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TE Connectivity AMPSEAL Robust Headers | Featured Product Spotlight

TE Connectivity AMPSEAL Robust Headers | Featured Product Spotlight

TE Connectivity AMPSEAL Robust Headers provide secure, high-reliability PCB connectivity designed for demanding industrial, commercial, and transportation applications. Watch and learn all about their features, specs, applications, and more!


Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.


News Mar 12, 2026 by Jake Hertz
Build Your Own Clock With Analog Dials, Part 3

Build Your Own Clock With Analog Dials, Part 3

To complete this project, we add backlight control and temperature-sensing functionality to the clock we built in the previous installments.


Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
Build Your Own Clock With Analog Dials, Part 2

Build Your Own Clock With Analog Dials, Part 2

We continue our design of a clock that uses analog ammeters to display time and temperature. In this installment, we examine the second of the two circuits that enable the timekeeping function.


Build Your Own Clock With Analog Dials, Part 1

Build Your Own Clock With Analog Dials, Part 1

This project turns old-school analog ammeters into a working clock that can also display the ambient temperature.


Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Learn how scaling beyond Dennard's limits triggered short-channel effects (SCE) and why transitioning from FinFET to Gate-All-Around (GAA) architectures is vital for 2 nm control.


National Semiconductor’s LM317 and the Rise of Adjustable Linear Power

National Semiconductor’s LM317 and the Rise of Adjustable Linear Power

Introduced in the mid-1970s, National Semiconductor’s LM317 condensed linear regulation into a three-terminal building block and turned voltage selection into a resistor choice.


News Feb 13, 2026 by Luke James
Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to withstand up to 100,000 mating cycles. Watch and learn all about their features, specs, applications, and more!


STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

The new USB Power Delivery sink controller combines hardwired USB-PD operation with a patented hybrid mode to simplify full-feature USB-C sink designs with minimal firmware.


News Feb 10, 2026 by Austin Futrell
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
Infineon Balances Power and Performance in USB 2.0 Peripheral Controller

Infineon Balances Power and Performance in USB 2.0 Peripheral Controller

Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip SRAM for high-throughput devices.


News Jan 28, 2026 by Joshua Tidwell
CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.


News Jan 21, 2026 by Luke James
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
TDK Merges Sensing and Intelligence at the Edge Like Never Before

TDK Merges Sensing and Intelligence at the Edge Like Never Before

All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.


News Jan 19, 2026 by Jake Hertz
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.


News Jan 12, 2026 by Luke James
High-Performance Automotive Camera Connectivity | Tech Guide

High-Performance Automotive Camera Connectivity | Tech Guide

Explore high-performance automotive camera connectivity with TE Connectivity’s FAKRA and MATE-AX connectors. Watch now to get started!


Digid Qualifies Its Tiny Temperature and Force Sensors for Mass Deployment

Digid Qualifies Its Tiny Temperature and Force Sensors for Mass Deployment

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.


News Jan 06, 2026 by Jake Hertz