At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.
At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.
Qorvo's 4 mΩ SiC JFET for solid-state circuit breakers provides significant advantages over traditional mechanical…
Qorvo's 4 mΩ SiC JFET for solid-state circuit breakers provides significant advantages over traditional mechanical breakers. Andy Wilson discussed the details with EEPower at PCIM 2024.
While the MCU can run at speeds of up to 72 MHz, its processing architecture and ReRAM technology keep power consumption low.
While the MCU can run at speeds of up to 72 MHz, its processing architecture and ReRAM technology keep power consumption low.
Using USB-C for power and data, the PicoScope 3000E series brings new meaning to portable, high-performance test equipment.
Using USB-C for power and data, the PicoScope 3000E series brings new meaning to portable, high-performance test equipment.
The new system supports applications ranging from power converter switching to motor drive analysis.
The new system supports applications ranging from power converter switching to motor drive analysis.
Infineon, Qorvo, and EPC, among many others, are showing off the latest and greatest in FET technology at PCIM Europe.
Infineon, Qorvo, and EPC, among many others, are showing off the latest and greatest in FET technology at PCIM Europe.
The new inertial measurement unit integrates edge processing and analog sensing into a single package.
The new inertial measurement unit integrates edge processing and analog sensing into a single package.
In this roundup, we spotlight new processors from Analog Devices, Texas Instruments, and WCH that meet embedded computing…
In this roundup, we spotlight new processors from Analog Devices, Texas Instruments, and WCH that meet embedded computing requirements across industries.
Littelfuse, Allegro Microsystems, and Power Integrations have released new gate drivers to improve interoperability with…
Littelfuse, Allegro Microsystems, and Power Integrations have released new gate drivers to improve interoperability with complex industrial designs.
Lumotive and Hokuyo Automatic have teamed up to bring the world’s first true beam-steering sensor to 3D LiDAR.
Lumotive and Hokuyo Automatic have teamed up to bring the world’s first true beam-steering sensor to 3D LiDAR.
In applications where space comes at a premium, Rohde & Schwarz’s newest oscilloscope brings industry-standard…
In applications where space comes at a premium, Rohde & Schwarz’s newest oscilloscope brings industry-standard performance in a server rack mount.
Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S.…
Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S. semiconductor supply chain.
With TSMC scaling down to 2 nm and lower, the semiconductor giant is working with Cadence, Siemens, and Synopsys to bring…
With TSMC scaling down to 2 nm and lower, the semiconductor giant is working with Cadence, Siemens, and Synopsys to bring updated EDA tools to IC designers.
In this roundup, we spotlight new inductors designed to reduce sources of inefficiency in modern power supplies.
In this roundup, we spotlight new inductors designed to reduce sources of inefficiency in modern power supplies.
The new Arm 32/64-bit industrial microprocessors hit on computing performance, expansive connectivity, and tight security.
The new Arm 32/64-bit industrial microprocessors hit on computing performance, expansive connectivity, and tight security.
Intel and ASML collaborated on the high NA EUV lithography tools to pioneer the next generation of chips.
Intel and ASML collaborated on the high NA EUV lithography tools to pioneer the next generation of chips.
Enjoy this taste of the rich collection of technology news from last week’s Embedded World trade show in Nuremberg, Germany.
Enjoy this taste of the rich collection of technology news from last week’s Embedded World trade show in Nuremberg, Germany.
Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg…
Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.
Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show…
Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show in Nuremberg, Germany.
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are…
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are racing to keep pace.
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