Industries like aerospace and defense are only raising the bar on IC requirements. Here are a few recently announced tools helping IC designers meet the task.
Industries like aerospace and defense are only raising the bar on IC requirements. Here are a few recently announced tools helping IC designers meet the task.
A new transistor architecture from IBM and Samsung may revitalize Moore’s law.
A new transistor architecture from IBM and Samsung may revitalize Moore’s law.
Seeing these advantages of using field programmable gate array (FPGA) technology, this week is Intel's FPGA Day, which…
Seeing these advantages of using field programmable gate array (FPGA) technology, this week is Intel's FPGA Day, which just announced a collab to further FPGA-based infrastructure processing units (IPUs).
Quantum technology has been a booming industry, with companies and researchers alike trying to push it to a mainstream…
Quantum technology has been a booming industry, with companies and researchers alike trying to push it to a mainstream level. Hoping to do just that, Oxford Instruments Nanoscience is partnering with three new projects.
In the past few weeks, big names like Samsung and Tesla have been flocking to establish fabs in the Lone Star state. What…
In the past few weeks, big names like Samsung and Tesla have been flocking to establish fabs in the Lone Star state. What about Texas is drawing in hardware heavy hitters?
Scientific complementary metal-oxide-semiconductor (sCMOS), a type of CMOS image sensor (CIS) with stringent noise…
Scientific complementary metal-oxide-semiconductor (sCMOS), a type of CMOS image sensor (CIS) with stringent noise specifications, appears to be entering its 4th generation era in 2021.
The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from…
The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from Kneron that claims to bring the capacity for autonomous driving capabilities to any vehicle.
A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their…
A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.
With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in…
With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max,…
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max, claim more than 2x the performance of the M1.
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to…
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and…
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will…
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will combine a wide range of semiconductors on a single 3D IC.
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end…
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end computing markets.
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years…
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few…
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC…
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and…
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and design tradeoffs.
Facebook
Google
GitHub
Linkedin