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New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.


News Jul 15, 2021 by Adrian Gibbons
A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.


News Jun 25, 2021 by Adrian Gibbons
Entering the Era of AI IC Design: Where Do EEs Fit In?

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?


News Jun 25, 2021 by Jake Hertz
An Introduction to Physically Unclonable Functions

An Introduction to Physically Unclonable Functions

In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.


From CMOS to Batteries: Past Space Tech Improved Earth Applications

From CMOS to Batteries: Past Space Tech Improved Earth Applications

Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.


News May 19, 2021 by Tyler Charboneau
Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.


News May 10, 2021 by Adrian Gibbons
IBM’s 2 nm Chip Dazzles with 50 Billion Transistors in Tiny Package

IBM’s 2 nm Chip Dazzles with 50 Billion Transistors in Tiny Package

In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips with 50 billion transistors apiece and the heir apparent to the age of FinFETs.


News May 06, 2021 by Kate Smith
Mega Chip Packs 2.6 Trillion Transistors on One Huge Piece of Silicon

Mega Chip Packs 2.6 Trillion Transistors on One Huge Piece of Silicon

Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the transistor punch from 1.2 trillion to 2.6 trillion.


News Apr 22, 2021 by Jake Hertz
An Introduction to Switched-capacitor Circuits

An Introduction to Switched-capacitor Circuits

In this series of articles, we’ll discuss one of the fundamental building blocks of analog IC design: the switched-capacitor circuit.


Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?


News Apr 18, 2021 by Jake Hertz
x86, Arm, and the Reach for Computing Supremacy

x86, Arm, and the Reach for Computing Supremacy

Intel has released a new processor for data center applications. How does this new x86 processor look compared to other processor advancements?


News Apr 16, 2021 by Rushi Patel
Why Physical Verification Is Only Getting Tougher With Advanced Nodes

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.


Tech Giants Enter Their Chips in the Race for Self-driving Cars

Tech Giants Enter Their Chips in the Race for Self-driving Cars

ADAS innovation happens at the chip level. Here are the big-name players honing in on autonomous SoCs to advance the possibility of self-driving cars.


News Apr 08, 2021 by Luke James
New Fabs Crop Up Globally in 2021 as Chip Crisis Continues

New Fabs Crop Up Globally in 2021 as Chip Crisis Continues

GlobalFoundries, SK Hynix, and Intel have all announced plans to either break ground on new manufacturing plants or expand existing operations.


News Apr 04, 2021 by Luke James
“The Space Race of Our Time:” EU Follows U.S. and China’s Dash for Domestic Chips

“The Space Race of Our Time:” EU Follows U.S. and China’s Dash for Domestic Chips

The European Commission has set an ambitious target: to double last year's production of computer chips in the European Union by 2030.


News Mar 30, 2021 by Luke James
It’s All About the Timing: 5G Brings Timing Synchronization Burdens

It’s All About the Timing: 5G Brings Timing Synchronization Burdens

Renesas has released three new ICs in its communication timing portfolio to help alleviate the burden of 5G timing constraints.


News Mar 25, 2021 by Jake Hertz
Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Intel veteran Uri Frank has been hired by Google as its new VP of engineering for server chip design. What does this mean for Google's custom silicon?


News Mar 24, 2021 by Jake Hertz
Scaling Down to 3nm Will Require Advances in Fabrication Technology

Scaling Down to 3nm Will Require Advances in Fabrication Technology

Keeping up with Moore's law at semiconductor fabs is not only an economic struggle. It's an issue of process control technology, too.


News Mar 17, 2021 by Jake Hertz
Apple Settles on Munich for Its European IC Design Center

Apple Settles on Munich for Its European IC Design Center

In an effort to solidify its European presence and expand wireless technologies, Apple will soon break ground on a new silicon design center in Germany.


News Mar 17, 2021 by Luke James
Scientists Reimagine Organic Transistors for Low-power, High-amplification Biowearables

Scientists Reimagine Organic Transistors for Low-power, High-amplification Biowearables

Scientists at the Terasaki Institute have put their own spin on organic electrochemical transistors (OECTs) to improve the performance in wearable health devices.


News Mar 12, 2021 by Jake Hertz