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Researchers Trap Light and Sound on a Chip, Adding to Photonic Toolbox

Researchers Trap Light and Sound on a Chip, Adding to Photonic Toolbox

Researchers have developed a new technique to trap light and sound in waveguides to manipulate light in large-scale circuits.


News Oct 18, 2022 by Darshil Patel
“Eavesdropping” Side-channel Attack Can Spy Through Phone Vibrations

“Eavesdropping” Side-channel Attack Can Spy Through Phone Vibrations

Using mmWave radar technology, Penn State researchers recently discovered how to tap into mobile vibrations to eavesdrop remotely.


News Oct 14, 2022 by Jake Hertz
Intel Joins DARPA’s Program to Build LEO Satellite Network

Intel Joins DARPA’s Program to Build LEO Satellite Network

DARPA has tapped Intel to develop a low-cost link between current and future satellite constellations—effectively creating a "universal translator."


News Oct 13, 2022 by Aaron Carman
Design and Selection of Magnetic ICM Modules to Ease Ethernet EMI/EMC Challenges

Design and Selection of Magnetic ICM Modules to Ease Ethernet EMI/EMC Challenges

Learn some of the high-level basics of magnetic integrated connector modules (ICMs), some of the tasks they are used to accomplish, and look at an example product from Bel Fuse.


Matter 1.0 is Officially Here to Connect a Fragmented Smart Home

Matter 1.0 is Officially Here to Connect a Fragmented Smart Home

The long-awaited Matter 1.0 standard has finally been released by the Connectivity Standards Alliance (CSA).


News Oct 05, 2022 by Jake Hertz
Helium, “the People’s Network,” Rises Among Low-power IoT Protocols

Helium, “the People’s Network,” Rises Among Low-power IoT Protocols

Scalable, long-range, and blockchain-integrated, Helium is attracting attention in the world of low-power IoT protocols.


News Oct 04, 2022 by Aaron Carman
RF Module Eyes IoT Networking Using Satellite Comms

RF Module Eyes IoT Networking Using Satellite Comms

Seeking to enable IoT device communication via satellites, Astrocast and CEA have teamed up on a new RF module.


News Oct 01, 2022 by Jake Hertz
Point2 Extends the Reach of 5G by 40 km in New Reference Design

Point2 Extends the Reach of 5G by 40 km in New Reference Design

The reference design features a new SoC with proprietary electronic dispersion compensation (EDC) capabilities.


News Sep 30, 2022 by Jake Hertz
IMEC Aims to Strengthen Next-gen Optical Networks With TIA Chip

IMEC Aims to Strengthen Next-gen Optical Networks With TIA Chip

With their transimpedance amplifier (TIA) chip, IMEC researchers offer a key technology for ensuring high reliability in 100G passive optical networks (PONs).


News Sep 29, 2022 by Jake Hertz
Silicon Labs’ SoCs Grow Protocol Support—Adding Wi-SUN, Wi-Fi 6, and More

Silicon Labs’ SoCs Grow Protocol Support—Adding Wi-SUN, Wi-Fi 6, and More

The Internet of Things will have a much larger scope thanks to recently-announced products from Silicon Labs.


News Sep 27, 2022 by Aaron Carman
CEVA Serves Up ASIC IP Platform for 5G O-RAN Designs

CEVA Serves Up ASIC IP Platform for 5G O-RAN Designs

Aiming to ease the challenges of 5G Open RAN (O-RAN) system designs, CEVA has unveiled a baseband IP platform for 5G RAN ASICs.


News Sep 26, 2022 by Jake Hertz
iWave Systems Doubles Down With Latest SoMs Using Xilinx and Intel SoCs

iWave Systems Doubles Down With Latest SoMs Using Xilinx and Intel SoCs

The world of embedded systems keeps expanding as iWave Systems employs the FPGAs and SoCs from leading manufacturers to launch small form factor systems on modules (SoMs).


News Sep 17, 2022 by Abdulwaliy Oyekunle
Researchers Achieve Wireless Power Transfer Nearly 100 Feet Using Laser

Researchers Achieve Wireless Power Transfer Nearly 100 Feet Using Laser

Recent research on wireless power transfer technology could transmit power across a room, enabling a wide array of charging applications.


News Sep 15, 2022 by Arjun Nijhawan
Molex On-Metal Wi-Fi Antenna | Asia New Product Brief

Molex On-Metal Wi-Fi Antenna | Asia New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Wi-Fi 7 Solutions Gear Up for Next-gen System Designs

Wi-Fi 7 Solutions Gear Up for Next-gen System Designs

With Wi-Fi 7 on the horizon, silicon vendors have already started introducing solutions supporting the new Wi-Fi specifications.


News Sep 10, 2022 by Darshil Patel
H-bridge DC Motor Control Using Complementary PWM, Shoot-through, and Dead-time

H-bridge DC Motor Control Using Complementary PWM, Shoot-through, and Dead-time

Learn about the role of non-overlapping or complementary pulse width modulation (PMW) in DC motor control using an h-bridge circuit, taking into consideration PWM shoot-through and dead-time PWM.


Nordic Semiconductor Rolls Out Its First Wi-Fi IC

Nordic Semiconductor Rolls Out Its First Wi-Fi IC

Complementing its existing wireless IoT offerings, Nordic Semiconductor has unveiled a dual-band Wi-Fi 6 companion chip.


News Aug 22, 2022 by Jake Hertz
GaN Transistors Race Beyond Performance Limits as New Products Roll

GaN Transistors Race Beyond Performance Limits as New Products Roll

As gallium nitride (GaN) technology gathers steam, new GaN transistor products are emerging to satisfy today’s engineering needs.


News Aug 09, 2022 by Jake Hertz
Messages From Underwater: Researchers Reveal Two Water-Air Communication Methods

Messages From Underwater: Researchers Reveal Two Water-Air Communication Methods

Back in 2018, MIT broke the water-air wireless communication barrier. Now, a team at KIT has transmitted messages in a novel way from the Titanic.


News Aug 08, 2022 by Chantelle Dubois
The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

Last week, Micron launched the production of a 232-layer 3D NAND. Now, SK hynix is claiming "highest 4D NAND flash" at 238 layers.


News Aug 05, 2022 by Jake Hertz