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Special Feature: Connectors Eye High Density and Performance

Special Feature: Connectors Eye High Density and Performance

To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are racing to keep pace.


News Mar 31, 2024 by Jeff Child
A Q&A With Renowned Neuromorphic Chip Designer Chiara Bartolozzi

A Q&A With Renowned Neuromorphic Chip Designer Chiara Bartolozzi

For our final feature celebrating Women’s History Month, we interviewed Chiara Bartolozzi, a senior researcher moving the needle in neuromorphic engineering.


News Mar 29, 2024 by Ingrid Fadelli
ST’s Packs MPU-Level Performance in New 600 MHz Bootflash MCUs

ST’s Packs MPU-Level Performance in New 600 MHz Bootflash MCUs

Two new 32-bit Arm Cortex-M7 microcontrollers combine bigger system capabilities with the convenience of a microcontroller.


News Mar 15, 2024 by Duane Benson
Intel Spins Off Altera as Independent FPGA Supplier

Intel Spins Off Altera as Independent FPGA Supplier

Eight and a half years after acquiring Altera, Intel has spun off the FPGA division as an independent subsidiary.


News Mar 08, 2024 by Duane Benson
Infineon Leverages Coreless Transformer Design in Solid-State Isolators

Infineon Leverages Coreless Transformer Design in Solid-State Isolators

The new family uses coreless transformer technology to ramp up switching speeds while lowering power dissipation by up to 70%.


News Mar 04, 2024 by Jake Hertz
Microchip’s Portfolio of Integrated Motor Drivers Grows With New Family

Microchip’s Portfolio of Integrated Motor Drivers Grows With New Family

The new systems introduce high levels of integration to reduce complexity and BOM count for motor circuitry.


News Feb 29, 2024 by Jake Hertz
STMicro, ADI, and Rohm Release New Op Amps for Industrial Applications

STMicro, ADI, and Rohm Release New Op Amps for Industrial Applications

Three new op amps bring low offset, low drift, and wide gain bandwidth for industrial designers.


News Feb 27, 2024 by Aaron Carman
Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

The five new parts are 1,200-V, full-bridge quad MOSFETs with current ratings from 27–102 A and RDS(on) values ranging from 20 to 80 mΩ.


News Feb 22, 2024 by Duane Benson
TI Launches Compact Power Devices Ahead of APEC 2024

TI Launches Compact Power Devices Ahead of APEC 2024

The company will demonstrate the new GaN power stages and DC-DC modules at APEC this year.


News Feb 20, 2024 by Aaron Carman
Nuvoton’s New Microprocessors Target Industrial HMI Applications

Nuvoton’s New Microprocessors Target Industrial HMI Applications

The MPU is built on 64/32-bit Arm Cortex-A35 cores, packing a computing punch in modern user interfaces.


News Feb 14, 2024 by Aaron Carman
New DC-DC Converters Pack Big Performance in Small Packages

New DC-DC Converters Pack Big Performance in Small Packages

In this roundup, we highlight three new DC-DC converters that emerged in the last few months, each driven by package and performance improvements.


News Feb 12, 2024 by Darshil Patel
Distance Measurement Solution Taps Bluetooth LE Channel Sounding

Distance Measurement Solution Taps Bluetooth LE Channel Sounding

In this news analysis piece, Nthatisi examines Silicon Labs’ High Accuracy Distance Measurement (HADM) solution, which leverages Bluetooth LE's Channel Sounding feature, designed for complex RF environments.


News Feb 09, 2024 by Nthatisi Hlapisi
New U-blox Modules Support Simultaneous Positioning and Communications

New U-blox Modules Support Simultaneous Positioning and Communications

Designers can leverage the newest U-blox modules to simplify cellular and IoT design.


News Feb 08, 2024 by Aaron Carman
AMD Launches Embedded+ Architecture Blending Ryzen and Versal

AMD Launches Embedded+ Architecture Blending Ryzen and Versal

Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.


News Feb 06, 2024 by Jake Hertz
Microchip Prioritizes Customizable Logic in New 8-bit MCUs

Microchip Prioritizes Customizable Logic in New 8-bit MCUs

Outfitted with a configurable logic block module, the new MCUs integrate customizable logic to reduce BOM and improve performance.


News Jan 29, 2024 by Jake Hertz
Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain

Siemens Devises Secure Way to Share IC Thermal Models to E-Supply Chain

IC designers can now securely share thermal models across the supply chain—without compromising critical details about chip architecture.


News Jan 25, 2024 by Jake Hertz
Infineon Rolls Out Magnetic Position Sensor Using TMR Technology

Infineon Rolls Out Magnetic Position Sensor Using TMR Technology

By measuring position with magnetics, the new position sensor frees up system real estate for designers.


News Jan 19, 2024 by Aaron Carman
Three New Gate Drivers Tailored for Wide-Bandgap Applications

Three New Gate Drivers Tailored for Wide-Bandgap Applications

New gate driver circuits address the challenges of wide-bandgap (WBG) semiconductors to help these high-power devices harness their potential.


News Jan 04, 2024 by Darshil Patel
Quantum Technology Takes on the Task of Electrical Die Sorting

Quantum Technology Takes on the Task of Electrical Die Sorting

Rohm has teamed up with Quanmatics to deploy quantum technology in a large-scale semiconductor manufacturing facility for the first time.


News Dec 20, 2023 by Jake Hertz