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How Did the 5G C-Band Threaten to Ground Thousands of Flights?

How Did the 5G C-Band Threaten to Ground Thousands of Flights?

AT&T and Verizon agreed to delay a mass 5G launch near airports. But major airlines are still concerned about how the 5G C-band may affect their aircraft altimeters.


News Jan 19, 2022 by Jake Hertz
Team Up Blasts LoRaWAN Into Space for Satellite IoT Connectivity

Team Up Blasts LoRaWAN Into Space for Satellite IoT Connectivity

The LoRa (long-range) wireless protocol is picking up steam as Semtech and Lacuna team up to push the Internet of Things (IoT) communication into areas previously inaccessible.


News Jan 17, 2022 by Jake Hertz
The New Wi-Fi 6 Release Has Big Implications for IoT Performance and Power

The New Wi-Fi 6 Release Has Big Implications for IoT Performance and Power

Of its many new features, the protocol's update includes support for uplink.


News Jan 05, 2022 by Jake Hertz
Low on Power, High on Integration: MKSemi Launches New UWB SoC

Low on Power, High on Integration: MKSemi Launches New UWB SoC

Ultra-wideband technology has sharply spiked in popularity since 2019. Now, MKSemi says its new UWB SoC is the smallest and most low power in the industry.


News Jan 05, 2022 by Jake Hertz
Following Dialog Acquisition, Renesas Goes After Celeno for Wi-Fi 6/6E Boost

Following Dialog Acquisition, Renesas Goes After Celeno for Wi-Fi 6/6E Boost

With its broad portfolio of Wi-Fi 6/6E chips and Doppler imaging technology, Israel-based Celeno seemed a clear choice for Renesas' next move in the wireless communication space.


News Dec 30, 2021 by Dr. Steve Arar
Companies Give Final Push to End 2021 With a Slew of GaN Devices

Companies Give Final Push to End 2021 With a Slew of GaN Devices

As 2021 comes to a close, STMicroelectronics, GaN Systems, and EPC push through final gallium nitride (GaN) based products. Could 2022 usher in even more GaN innovations?


A GaN Roundup: RF MMICs, Power ICs, and SOIC Drivers Keep the Ball Rolling

A GaN Roundup: RF MMICs, Power ICs, and SOIC Drivers Keep the Ball Rolling

The use of gallium nitride (GaN) picks up speed as this year draws to a close with new releases from Microchip, Navitas, and Teledyne e2v. Let's see how these new products are leveraging GaN technology.


News Dec 22, 2021 by Kristijan Nelkovski
From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

With 2022's Consumer Electronics Show (CES) coming up soon, we’ll take a look at some notable technologies to be highlighted at next year's Innovation Awards.


News Dec 20, 2021 by Jake Hertz
Hardware-as-a-Service Takes on New Utility in an Era of Remote PCB Design

Hardware-as-a-Service Takes on New Utility in an Era of Remote PCB Design

As the world embraces remote and hybrid work, design for hardware finds itself at a crossroads.


News Dec 14, 2021 by Jake Hertz
5G Backhaul May Move Data From Base Stations to a Core Network

5G Backhaul May Move Data From Base Stations to a Core Network

The future of 5G NR means moving into mmWave frequencies. What opportunities and challenges await operators in designing backhaul network services?


News Dec 13, 2021 by Adrian Gibbons
With 3G’s Departure, We May See a Tidal Wave of Obsolete Hardware

With 3G’s Departure, We May See a Tidal Wave of Obsolete Hardware

The sunset of 3G is scheduled for the end of next year. What does this mean for the millions of devices that rely on this wireless technology?


News Dec 13, 2021 by Tyler Charboneau
An “Industry First” 5G NR Small Cell SoC Spurs Open RAN Technology Forward

An “Industry First” 5G NR Small Cell SoC Spurs Open RAN Technology Forward

Radio Access Networks (RAN) technology was limited and expensive; however, Open RAN (O-RAN) is hoping to create easier and more compatible 5G technology. Pushing 5G Open RAN forward is Picocom's 5G New Radio (NR) SoC.


News Dec 06, 2021 by Jake Hertz
Infineon Tackles High-frequency Switching Losses With Latest OptiMOS 6 MOSFETS

Infineon Tackles High-frequency Switching Losses With Latest OptiMOS 6 MOSFETS

With increased performance of drain-source on-state resistance, gate charge, and figures of merit, Infineon's latest 100 V MOSFET technology seeks to improve high-frequency switching applications.


News Nov 21, 2021 by Ikimi .O
The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

The Next Gen of Memory: Micron and MediaTek Team Up to Validate LPDDR5X

Hoping to unlock AI and 5G smartphone innovations, Micron and MediaTek, leveraging 1α node technology, have validated the next generation of memory: the LPDDR5X.


News Nov 19, 2021 by Jake Hertz
Qorvo Acquires UnitedSiC, Snapping Up More of the Wide Bandgap Market

Qorvo Acquires UnitedSiC, Snapping Up More of the Wide Bandgap Market

In a bid to expand into new power markets, RF giant Qorvo has acquired UnitedSiC, a pioneer in SiC FET technology.


News Nov 10, 2021 by Adrian Gibbons
Wi-Fi CERTIFIED HaLow Makes Its Debut—and Graduates Its First Reference Design

Wi-Fi CERTIFIED HaLow Makes Its Debut—and Graduates Its First Reference Design

Wi-Fi HaLow is described as having the best combination of range, throughput, density, low-power operation, and deployment costs. Now, the certification program will bring this latest IEEE standard to market.


News Nov 05, 2021 by Jake Hertz
5G From Space: Verizon and Amazon Team Up to Build Antennas for LEO Satellites

5G From Space: Verizon and Amazon Team Up to Build Antennas for LEO Satellites

Amazon's Project Kuiper, a counterpart to SpaceX's Starlink, aims to bring connectivity to rural areas via a constellation of Ka-band satellites. Now, Verizon wants in on the action.


Qualcomm Targets Industry Shortcomings and 5G Adoption with New Processors

Qualcomm Targets Industry Shortcomings and 5G Adoption with New Processors

These new processors aim to bring 5G and performance to mid-tier smartphones.


News Oct 29, 2021 by Jake Hertz
National Science Foundation Bankrolls EE Innovation at the University Level

National Science Foundation Bankrolls EE Innovation at the University Level

With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.


News Oct 25, 2021 by Lianne Frith
DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

Disrupting the Ga-polar GaN technology tradition with N-polar GaN devices, Transphorm is evaluating the cost vs. performance of sapphire substrates with a new DARPA contract.


News Oct 15, 2021 by Adrian Gibbons