Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
July 15, 2021 by Adrian Gibbons
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
July 14, 2021 by Adrian Gibbons
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.
March 02, 2021 by Antonio Anzaldua Jr.
Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.
March 02, 2021 by Jake Hertz