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MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT’s experimental fusion reactor, Alcator C-Mod, breaks the plasma pressure record on its last day of operation.


News Oct 26, 2016 by Dr. Steve Arar
C-BISCUIT: Layout and Assembly for the Robot Control Board

C-BISCUIT: Layout and Assembly for the Robot Control Board

We’ll discuss some important layout and manufacturing concepts as we look at the PCB for the Robot Control Board.


Projects Oct 25, 2016 by Robert Keim
Silicon Carbide Chips Kickstart a New Era in Power Electronics

Silicon Carbide Chips Kickstart a New Era in Power Electronics

SiC devices—both diodes and transistors—are making inroads in automotive, energy, and industrial environments amid high-power handling capability and power loss savings.


News Oct 24, 2016 by Majeed Ahmad
Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Researchers at Stanford University have developed a low-cost plastic material which keeps the wearer much cooler than the conventional textiles.


News Oct 17, 2016 by Dr. Steve Arar
Industrial Instrumentation and Control: An Introduction to the Basic Principles

Industrial Instrumentation and Control: An Introduction to the Basic Principles

In part one of this instrumentation and control (I & C) series, we'll go over the fundamental terminology and concepts used when working with industrial plants.


Teardown Tuesday: Thermal Camera

Teardown Tuesday: Thermal Camera

In this Teardown Tuesday, we are going to take a look at the insides of an inexpensive thermal camera.


News Sep 13, 2016 by Alex Udanis
3D Printing Filaments: HT vs PLA Final Overview

3D Printing Filaments: HT vs PLA Final Overview

Results of testing the filament under both heat and shock, as well as a final overview of the tests.


News Sep 11, 2016 by Michael Greer
HT vs PLA Filament for High-Temperature 3D Printing

HT vs PLA Filament for High-Temperature 3D Printing

In this article, we compare the thermal and structural properties of high-temperature filament.


News Sep 10, 2016 by Michael Greer
Working with High-Temperature 3D Printer Filaments

Working with High-Temperature 3D Printer Filaments

An overview and basic testing knowledge of high-temperature printer filaments.


News Aug 27, 2016 by Michael Greer
Measuring Temperature with an NTC Thermistor

Measuring Temperature with an NTC Thermistor

For this article, we are only concerned with one type of sensor that can measure temperature. This sensor is called a thermistor.


Projects Aug 15, 2016 by Joseph Corleto
A Walkthrough of the Texas Instruments WEBENCH

A Walkthrough of the Texas Instruments WEBENCH

TI offers a variety of design tools. The WEBENCH Power Designer provides end to end solutions for your single and multiple power design needs.


News Aug 06, 2016 by Mark Hughes
Stencil Design for Exposed-Pad Packages

Stencil Design for Exposed-Pad Packages

A properly designed solder stencil helps to ensure successful reflow soldering with IC packages that have an exposed thermal pad.


Thermal Design with Exposed-Pad Packages

Thermal Design with Exposed-Pad Packages

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad.


Feel the Heat in VR with These Haptic Feedback Gloves

Feel the Heat in VR with These Haptic Feedback Gloves

Gloveone is a virtual reality company that is using gloves instead of the traditional headset to allow users to touch and feel virtual objects.


News Jul 08, 2016 by Donald Krambeck
The How and Why of Energy Harvesting for Low-Power Applications

The How and Why of Energy Harvesting for Low-Power Applications

Harvesting energy from non-conventional sources has received an increased interest as designers look for alternative power sources. Even though the power is usually harvested in small amounts, it is adequate for various low-power applications.


Silicon Could Be Key to Making Diamond Semiconductors a Reality

Silicon Could Be Key to Making Diamond Semiconductors a Reality

Researchers from the University of Texas at Arlington and the University of Wisconsin-Madison have made a collective discovery in a new method for doping diamonds


News Jun 06, 2016 by Zabrel Holsman
One Step Closer to Wearable Flexible Electronics

One Step Closer to Wearable Flexible Electronics

A Research team at Penn State lead by Professor Qing Wang has developed the first dielectric that can restore multiple functions after multiple breaks


News May 21, 2016 by Zabrel Holsman
The Future of 2D Memory Semiconductors: Atomically Thin Low-Heat Data Storage

The Future of 2D Memory Semiconductors: Atomically Thin Low-Heat Data Storage

A research team consisting of Stanford and NMSU engineers may have found a material capable of revolutionizing the 2D memory semiconductor market.


News May 16, 2016 by Zabrel Holsman
Nanoscale Heat Transfer 100 Times Stronger Than Previously Thought

Nanoscale Heat Transfer 100 Times Stronger Than Previously Thought

A new breakthrough in nanoscale heat transfer may redefine what was once thought possible by conventional thermal radiation laws.


News Apr 05, 2016 by Zabrel Holsman
Ten Ways to Design for Intrinsic Safety

Ten Ways to Design for Intrinsic Safety

How to build electronic devices when a higher degree of safety is required.