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AMD Announces Desktop Processors With the “Fastest Core in Gaming”

AMD Announces Desktop Processors With the “Fastest Core in Gaming”

AMD's much-anticipated Ryzen 7000 series is set for release Sept. 27.


News Sep 01, 2022 by Jake Hertz
Considerations for Choosing Edge ML Application Hardware

Considerations for Choosing Edge ML Application Hardware

As edge machine learning (ML) applications keep growing, EEs need to understand ML at the edge, especially concerning processing and processing hardware.


Chinese Startup Biren Technology Takes on NVIDIA in GPU Market

Chinese Startup Biren Technology Takes on NVIDIA in GPU Market

At Hot Chips 34, a new player entered the high-performance GPU market.


News Aug 31, 2022 by Jake Hertz
Electronic Component Aging—the Aging Effects of Resistors and Op-amps

Electronic Component Aging—the Aging Effects of Resistors and Op-amps

Learn about the aging behavior of resistors and amplifiers using temperature calculations and the Arrhenius equation to understand resistor drift, resistor stability, and op-amp drift.


Software Solutions Aim to Accelerate AI, Quantum, and GPU Processing

Software Solutions Aim to Accelerate AI, Quantum, and GPU Processing

With the goal of accelerating various types of advanced computing, including AI, GPU, and quantum processing, a variety of software solutions have recently been unveiled.


News Aug 26, 2022 by Ikimi .O
Intel GPU Muscles Up for Media Processing and the Visual Cloud

Intel GPU Muscles Up for Media Processing and the Visual Cloud

Optimized for media streaming, Intel’s new GPU family hopes to meet the video processing needs of data centers and the cloud.


News Aug 25, 2022 by Jake Hertz
NVIDIA Shares Details on Grace CPU and Hopper GPU at Hot Chips

NVIDIA Shares Details on Grace CPU and Hopper GPU at Hot Chips

At this year’s Hot Chips conference, NVIDIA shed more light on its newest computing flagship processors.


News Aug 24, 2022 by Jake Hertz
Hindered by Drama—Cubic Boron Arsenide Strikes to be “Best Semiconductor Ever”

Hindered by Drama—Cubic Boron Arsenide Strikes to be “Best Semiconductor Ever”

Another potential "superior" semiconductor hits the scene: cubic boron arsenide (c-BAs). However, more tests and funding are needed to see whether this semiconductor shifts from the lab to practical applications.


News Aug 23, 2022 by Biljana Ognenova
Researchers Worldwide Come Together on “NeuRRAM” Neuromorphic Chip

Researchers Worldwide Come Together on “NeuRRAM” Neuromorphic Chip

The teams have developed the first compute-in-memory chip to tackle a range of AI applications at lower energy and higher accuracy than other platforms.


News Aug 22, 2022 by Jake Hertz
Not Limited by Wavelength, OmniVision Shrinks Down to “World’s Smallest” Pixel

Not Limited by Wavelength, OmniVision Shrinks Down to “World’s Smallest” Pixel

OmniVision keeps shrinking the pixel size of its complementary metal-oxide semiconductor (CMOS) image sensors by introducing its latest sensor with the "world’s smallest" pixel size.


News Aug 17, 2022 by Jake Hertz
Intel Zeros in on Hardware Security with a Tunable Replica Circuit

Intel Zeros in on Hardware Security with a Tunable Replica Circuit

Intel is employing a new hardware security measure to mitigate the threat of physical fault injection attacks.


News Aug 16, 2022 by Jake Hertz
Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.


News Aug 16, 2022 by Jeff Child
In the Race for Quantum Supremacy, Researchers Claim to Pull Ahead of Google

In the Race for Quantum Supremacy, Researchers Claim to Pull Ahead of Google

New research from the Chinese Academy of Sciences may overtake Google’s 2019 claims of quantum supremacy.


News Aug 15, 2022 by Jake Hertz
Three’s a Crowd—YTMC Throws Its Own 3D NAND Into the Ring

Three’s a Crowd—YTMC Throws Its Own 3D NAND Into the Ring

Summer 2022 is turning out to be a hot one for the memory industry, with not just one, not just two, but three announcements from chipmakers relating to advanced 3D NAND production.


News Aug 10, 2022 by Chantelle Dubois
Take Our 2022 EETech Global Engineering Survey

Take Our 2022 EETech Global Engineering Survey

Join your engineering community peers and take our EETech 2022 Global Engineering Survey. You’ll get a summary of the results once they’re released. And you’ll be entered for a chance to win an Amazon card prize!


News Aug 09, 2022 by Jeff Child
Renesas Takes a Swing at HMIs With Octal-SPI and RTOS-supported MPUs

Renesas Takes a Swing at HMIs With Octal-SPI and RTOS-supported MPUs

The new MPU family hopes to address traditional challenges in the design of HMI systems.


News Aug 08, 2022 by Jake Hertz
ToF Sensors Land Roles in PCs, Smart Door Locks, and More

ToF Sensors Land Roles in PCs, Smart Door Locks, and More

A new wave of time-of-flight (ToF) sensors are finding use in applications such as PCs, smart door lock facial recognition, 3D image sensing, and more.


The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

Last week, Micron launched the production of a 232-layer 3D NAND. Now, SK hynix is claiming "highest 4D NAND flash" at 238 layers.


News Aug 05, 2022 by Jake Hertz
iPronics Launches an Era of Programmable Photonic Processors

iPronics Launches an Era of Programmable Photonic Processors

iPronics is bringing FPGA concepts to the world of photonics.


News Aug 03, 2022 by Jake Hertz
The Fate of the Leap Second Hangs in the Balance

The Fate of the Leap Second Hangs in the Balance

Many of the largest names in tech—including Meta—are rallying against the leap second. How can just one second affect operating systems?


News Aug 02, 2022 by Chantelle Dubois