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Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco designed the Universal Quantum Switch to connect quantum systems using different encoding methods, marking a major step toward scalable quantum networking over existing telecom infrastructure.


News May 14, 2026 by Joshua Tidwell
Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact high-current interconnects, and environmentally sealed USB Type-C connectivity.


News May 13, 2026 by Joshua Tidwell
RECOM Power REFIN2U/CL Series Flat Panel 1AC Power Supply | New Product Brief

RECOM Power REFIN2U/CL Series Flat Panel 1AC Power Supply | New Product Brief

RECOM Power REFIN2U/CL Series Flat Panel 1AC Power Supply is an ultra-slim, high-efficiency solution designed for space-constrained industrial and automation systems. Watch and learn all about their features, specs, applications, and more!


Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.


News May 12, 2026 by Luke James
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


STMicroelectronics STSPIN9P1 75V Advanced Motor Drivers | New Product Brief

STMicroelectronics STSPIN9P1 75V Advanced Motor Drivers | New Product Brief

STMicroelectronics STSPIN9P1 75V Advanced Motor Drivers provide a flexible, highly integrated solution for efficient control of brushed DC, stepper, and brushless DC motors. Watch and learn all about their features, specs, applications, and more!


SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also examine the Class D stage's power supply requirements.


Optical Brain Research Pushes Smaller Implants, Sharper Imaging

Optical Brain Research Pushes Smaller Implants, Sharper Imaging

Cornell, MIT, and HKUST teams have reported laser- and photonics-based devices that record neurons, image deeper, and tame crosstalk in all-optical neuroscience.


News May 08, 2026 by Luke James
Nordic Semiconductor nRF9151 SMA Development Kit | Digital Datasheet

Nordic Semiconductor nRF9151 SMA Development Kit | Digital Datasheet

Nordic Semiconductor nRF9151 SMA Development Kit is a flexible, feature-rich platform designed for advanced cellular and satellite IoT development. Watch and learn all about their features, specs, applications, and more!


The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

Developed in the mid-1970s, National Semi’s LM386 collapsed a complete audio output stage into a single DIP-8 package running off a 9-V battery—and it became the first amplifier most hobbyists ever built.


News May 08, 2026 by Luke James
STMicro Unwraps Low-Power Image Sensors for Always-On Designs

STMicro Unwraps Low-Power Image Sensors for Always-On Designs

New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.


News May 07, 2026 by Jake Hertz
5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V microcontrollers vs. 5 V Tolerant microcontrollers: That single word is a massive differentiator. Learn the crucial difference between supply voltage and I/O tolerance for predictable 5 V logic design.


Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.


News May 06, 2026 by Austin Futrell
Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.


News May 06, 2026 by Duane Benson
Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Google Cloud split the TPU line into training and inference variants, with Arm Neoverse-based Axion CPUs as the host across the stack. Arm also rolled out Performix, a free performance toolkit aimed at the silicon's growing developer base.


News May 05, 2026 by Luke James