Latest IC Design News

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply…

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability…

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new…

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era…

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products…

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.

Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the…

Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the world, it now faces an unprecedented challenge.

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex…

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex AI challenges.

Emerging from stealth mode, HaiLa believes they can enable a future of IoT nodes without batteries.

Emerging from stealth mode, HaiLa believes they can enable a future of IoT nodes without batteries.

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last…

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.

Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those…

Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those funds looks like.

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.

Intel has unveiled a new backside power delivery technology called PowerVia, which decouples power and signal…

Intel has unveiled a new backside power delivery technology called PowerVia, which decouples power and signal interconnects on a wafer to increase performance and lower costs.

Tunnel Falls removes barriers to entry for quantum research by leveraging traditional transistor processes for high-yield…

Tunnel Falls removes barriers to entry for quantum research by leveraging traditional transistor processes for high-yield fabrication.

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink…

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink UCIe interconnect offers advantages over silicon interposer approaches.

Using plain English—not a hardware definition language—a group of researchers used generative AI to successfully…

Using plain English—not a hardware definition language—a group of researchers used generative AI to successfully design a microprocessor.

Leveraging novel photonic circuit designs, researchers hope to lower electricity consumption in data centers.

Leveraging novel photonic circuit designs, researchers hope to lower electricity consumption in data centers.

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize”…

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).