At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC…
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and…
In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and design tradeoffs.
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design.…
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the…
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.
In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space…
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips…
In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips with 50 billion transistors apiece and the heir apparent to the age of FinFETs.
Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the…
Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the transistor punch from 1.2 trillion to 2.6 trillion.
In this series of articles, we’ll discuss one of the fundamental building blocks of analog IC design: the…
In this series of articles, we’ll discuss one of the fundamental building blocks of analog IC design: the switched-capacitor circuit.
This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations…
This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?
Intel has released a new processor for data center applications. How does this new x86 processor look compared to other…
Intel has released a new processor for data center applications. How does this new x86 processor look compared to other processor advancements?
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline…
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.
ADAS innovation happens at the chip level. Here are the big-name players honing in on autonomous SoCs to advance the…
ADAS innovation happens at the chip level. Here are the big-name players honing in on autonomous SoCs to advance the possibility of self-driving cars.
GlobalFoundries, SK Hynix, and Intel have all announced plans to either break ground on new manufacturing plants or…
GlobalFoundries, SK Hynix, and Intel have all announced plans to either break ground on new manufacturing plants or expand existing operations.
The European Commission has set an ambitious target: to double last year's production of computer chips in the European…
The European Commission has set an ambitious target: to double last year's production of computer chips in the European Union by 2030.
Renesas has released three new ICs in its communication timing portfolio to help alleviate the burden of 5G timing constraints.
Renesas has released three new ICs in its communication timing portfolio to help alleviate the burden of 5G timing constraints.
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