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New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.

July 15, 2021 by Adrian Gibbons

Higher Memory, Compute, and Security: Xilinx’s Versal HBM Platform Speeds Past DDR5

Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.

July 14, 2021 by Adrian Gibbons

TI’s Sitara AM2x Platform Blurs the Lines Between MCU and MPU

Recently, All About Circuits had the chance to talk with Texas Instruments about its newest MCU development, the Sitara AM2x.

July 12, 2021 by Jake Hertz

From Safety to Design Simplification: IoT Design Takes Another Leap Forward

Recently IoT has been at the forefront of everyone's mind, especially for Renesas, Silicon Labs, and Nordic Semiconductor. What IoT innovations have they come up with lately?

July 09, 2021 by Jake Hertz

Qualcomm’s 5G Open RAN Platform Elevates 5G Small Cell Technology

Small cell technology is becoming increasingly important as 5G continues its rollout, but why is that and what role is Qualcomm taking?

July 08, 2021 by Jake Hertz

The Story of Bluetooth: The Slow Road to Becoming an Industry Standard

Bluetooth seems like a commonplace technology in 2021; however, this wasn't always the case. What did the slow adoption of this industry-standard technology look like?

July 03, 2021 by Lianne Frith

A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

Single-digit node process is nothing new, but existing technology hampers RF performance due to parasitics. Samsung Foundry and TSMC seek to bring single-digit node performance to RF chips.

June 17, 2021 by Adrian Gibbons

Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Today, Mipsology is announcing its solution for FPGA programming: Zebra FPGA IP. This IP aims to ease FPGA programming, giving the designer more time to design.

June 09, 2021 by Sam Holland

“Smart” Power Lines? ST’s SoC and RF Chipset Get Industry-first Certification

The G3-PLC hybrid standard ensures interoperability and is key to STMicroelectronics delivering competitive market solutions for power line communications.

June 03, 2021 by Adrian Gibbons

NXP is Revving Up ADAS Technology with 16 nm FinFET Processors

Recently, AAC had the chance to sit down with Matthias Feulner and Brian Carlson from NXP to hear about two new automotive processors on 16nm technology.

June 02, 2021 by Jake Hertz

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.

May 21, 2021 by Jake Hertz

AMD Says Its “Highest-performing Server Processor” Is Here

Designed to level up with burgeoning data center demands, AMD claims its new EPYC 7003 Series CPUs outperform competitors in terms of speed and security.

March 16, 2021 by Jake Hertz

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

Emerging DDR5 Technology Shows Promise in Securing Automotive Memory

While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.

March 02, 2021 by Antonio Anzaldua Jr.

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.

March 02, 2021 by Jake Hertz

New Automotive SoCs Provide a Window to ADAS Trends

Taking a survey of new automotive-facing chips can tip us off to the design trends ADAS may take in the future.

February 16, 2021 by Jake Hertz

As mmWave Tech Matures, T&M Equipment and Techniques are Shifting, Too

While millimeter wave technology is by no means new, test and measurement suppliers are releasing innovative tips and equipment to help test engineers address higher-frequency challenges.

January 29, 2021 by Antonio Anzaldua Jr.

Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.

January 27, 2021 by Jake Hertz

The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The CES 2021 stage has debuted the hardware of some of the first Wi-Fi 6E devices. What are the benefits and challenges of this new connectivity protocol?

January 15, 2021 by Tyler Charboneau

More Cells, More Range: TI’s Wireless Battery Management System Frees EV Space for More Design Innovation

We spoke with Texas Instruments to learn more about this new tech, which they feel can shake up the EV industry.

January 07, 2021 by Jake Hertz