blackwell: The ‘World’s Most Powerful Chip’ for AI

Nvidia Reveals Blackwell: The ‘World’s Most Powerful Chip’ for AI

Nvidia took the GTC stage to unveil Blackwell, a platform built upon a 208 billion transistor, dual-die GPU with a 10 TB/s chip-to-chip interconnect.


News Mar 22, 2024 by Duane Benson
Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.


News Mar 13, 2024 by Duane Benson
State of the Industry: Semiconductor Insiders Discuss the Ambitions and Realities of the CHIPS Act

State of the Industry: Semiconductor Insiders Discuss the Ambitions and Realities of the CHIPS Act

The goal of the CHIPS Act is to invigorate US semiconductor manufacturing. Three leaders in the US semiconductor industry with unique perspectives join us to discuss: Will it work? Is it enough? And where should future investments go?


5 Electrical Engineering Research Projects Making Their Mark in 2024

5 Electrical Engineering Research Projects Making Their Mark in 2024

From 3D processors to self-powered sensors, these academic research projects show how "the next big thing" in electronics may emerge from labs worldwide.


News Mar 08, 2024 by Jake Hertz
Intel Spins Off Altera as Independent FPGA Supplier

Intel Spins Off Altera as Independent FPGA Supplier

Eight and a half years after acquiring Altera, Intel has spun off the FPGA division as an independent subsidiary.


News Mar 08, 2024 by Duane Benson
Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

We talked with Flux’s co-founders about their new partnership—announced today—with online electronic parts ecosystem firm Ultra Librarian.


News Mar 06, 2024 by Jeff Child
Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Ahead of the IEEE 1.6 TbE standard, Synopsys has developed a complete 1.6 T solution that includes multi-rate, multi-channel 1.6 T Ethernet MAC and PCS controllers, 224-G Ethernet PHY IP, and verification IP.


News Mar 05, 2024 by Jake Hertz
AMD Rolls Out Cost-Optimized FPGA Family

AMD Rolls Out Cost-Optimized FPGA Family

As FPGAs target more applications, AMD’s newest family—launched today—balances cost and power with performance.


News Mar 05, 2024 by Aaron Carman
Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Unveiled today, Renesas' new embedded AI processors significantly increase performance for vision-sensing devices while consuming less power than competitive alternatives.


News Feb 29, 2024 by Duane Benson
ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.


News Feb 28, 2024 by Jake Hertz
ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.


News Feb 23, 2024 by Aaron Carman