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Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.


News Jan 25, 2017 by Chantelle Dubois
3D-Printed Embedded Electronics Make this Drone Ready to Fly Straight out of the Printer

3D-Printed Embedded Electronics Make this Drone Ready to Fly Straight out of the Printer

This 3D-printed drone features built-in printed electronics.


News Jan 20, 2017 by Robin Mitchell
Calculating the Lifespan of Electrolytic Capacitors with De-Rating

Calculating the Lifespan of Electrolytic Capacitors with De-Rating

Aluminum electrolytic capacitors have a reputation as having a short life expectancy and being unreliable...but are they really that much worse than other types of capacitor?


News Dec 26, 2016 by David Williams
A Robot that Sweats? Engineers Try Bio-Inspired Heat Management

A Robot that Sweats? Engineers Try Bio-Inspired Heat Management

Researchers have designed a humanoid robot which sweats water through its metal frame to cool itself.


News Dec 12, 2016 by Dr. Steve Arar
Gold-Coated DNA Nanowires Could Power Genetic Computing

Gold-Coated DNA Nanowires Could Power Genetic Computing

A team of scientists in Germany have created genetic nanostructures that could be the key to genetic computers.


News Dec 01, 2016 by Robin Mitchell
Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.


News Nov 23, 2016 by Robin Mitchell
Why the Future of Data Centers Could Be in the Oceans

Why the Future of Data Centers Could Be in the Oceans

Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging them under water.


News Nov 11, 2016 by Robin Mitchell
MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT’s experimental fusion reactor, Alcator C-Mod, breaks the plasma pressure record on its last day of operation.


News Oct 26, 2016 by Dr. Steve Arar
C-BISCUIT: Layout and Assembly for the Robot Control Board

C-BISCUIT: Layout and Assembly for the Robot Control Board

We’ll discuss some important layout and manufacturing concepts as we look at the PCB for the Robot Control Board.


Projects Oct 25, 2016 by Robert Keim
Silicon Carbide Chips Kickstart a New Era in Power Electronics

Silicon Carbide Chips Kickstart a New Era in Power Electronics

SiC devices—both diodes and transistors—are making inroads in automotive, energy, and industrial environments amid high-power handling capability and power loss savings.


News Oct 24, 2016 by Majeed Ahmad
Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Researchers at Stanford University have developed a low-cost plastic material which keeps the wearer much cooler than the conventional textiles.


News Oct 17, 2016 by Dr. Steve Arar
Industrial Instrumentation and Control: An Introduction to the Basic Principles

Industrial Instrumentation and Control: An Introduction to the Basic Principles

In part one of this instrumentation and control (I & C) series, we'll go over the fundamental terminology and concepts used when working with industrial plants.


Teardown Tuesday: Thermal Camera

Teardown Tuesday: Thermal Camera

In this Teardown Tuesday, we are going to take a look at the insides of an inexpensive thermal camera.


News Sep 13, 2016 by Alex Udanis
3D Printing Filaments: HT vs PLA Final Overview

3D Printing Filaments: HT vs PLA Final Overview

Results of testing the filament under both heat and shock, as well as a final overview of the tests.


News Sep 11, 2016 by Michael Greer
HT vs PLA Filament for High-Temperature 3D Printing

HT vs PLA Filament for High-Temperature 3D Printing

In this article, we compare the thermal and structural properties of high-temperature filament.


News Sep 10, 2016 by Michael Greer
Working with High-Temperature 3D Printer Filaments

Working with High-Temperature 3D Printer Filaments

An overview and basic testing knowledge of high-temperature printer filaments.


News Aug 27, 2016 by Michael Greer
Measuring Temperature with an NTC Thermistor

Measuring Temperature with an NTC Thermistor

For this article, we are only concerned with one type of sensor that can measure temperature. This sensor is called a thermistor.


Projects Aug 15, 2016 by Joseph Corleto
A Walkthrough of the Texas Instruments WEBENCH

A Walkthrough of the Texas Instruments WEBENCH

TI offers a variety of design tools. The WEBENCH Power Designer provides end to end solutions for your single and multiple power design needs.


News Aug 06, 2016 by Mark Hughes
Stencil Design for Exposed-Pad Packages

Stencil Design for Exposed-Pad Packages

A properly designed solder stencil helps to ensure successful reflow soldering with IC packages that have an exposed thermal pad.


Thermal Design with Exposed-Pad Packages

Thermal Design with Exposed-Pad Packages

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad.