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Recent FPGAs Designed for C++ and Python, Harsh Environments, and ASIC Prototyping

Recent FPGAs Designed for C++ and Python, Harsh Environments, and ASIC Prototyping

These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.


News Nov 23, 2019 by Robin Mitchell
How Automated CDC Protocol Verification Accelerates Testing Processes

How Automated CDC Protocol Verification Accelerates Testing Processes

This article describes a methodology that automates set up, constraints, and results analysis as designs move from static CDC analysis to formal verification to simulation and avoid manual scripting efforts, thus reducing setup effort and errors.


Understanding Collector Current in BJT Beta Variations

Understanding Collector Current in BJT Beta Variations

This article looks at factors that can alter the functionality of a bipolar junction transistor (BJT) by causing variations in its forward current gain.


Google Launches Open-Source OpenTitan Project for Silicon Root of Trust Chips

Google Launches Open-Source OpenTitan Project for Silicon Root of Trust Chips

Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.


News Nov 08, 2019 by Cabe Atwell
Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.


News Nov 04, 2019 by Robin Mitchell
Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.


News Nov 01, 2019 by Lisa Boneta.
Obtaining Convergence for High-Q XTAL Oscillators

Obtaining Convergence for High-Q XTAL Oscillators

Learn a method of attaining convergence when simulating very high Q crystal oscillators using Cadence’s Virtuoso Periodic Steady State (PSS) analysis.


Maxim Integrated Optical Bio-Sensor | New Product Brief

Maxim Integrated Optical Bio-Sensor | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Oct 28, 2019 by Mouser
Melexis Announces Pressure Sensing IC for Engine EVAP Systems

Melexis Announces Pressure Sensing IC for Engine EVAP Systems

The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.


News Oct 23, 2019 by Gary Elinoff
Determining Copper Trace Thickness in PCB Design

Determining Copper Trace Thickness in PCB Design

This article discusses the issues surrounding trace-width calculation and provides a solid foundation for designing your next high-current net.


X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.


News Oct 18, 2019 by Gary Elinoff
Introduction to the Advanced Extensible Interface (AXI)

Introduction to the Advanced Extensible Interface (AXI)

This article will introduce the Advanced Extensible Interface (AXI), an extension of AMBA.


STMicroelectronics Unveils New Series of Secure Payment SoCs

STMicroelectronics Unveils New Series of Secure Payment SoCs

ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.


News Oct 17, 2019 by Gary Elinoff
The Relationship Between Rise Time and Bandwidth in Digital Signals

The Relationship Between Rise Time and Bandwidth in Digital Signals

In this article, we’ll look at the relationship between the rise/fall time of a digital signal and its bandwidth.


IoT Roundup: New Wireless Protocols Extend Coverage and Memory

IoT Roundup: New Wireless Protocols Extend Coverage and Memory

As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.


News Oct 10, 2019 by Hannah DeTavis
Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.


News Oct 08, 2019 by Gary Elinoff
Arm TechCon 2019 Explores the Convergence of AI, 5G, and IoT

Arm TechCon 2019 Explores the Convergence of AI, 5G, and IoT

Arm TechCon begins today in San Jose, CA. Here's what you need to know.


News Oct 08, 2019 by Gary Elinoff
Via Configurations for Connecting Decoupling Capacitors

Via Configurations for Connecting Decoupling Capacitors

In this article, we’ll focus on the different via configurations that can be used to connect a decoupling capacitor to the PCB power and ground planes.


PCB Thermal Management Techniques

PCB Thermal Management Techniques

This article will discuss design practices that ensure better thermal management, including some common methods for removing excess heat from a PCB.


Semtech Aims for Smart Homes and Smart Buildings with a New LoRa-based Corecell Reference Design

Semtech Aims for Smart Homes and Smart Buildings with a New LoRa-based Corecell Reference Design

Semtech’s LoRa Corecell reduces power consumption and conserves board space for indoor gateway applications.


News Oct 04, 2019 by Gary Elinoff