The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from Kneron that claims to bring the capacity for…
The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from Kneron that claims to bring the capacity for autonomous driving capabilities to any vehicle.
A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their…
A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.
With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in…
With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max,…
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max, claim more than 2x the performance of the M1.
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to…
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and…
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will…
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will combine a wide range of semiconductors on a single 3D IC.
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end…
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end computing markets.
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years…
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few…
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC…
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and…
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and design tradeoffs.
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design.…
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the…
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.
In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space…
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Facebook
Google
GitHub
Linkedin