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Introduction to the Advanced Extensible Interface (AXI)

Introduction to the Advanced Extensible Interface (AXI)

This article will introduce the Advanced Extensible Interface (AXI), an extension of AMBA.


STMicroelectronics Unveils New Series of Secure Payment SoCs

STMicroelectronics Unveils New Series of Secure Payment SoCs

ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.


News Oct 17, 2019 by Gary Elinoff
The Relationship Between Rise Time and Bandwidth in Digital Signals

The Relationship Between Rise Time and Bandwidth in Digital Signals

In this article, we’ll look at the relationship between the rise/fall time of a digital signal and its bandwidth.


IoT Roundup: New Wireless Protocols Extend Coverage and Memory

IoT Roundup: New Wireless Protocols Extend Coverage and Memory

As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.


News Oct 10, 2019 by Hannah DeTavis
Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.


News Oct 08, 2019 by Gary Elinoff
Arm TechCon 2019 Explores the Convergence of AI, 5G, and IoT

Arm TechCon 2019 Explores the Convergence of AI, 5G, and IoT

Arm TechCon begins today in San Jose, CA. Here's what you need to know.


News Oct 08, 2019 by Gary Elinoff
Via Configurations for Connecting Decoupling Capacitors

Via Configurations for Connecting Decoupling Capacitors

In this article, we’ll focus on the different via configurations that can be used to connect a decoupling capacitor to the PCB power and ground planes.


PCB Thermal Management Techniques

PCB Thermal Management Techniques

This article will discuss design practices that ensure better thermal management, including some common methods for removing excess heat from a PCB.


Semtech Aims for Smart Homes and Smart Buildings with a New LoRa-based Corecell Reference Design

Semtech Aims for Smart Homes and Smart Buildings with a New LoRa-based Corecell Reference Design

Semtech’s LoRa Corecell reduces power consumption and conserves board space for indoor gateway applications.


News Oct 04, 2019 by Gary Elinoff
Analog Devices Inc. Smart Energy Harvesting FCI Design | New Product Brief

Analog Devices Inc. Smart Energy Harvesting FCI Design | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


The Importance of Advanced ERC in Circuit Design

The Importance of Advanced ERC in Circuit Design

This article introduces and explores advanced ERC, highlighting its differences from traditional ERC and discussing how it can help create better circuit designs.


The Journey of RISC-V Implementation

The Journey of RISC-V Implementation

In this article, Western Digital's Ted Marena explores the reasons companies have and the process they go through when integrating the open process instruction set architecture RISC-V.


Synopsys and NSITEXE Partnership Finds Success with Accelerated Processor SoC Development

Synopsys and NSITEXE Partnership Finds Success with Accelerated Processor SoC Development

NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.


News Sep 09, 2019 by Gary Elinoff
Meeting ASIL Compliance for ADAS with an Integrated SoC Power System Monitor

Meeting ASIL Compliance for ADAS with an Integrated SoC Power System Monitor

This article looks at the safety standard that governs ADAS features and the challenge in designing power monitoring systems to comply with this standard while introducing an automotive power monitor that has been certified to meet this standard.


Firmware Enables Gas Sensors to Personalize Monitoring Services

Firmware Enables Gas Sensors to Personalize Monitoring Services

A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms.


News Sep 05, 2019 by Majeed Ahmad
Common PCB Stackups for a Four-Layer Board

Common PCB Stackups for a Four-Layer Board

This article looks at the common options for a four-layer board stackup.


TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.


News Aug 29, 2019 by Gary Elinoff
Xilinx Claims Title of “World’s Largest FPGA” with New VU19P

Xilinx Claims Title of “World’s Largest FPGA” with New VU19P

Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.


News Aug 28, 2019 by Gary Elinoff
A Clever Oscillator Circuit You’ve Probably Never Heard of: The Sulzer Network

A Clever Oscillator Circuit You’ve Probably Never Heard of: The Sulzer Network

Learn about the Sulzer network, an alternative to classic R-C networks that is easier to tune over wide frequency ranges.


Special Topics in Schematic Capture

Special Topics in Schematic Capture

Learn about heterogeneous and homogenous buses, special IC packages, and more!