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Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.


News Nov 07, 2019 by Gary Elinoff
Wind River Systems Announces New Version of Simics for Stronger Cybersecurity and DevOps

Wind River Systems Announces New Version of Simics for Stronger Cybersecurity and DevOps

The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.


News Nov 06, 2019 by Lisa Boneta.
TE’s New Multi-Sensor Module Geared to Push Smart Devices to Market Faster

TE’s New Multi-Sensor Module Geared to Push Smart Devices to Market Faster

The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.


News Nov 06, 2019 by Gary Elinoff
New ams Color Sensor Designed to Eliminate Flicker in Rolling Shutter Sensors

New ams Color Sensor Designed to Eliminate Flicker in Rolling Shutter Sensors

The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.


News Nov 05, 2019 by Gary Elinoff
TI Rolls Out New ADC for Improved Voice Capture in Noisy, Far-field Environments

TI Rolls Out New ADC for Improved Voice Capture in Noisy, Far-field Environments

TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.


News Nov 05, 2019 by Lisa Boneta.
Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.


News Nov 04, 2019 by Robin Mitchell
Reader Question: How Do You Use Modules and Modular Design?

Reader Question: How Do You Use Modules and Modular Design?

Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?


News Nov 02, 2019 by Kate Smith
Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Concord Pro allows each player in the design process to share up-to-date component information.


News Nov 01, 2019 by Gary Elinoff
Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.


News Nov 01, 2019 by Lisa Boneta.
Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.


News Oct 31, 2019 by Gary Elinoff
Keithley SMU Modules Aim to Aid in Low-current, High-capacitance Testing

Keithley SMU Modules Aim to Aid in Low-current, High-capacitance Testing

Source measurement unit modules augment the effectiveness of Keithley's 4200A-SCS Parameter Analyzer.


News Oct 30, 2019 by Gary Elinoff
NXP and Volkswagen Roll Out Wi-Fi-Based V2X Automotive Connectivity Technology

NXP and Volkswagen Roll Out Wi-Fi-Based V2X Automotive Connectivity Technology

Going firmly against the grain, the new system will rely on Wi-Fi, and not 5G.


News Oct 29, 2019 by Gary Elinoff
New ARM IP Brings Down Costs of AI for Mainstream Products

New ARM IP Brings Down Costs of AI for Mainstream Products

Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.


News Oct 28, 2019 by Gary Elinoff
Diodes Incorporated Reveals 2A Load Switch Aimed to Improve High-Side Load Switch Reliability

Diodes Incorporated Reveals 2A Load Switch Aimed to Improve High-Side Load Switch Reliability

The AP22913 features slew-rate control and true reverse-current blocking for single-channel load switching.


News Oct 25, 2019 by Gary Elinoff
Microchip Claims to Have Solved Power Over Ethernet Interoperability Issues with New PoE Products

Microchip Claims to Have Solved Power Over Ethernet Interoperability Issues with New PoE Products

New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.


News Oct 24, 2019 by Gary Elinoff
Melexis Announces Pressure Sensing IC for Engine EVAP Systems

Melexis Announces Pressure Sensing IC for Engine EVAP Systems

The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.


News Oct 23, 2019 by Gary Elinoff
New Wi-Fi 6, 5G, mm Wave Antennas Unveiled by Antenna Company at MCW19

New Wi-Fi 6, 5G, mm Wave Antennas Unveiled by Antenna Company at MCW19

A new 64 antenna 5G DRA covers 24-30 GHz frequency bands, MIMO device is aimed at Wi-Fi 6 (802.11ax).


News Oct 23, 2019 by Gary Elinoff
US-based Mobile World Conference 2019 Kicks off in Los Angeles, Doubles Down on 5G, AI, and IoT

US-based Mobile World Conference 2019 Kicks off in Los Angeles, Doubles Down on 5G, AI, and IoT

MWC2019 Los Angeles begins today, giving us a chance to reflect on the past 10 months in connectivity.


News Oct 22, 2019 by Gary Elinoff
Reader Question: What Is the Most Difficult Specialty Within Electrical Engineering?

Reader Question: What Is the Most Difficult Specialty Within Electrical Engineering?

There are some disciplines that many call "black magic"—but which is the most difficult field an EE can pursue?


News Oct 21, 2019 by Kate Smith
X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.


News Oct 18, 2019 by Gary Elinoff