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ADVANTECH ECU 150 High Performance Quad Core IoT Gateway | New Product Brief

ADVANTECH ECU 150 High Performance Quad Core IoT Gateway | New Product Brief

Advantech ECU-150 High Performance Quad Core IoT Gateway, powered by an NXP i.MX8M Quad Core Cortex A53 1.3G CPU, is designed for versatile IoT applications. Watch and learn all about their features, specs, applications, and more!


New Proposals Vie for CHIPS Act Funds for Fabs and Digital Twin R&D

New Proposals Vie for CHIPS Act Funds for Fabs and Digital Twin R&D

Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S. semiconductor supply chain.


News May 15, 2024 by Aaron Carman
Density Demands Push Memory Solutions to New Heights

Density Demands Push Memory Solutions to New Heights

From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize density and speed.


News Apr 29, 2024 by Aaron Carman
Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Today's processors support large-language models scaling to over a trillion parameters. Rambus is keeping up with this computational load with a new memory solution.


News Apr 24, 2024 by Aaron Carman
Three Software Companies Show Off Support Tools at Embedded World

Three Software Companies Show Off Support Tools at Embedded World

Embedded World was rife with major hardware releases. Here are a few unique software packages designed to simplify the development experience.


News Apr 23, 2024 by Aaron Carman
Cooperation and Competition Behind the Scenes in the RISC-V Community

Cooperation and Competition Behind the Scenes in the RISC-V Community

RISC-V “is changing the way people build every single computer,” says Mark Himelstein, the former CTO at RISC-V International. He joins us to explain the significance of the RISC-V ISA, open standard development challenges, and read poetry.


SiTime Trumpets New Integrated Clock Chip as a First for AI Data Centers

SiTime Trumpets New Integrated Clock Chip as a First for AI Data Centers

The new SiTime data center clock chip delivers 10x higher performance than quartz crystal-based devices in half the space.


News Apr 22, 2024 by Duane Benson
Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.


News Apr 02, 2024 by Jake Hertz
Understanding How CXL 3.0 Links the Data Center Fabric

Understanding How CXL 3.0 Links the Data Center Fabric

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.


Intel Spins Off Altera as Independent FPGA Supplier

Intel Spins Off Altera as Independent FPGA Supplier

Eight and a half years after acquiring Altera, Intel has spun off the FPGA division as an independent subsidiary.


News Mar 08, 2024 by Duane Benson
Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Ahead of the IEEE 1.6 TbE standard, Synopsys has developed a complete 1.6 T solution that includes multi-rate, multi-channel 1.6 T Ethernet MAC and PCS controllers, 224-G Ethernet PHY IP, and verification IP.


News Mar 05, 2024 by Jake Hertz
ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.


News Feb 27, 2024 by Duane Benson
ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.


News Feb 23, 2024 by Aaron Carman
SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

The five new parts are 1,200-V, full-bridge quad MOSFETs with current ratings from 27–102 A and RDS(on) values ranging from 20 to 80 mΩ.


News Feb 22, 2024 by Duane Benson
Amphenol OCP ORv3 AC Input Connectors & Cable Assemblies | New Product Brief

Amphenol OCP ORv3 AC Input Connectors & Cable Assemblies | New Product Brief

Amphenol FCI introduces the OCP ORv3 AC Input Connectors and Cable Assemblies, crafted to adhere to Open Compute Project's V3 universal power distribution standards. Watch and learn all about their features, specs, applications, and more!


Jay W. Forrester and the Invention of Magnetic Core Memory

Jay W. Forrester and the Invention of Magnetic Core Memory

During his long and remarkably productive career, Jay Forrester accumulated an impressive list of innovations and achievements in electrical engineering, social science, and business management.


News Feb 09, 2024 by Robert Keim
Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

In this news analysis piece, Nthatisi discusses crafting sensors equipped with Wi-Fi 6, Matter, and Machine Learning using Silicon Labs' SiWx917 IoT device.


News Jan 27, 2024 by Nthatisi Hlapisi
Synopsys Acquires Ansys for $35 Billion, Bolstering Its Simulation Prowess

Synopsys Acquires Ansys for $35 Billion, Bolstering Its Simulation Prowess

Synopsys is set to acquire simulation software firm Ansys to further advance its systems design offerings


News Jan 24, 2024 by Ingrid Fadelli
Renesas Snaps Up GaN Specialist Transphorm for $339 Million

Renesas Snaps Up GaN Specialist Transphorm for $339 Million

The acquisition marks a larger trend of consolidation in the GaN industry.


News Jan 22, 2024 by Jake Hertz
Three Companies Collab on Near-Zero-Degree Cryogenic CMOS Circuits

Three Companies Collab on Near-Zero-Degree Cryogenic CMOS Circuits

In order to tackle quantum problems, Siemens, SemiWise, and SureCore are making CMOS circuits much cooler.


News Jan 12, 2024 by Aaron Carman