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ST Praises Power Management IC for Saving Board Space, BOM, & Power

ST Praises Power Management IC for Saving Board Space, BOM, & Power

ST’s STPMIC1 is both a general-purpose system power management device and a companion chip for the STM32MP1 microprocessor.


News Dec 10, 2019 by Gary Elinoff
Littelfuse 8.0SMDJ TVS Diodes | New Product Brief

Littelfuse 8.0SMDJ TVS Diodes | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


NIC Components’ SMT Power Inductors Built to Operate Up to +155°C

NIC Components’ SMT Power Inductors Built to Operate Up to +155°C

The NPIM_PE series are automotive-grade metal composite SMT power inductors with an operating temperature range of ‐55°C to +155°C.


News Nov 20, 2019 by Cabe Atwell
Würth Elektronik Surface Mount Solderable Gaskets | New Product Brief

Würth Elektronik Surface Mount Solderable Gaskets | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


New Connectors Around the Market Described as Light Weight, Durable, and Water Resistant

New Connectors Around the Market Described as Light Weight, Durable, and Water Resistant

Here are some connectors around the industry that can endure harsh environments, save PCB space, and withstand water exposure.


News Nov 16, 2019 by Robin Mitchell
GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.


News Nov 11, 2019 by Gary Elinoff
Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.


News Nov 08, 2019 by Gary Elinoff
Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.


News Nov 07, 2019 by Gary Elinoff
Microchip Curiosity Development Board | New Product Brief

Microchip Curiosity Development Board | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Determining Copper Trace Thickness in PCB Design

Determining Copper Trace Thickness in PCB Design

This article discusses the issues surrounding trace-width calculation and provides a solid foundation for designing your next high-current net.


Amphenol ICC OSFP Interconnect System | New Product Brief

Amphenol ICC OSFP Interconnect System | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Toshiba CUHSxx Schottky Barrier Diodes | New Product Brief

Toshiba CUHSxx Schottky Barrier Diodes | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.


News Oct 08, 2019 by Gary Elinoff
Via Configurations for Connecting Decoupling Capacitors

Via Configurations for Connecting Decoupling Capacitors

In this article, we’ll focus on the different via configurations that can be used to connect a decoupling capacitor to the PCB power and ground planes.


PCB Thermal Management Techniques

PCB Thermal Management Techniques

This article will discuss design practices that ensure better thermal management, including some common methods for removing excess heat from a PCB.


AVX Wire-to-Board Insulation Displacement Connectors | New Product Brief

AVX Wire-to-Board Insulation Displacement Connectors | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Microchip Technology Temperature Sensor Evaluation Board | New Product Brief

Microchip Technology Temperature Sensor Evaluation Board | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


The Importance of Advanced ERC in Circuit Design

The Importance of Advanced ERC in Circuit Design

This article introduces and explores advanced ERC, highlighting its differences from traditional ERC and discussing how it can help create better circuit designs.


STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.


News Sep 13, 2019 by Gary Elinoff
Common PCB Stackups for a Four-Layer Board

Common PCB Stackups for a Four-Layer Board

This article looks at the common options for a four-layer board stackup.